Ukuba uyazibuza ukuba yintoni kanye kanye Iibhodi zeSekethe eziprintiweyo (iiPCBs) zikho kwaye zenziwa njani, ngoko awuwedwa.Abantu abaninzi banokuqonda okungacacanga "kweeBhodi zeSekethe", kodwa eneneni abazizo iingcali xa kufikwa ekukwazini ukucacisa ukuba yintoni iBhodi yeSekethe eShicileleyo.IiPCB zidla ngokusetyenziselwa ukuxhasa kunye nokudibanisa ngombane izinto eziqhagamshelweyo ze-elektroniki ebhodini.Eminye imizekelo yamacandelo e-elektroniki kwiiPCB's zii-capacitors kunye nezixhasi.Ezi kunye nezinye iikhomponenti ezahlukeneyo ze-elektroniki ziqhagamshelwe ngeendlela zokuqhuba, iingoma okanye imikhondo yemiqondiso ekrolwe kumaphepha obhedu alaminethiweyo kwi-non conductive substrate.Xa ibhodi inezi ndlela eziqhubayo nezingaqhubiyo, iibhodi ngamanye amaxesha zibizwa ngokuba yiPrinted Wiring Board (PWB).Nje ukuba ibhodi ibe neentambo zocingo kunye nezixhobo ze-elektroniki eziqhagamshelwe, iBhodi yeSekethe eShicileleyo ngoku ibizwa ngokuba yiNdibano yeSekethe eprintiweyo (PCA) okanye INdibano yeBhodi yeSekethe eprintiweyo (PCBA).

Iibhodi zeSekethe eziprintiweyo amaxesha amaninzi azibizi kakhulu, kodwa zithembeke kakhulu.Iindleko zokuqala ziphezulu ngenxa yokuba iinzame zokuyila zifuna ixesha elininzi kunye nezibonelelo, kodwa ii-PCB ziseneendleko ezithintekayo kwaye zikhawuleza ukuvelisa ukuveliswa kwevolumu ephezulu.Uninzi loYilo lwePCB yolu shishino, ulawulo lomgangatho, kunye nemigangatho yendibano zisekwe ngumbutho oQhagamshelayo we-Electronics Industries (IPC).

Xa kuveliswa ii-PCBs, uninzi lweesekethe eziprintiweyo ziveliswa ngokubopha umaleko wobhedu phezu kwe-substrate, ngamanye amaxesha kumacala omabini, okwenza i-PCB engenanto.Emva koko, ubhedu olungafunwayo luyasuswa emva kokuba imaski yethutyana isetyenziswe ngokukrolwa.Oku kushiya kuphela imikhondo yobhedu ebinqweneleka ukuba ihlale kwiPCB.Ngokuxhomekeke ekubeni umthamo wemveliso ungoweSampuli / ubungakanani bePrototype okanye umthamo wokuvelisa, kukho inkqubo ye-electroplating eninzi, inkqubo eyinkimbinkimbi eyongeza umkhondo okanye ubhedu oluncinci lwe-substrate kwi-substrate engenanto.

Kukho iindlela ezahlukeneyo kwiindlela zokunciphisa (okanye ukususwa kobhedu olungafunekiyo ebhodini) ngexesha lokuveliswa kweePCB.Indlela yokuthengisa ephambili yomthamo womthamo wemveliso kukuprintwa kwesikrini sesilika kunye neendlela zokufota (Ezidla ngokusetyenziswa xa ububanzi bomgca bulungile).Xa umthamo wemveliso uyimiyinge emincinci, iindlela eziphambili zokusetyenziswa yilaser printed resist, iprinte kwifilim esobala, i-laser resist ablation, kunye nokusebenzisa i-CNC-mill.Ezona ndlela zixhaphakileyo kukuprintwa kwesikrini sesilika, ukukrolwa kwefoto, kunye nokusila.Nangona kunjalo, kukho inkqubo eqhelekileyo ekhoyo esetyenziswa ngokuqhelekileyo iibhodi zeesekethe ezininzi kuba iququzelela i-plating-through yemingxuma, ebizwa ngokuba yi "Addictive" okanye "Semi-Addictive".