Yenziwa njani ibhodi yesekethe yomzi-mveliso wePCB?Izinto ezincinci zesekethe ezinokuthi zibonwe phezu komhlaba ziyi-foil yobhedu.Ekuqaleni, ifoyile yobhedu yayigutyungelwe kuyo yonke iPCB, kodwa inxalenye yayo yabhalwa ngexesha lenkqubo yokwenziwa, kwaye inxalenye eseleyo yaba yisekethe encinci efana nomnatha..

 

Ezi ntambo zibizwa ngokuba ziingcingo okanye iitrayisi kwaye zisetyenziselwa ukubonelela ngoqhagamshelo lombane kumacandelo akwi-PCB.Ngokuqhelekileyo umbala we ibhodi PCB iluhlaza okanye imdaka, umbala we-solder mask.Ngumaleko okhuselayo okhuselayo okhusela ucingo lobhedu kwaye unqande iindawo ukuba zingathengiswa kwiindawo ezingalunganga.



Iibhodi zeSekethe ezininzi ngoku zisetyenziswa kwiibhodi zemotherboard kunye namakhadi emizobo, nto leyo eyandisa kakhulu indawo enokuthi ibe neengcingo.Iibhodi ezininzi zisebenzisa ngaphezulu iibhodi zocingo olulodwa okanye ezimbini , kwaye ubeke umaleko we-insulating phakathi kwebhodi nganye uze uzicinezele kunye.Inani leeleya zebhodi yePCB lithetha ukuba kukho iileya ezininzi ezizimeleyo zocingo, ngokuqhelekileyo inani lemaleko lilinganayo, kwaye libandakanya amaleko amabini angaphandle.Iibhodi ze-PCB eziqhelekileyo ngokuqhelekileyo zi-4 ukuya kwi-8 umaleko wesakhiwo.Inani leeleya ezininzi zeebhodi zePCB zinokubonwa ngokujonga icandelo lebhodi yePCB.Kodwa eneneni, akukho mntu uneliso elinjalo.Ke, nantsi enye indlela yokukufundisa.

 

Uqhagamshelo lwesekethe yeebhodi ezinomaleko amaninzi lungcwatywa ngendlela kwaye luyimfama ngeteknoloji.Uninzi lweebhodi zoomama kunye namakhadi okubonisa zisebenzisa iibhodi zePCB ezine-4, kwaye ezinye zisebenzisa i-6-, 8-layer, okanye iibhodi zePCB ezinomaleko ezili-10.Ukuba ufuna ukubona ukuba zingaphi iileya kwi-PCB, unokuyichonga ngokujonga imingxunya yesikhokelo, kuba iibhodi ezine-4 ezisetyenziswa kwibhodi ephambili kunye nekhadi lokubonisa zizinto zokuqala nezesine zomaleko wocingo. ezinye iileya zisetyenziselwa ezinye iinjongo (ucingo lomhlaba).kunye namandla).

 

Ngoko ke, njengebhodi ephindwe kabini, umngxuma wesikhokelo uya kungena kwibhodi yePCB.Ukuba ezinye vias avele kwicala langaphambili PCB kodwa ayifumaneki kwicala umva, ngoko ke kufuneka ibe ibhodi 6/8-umaleko.Ukuba imingxunya isikhokelo efanayo inokufumaneka macala omabini ebhodi PCB, ngokwemvelo ibhodi-4 umaleko.



Inkqubo yokwenziwa kwePCB iqala ngePCB "substrate" eyenziwe ngeGlass Epoxy okanye efanayo.Isinyathelo sokuqala sokuvelisa kukuzoba i-wiring phakathi kwamacandelo.Indlela "yokushicilela" i-negative yesekethe yebhodi yesekethe eyiliweyo ye-PCB kwi-conductor yesinyithi ngokusebenzisa ukudluliselwa kwe-Subtractive.



