Ekubeni i-COB ayinaso isakhelo esikhokelayo sephakheji ye-IC, kodwa ithatyathelwe indawo yi-PCB, uyilo lwe-PCB pads lubaluleke kakhulu, kwaye Gqiba unokusebenzisa kuphela igolide ye-electroplated okanye i-ENIG, kungenjalo ucingo lwegolide okanye ucingo lwe-aluminium, okanye iingcingo zobhedu zamva nje. uya kuba neengxaki ezingenako ukubethelwa. Uyilo lwePCB Iimfuno zeCOB 1. Ukulungiswa komphezulu ogqityiweyo webhodi ye-PCB kufuneka ibe yigolide ye-electroplating okanye i-ENIG, kwaye ingqindilili kancinci kunomaleko wegolide webhodi ye-PCB ngokubanzi, ukuze unikeze amandla afunekayo kwi-Die Bonding kwaye wenze i-aluminiyam yegolide. okanye igolide negolide iyonke. 2. Kwindawo yokubeka i-wiring yesekethe ye-pad ngaphandle kwe-Die Pad ye-COB, zama ukuqwalasela ukuba ubude bocingo lwe-welding nganye bunobude obusisigxina, oko kukuthi, umgama we-solder joint ukusuka kwi-wafer ukuya kwi-PCB. iphedi kufuneka ingqinelane kangangoko kunokwenzeka.Isikhundla socingo ngalunye lokudibanisa lunokulawulwa ukunciphisa ingxaki yesiphaluka esifutshane xa iingcingo zokudibanisa zidibanisa.Ngoko ke, i-pad design kunye nemigca ye-diagonal ayihambelani neemfuno.Kucetyiswa ukuba isithuba sepadi se-PCB sinokufinyezwa ukuphelisa ukubonakala kweepadi zediagonal.Kwakhona kunokwenzeka ukuyila izikhundla ze-elliptical pad ukusabalalisa ngokulinganayo iindawo ezihambelanayo phakathi kweengcingo zebhondi. 3. Kucetyiswa ukuba i-wafer ye-COB kufuneka ibe neendawo ezimbini zokubeka ubuncinane.Kungcono ukuba ungasebenzisi iindawo zokubeka ezijikelezayo ze-SMT yemveli, kodwa usebenzise iindawo zokumisa ezimilise okwemilo enqamlezayo, kuba umatshini we-Wire Bonding (i-wire bonding) uyazenzela Xa ubeka, ukubekwa ngokwesiseko kwenziwa ngokubamba umgca othe tye. .Ndicinga ukuba oku kungenxa yokuba akukho ndawo yokumisa setyhula kwisakhelo esikhokelayo semveli, kodwa isakhelo sangaphandle esithe ngqo kuphela.Mhlawumbi abanye oomatshini be-Wire Bonding abafani.Kucetyiswa ukuba uqale ubhekisele ekusebenzeni komatshini ukwenza uyilo.
I-4, ubungakanani bephedi yokufa ye-PCB kufuneka ibe nkulu kancinane kune-wafer yangempela, enokunciphisa i-offset xa ubeka i-wafer, kwaye iphinde ithintele i-wafer ekujikelezeni kakhulu kwi-fae pad.Kucetyiswa ukuba iipads ezisicaba kwicala ngalinye zibe nkulu ngo-0.25~0.3mm kuneyona wafer.
5. Kungcono ukuba ungabikho ngemingxuma kwindawo apho i-COB kufuneka izaliswe ngeglue.Ukuba ayinakuphetshwa, umzi-mveliso we-PCB uyafuneka ukuba uqhagamshelwe ngokupheleleyo ngemingxunya.Injongo kukuthintela imingxunya ekungeneni kwi-PCB ngexesha lokukhupha i-Epoxy.kwelinye icala, kubangela iingxaki ezingeyomfuneko. 6. Kucetyiswa ukuba uprinte i-logo yeSilkscreen kwindawo efuna ukuhanjiswa, enokuthi iququzelele ukusebenza kokukhutshwa kunye nokulawulwa kwemilo.
Ukuba kukho nawuphi na umbuzo okanye umbuzo, nceda uqhagamshelane nathi! Apha .
Yazi ngakumbi ngathi! Apha.
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