Ubuqhetseba kukusabalalisa uluhlu oluncinci lwe-foil yethusi phezu kwendawo yonke kwaye ususe ukugqithisa.Ukuba imveliso inamacala amabini, ke macala omabini e-PCB substrate aya kugqunywa ngefoyile yobhedu.Ukwenza ibhodi ye-multi-layer, iibhodi ezimbini ezinamacala amabini zinokuthi "zicinezele" kunye ne-adhesive ekhethekileyo.

 

Okulandelayo, ukugrumba kunye ne-electroplating efunekayo ukudibanisa amacandelo kunokwenziwa kwibhodi yePCB.Emva kokugaya ngezixhobo zomatshini ngokweemfuno zokugaya, ngaphakathi kwodonga lomngxuma kufuneka lubekwe (iPlated-Through-Hole technology, PTH).Emva kokuba unyango lwesinyithi lwenziwa ngaphakathi kwodonga lomngxuma, iileyile zangaphakathi zeesekethe zinokudibaniswa komnye nomnye.

 

Ngaphambi kokuba uqalise i-electroplating, i-debris emngxunyeni kufuneka icocwe.Oku kungenxa yokuba i-resin epoxy iya kuqhuba utshintsho oluthile lweekhemikhali xa ishushu, kwaye iya kugubungela iileya zePCB zangaphakathi, ngoko kufuneka isuswe kuqala.Zombini izenzo zokucoca kunye ne-plating zenziwa kwinkqubo yeekhemikhali.Okulandelayo, kuyimfuneko ukugqoka i-solder yokuxhathisa ipeyinti (i-solder ukumelana ne-inki) kwi-wiring yangaphandle ukwenzela ukuba i-wiring ingachukumisi inxalenye edibeneyo.

 

Emva koko, amacandelo ahlukeneyo aprintwa isikrini kwibhodi yesiphaluka ukubonisa indawo yecandelo ngalinye.Ayinakugubungela nayiphi na i-wiring okanye iminwe yegolide, ngaphandle koko inokunciphisa i-solderability okanye ukuzinza koqhagamshelwano lwangoku.Ukongeza, ukuba kukho uxhulumaniso lwesinyithi, "iminwe yegolide" idla ngokugqithwa ngegolide ngeli xesha ukuqinisekisa uxhulumaniso lombane oluphezulu xa lufakwe kwi-slot yokwandisa.

 

Ekugqibeleni, kukho uvavanyo.Vavanya i-PCB yeebhulukhwe ezimfutshane okanye iisekethe ezivulekileyo, nokuba kukwi-optically okanye nge-elektroniki.Iindlela ze-Optical zisebenzisa ukuskena ukufumana iziphene kumaleko ngamnye, kwaye uvavanyo lwe-elektroniki luhlala lusebenzisa iFlying-Probe ukujonga lonke unxibelelwano.Uvavanyo lwe-elektroniki luchanekile ngakumbi ekufumaneni iibhulukhwe ezimfutshane okanye ezivulayo, kodwa uvavanyo lwe-optical lunokufumanisa ngokulula iingxaki ezinezithuba ezingalunganga phakathi kwabaqhubi.



Emva kokuba i-substrate yebhodi yesekethe igqityiwe, i-motherboard egqityiweyo ixhotyiswe ngamacandelo ahlukeneyo obungakanani obuhlukeneyo kwi-substrate ye-PCB ngokweemfuno - kuqala sebenzisa umatshini wokubeka we-SMT ngokuzenzekelayo "ukuthengisela i-IC chip kunye ne-patch components", kwaye ngoko ngesandla. qhagamshela.Xhuma umsebenzi othile ongenakukwenziwa ngumatshini, kwaye ulungise ngokuqinileyo ezi plug-in kwi-PCB ngokusebenzisa inkqubo yokuthengiswa kwamaza / ukubuyisela kwakhona, ukuze kuveliswe i-motherboard.