I-Via hole ikwabizwa ngokuba yi-Via hole.Ukuze kuhlangatyezwane neemfuno zabathengi, i
ibhodi yesekethe ngomngxuma kufuneka iplagwe.Emva kokuziqhelanisa okuninzi, inkqubo yeplagi yealuminiyam yesiqhelo itshintshiwe, kwaye imaski yebhodi yesekethe yomphezulu we-solder kunye neplagi igqitywe ngemesh emhlophe.umngxuma.Imveliso ezinzileyo kunye nomgangatho othembekileyo.
Ngemingxuma idlala indima yokudibanisa kunye nokuqhuba imigca.Uphuhliso loshishino lombane lukwakhuthaza uphuhliso lweePCBs, kwaye lukwabeka phambili iimfuno eziphezulu zokwenziwa kwebhodi eprintiweyo yokwenziwa kwetekhnoloji kunye neteknoloji yokubeka umphezulu.Itekhnoloji yokuplaga yomngxuma ibekho, kwaye ezi mfuno zilandelayo kufuneka kuhlangatyezwane nazo ngaxeshanye:
(1) Kukho ubhedu kuphela emngxunyeni odlulayo, kwaye isigqubuthelo sobuso sinokuxhunywa okanye hayi;
(2) Kufuneka kubekho inkonkxa kunye nelothe emngxunyeni odlulayo, kunye nemfuno ethile yobukhulu (ii-microns ezi-4), kwaye akukho inki yokuxhathisa i-solder kufuneka ingene emngxunyeni, ebangela ukuba amaso e-tin afihlwe emngxunyeni;
(3) Imingxunya edlulayo kufuneka ibe nemingxunya ye-inki yokuxhathisa iplagi, i-opaque, kwaye mayingabi nezangqa zenkcenkce, amaso enkcenkce kunye neemfuno zokulinganisa.
Kutheni iibhodi zesekethe PCB kufuneka ibhlokile vias?
Ngophuhliso lweemveliso ze-elektroniki kwicala "lokukhanya, elibhityileyo, elifutshane kunye nelincinci", ii-PCBs nazo ziphuhlisa ukuxinana okuphezulu kunye nobunzima obukhulu.Ke ngoko, kuye kwavela inani elikhulu le-SMT kunye ne-BGA PCBs, kwaye abathengi bafuna imingxunya yeeplagi xa kunyuswa amacandelo, ngakumbi kubandakanya imisebenzi emihlanu:
(1) Thintela itoti ekungeneni kumphezulu wecandelo ngomngxuma odlulayo ukwenza isekethe emfutshane xa iPCB idlula kwisoldering yamaza;ingakumbi xa sibeka nge umngxuma kwi pad BGA, kufuneka siqale senze umngxuma iplagi, kwaye ke igolide-etyalwe lula BGA ukusoda.
(2) Ziphephe iintsalela eziphuma kumngxuma odlulayo;
(3) Emva kokuba indawo yokuxhoma umphezulu kunye nenxalenye yokudibanisa umzi-mveliso we-elektroniki igqityiwe, iPCB kufuneka icocwe kumatshini wokuvavanya ukwenza uxinzelelo olubi phambi kokuba igqitywe:
(4) Thintela umphezulu usolder intlama ukuba agelezele emngxunyeni kubangele welding virtual, echaphazela ukunyuselwa;
(5) Thintela amaso enkcenkce ukuba angaphumi ngexesha lokusongelwa kwamaza, okubangela ukujikeleza okufutshane.
Ukufezekiswa kweTekhnoloji yokuPlaga ye-Conductive Hole
Kwiibhodi zokunyuswa komphezulu, ngakumbi kwi-BGA kunye ne-IC yokunyuswa, imingxuma edlulayo mayibe sicaba, ibe neconvex kunye neconcave dibanisa okanye thabatha 1 mil, kwaye akufuneki kubekho inkonkxa ebomvu kwincam yomngxuma odlulayo;Amaso e-tin afihlwe kumngxuma odlulayo, ukuze kuphunyezwe ukwaneliseka kwabathengi. Iimfuno zenkqubo yokuplaga ngengxuma ingachazwa njengeyahlukeneyo, ukuhamba kwenkqubo inde kakhulu, kwaye inkqubo yolawulo inzima.Kuhlala kukho iingxaki ezifana nokulahleka kweoli ngexesha lokulinganisa umoya oshushu kunye novavanyo lokumelana ne-oyile eluhlaza;ukuqhuma kweoli emva kokunyanga.Ngoku ngokweemeko zokwenyani zemveliso, iinkqubo ezahlukeneyo zomngxuma weplagi wePCB zishwankathelwa, kwaye ezinye uthelekiso kunye neenkcazo zenziwa kwinkqubo, iingenelo kunye nokungalunganga:
Qaphela: Umgaqo osebenzayo womgangatho womoya oshushu kukusebenzisa umoya oshushu ukususa i-solder engaphezulu kumphezulu webhodi yesekethe eprintiweyo kunye nemingxuma, kwaye i-solder eseleyo igutyungelwe ngokulinganayo kwiipads, imigca ye-solder enganyangekiyo kunye nomphezulu. iindawo zokupakisha, eyona ndlela yonyango lomphezulu webhodi yesekethe eprintiweyo.Nye.
1. Iplagi yenkqubo yomngxuma emva komgangatho womoya oshushu
Inkqubo yokuhamba yile: imaski yomphezulu webhodi yesoda → HAL → umngxuma weplagi → ukunyanga.Inkqubo engeyiyo iplagi isetyenziselwa imveliso.Emva kokuba umoya oshushu ulinganisiwe, isikrini se-aluminiyam okanye isikrini sokuthintela i-inki sisetyenziselwa ukugqibezela ukuplaga ngomngxuma kuzo zonke iinqaba ezifunwa ngumthengi.I-inki yokuplaga ingaba yi-inki ye-photosensitive okanye i-inki ye-thermosetting.Kwimeko yokuqinisekisa umbala ofanayo wefilimu emanzi, i-inki yokufaka iplagi ingcono ukusebenzisa i-inki efanayo kunye nomgangatho webhodi.Le nkqubo inokuqinisekisa ukuba umngxuma odlulayo awuyiwisi ioyile emva kokuba umoya oshushu ulinganisiwe, kodwa kulula ukwenza ukuba i-inki yomngxuma weplagi ingcolise umphezulu webhodi kwaye ingalingani.Kulula kubathengi ukuba babangele i-soldering ebonakalayo (ingakumbi kwi-BGA) xa unyuka.Abathengi abaninzi abayamkeli le ndlela.
2. Iplagi yenkqubo yomngxuma phambi komgangatho womoya oshushu
2.1 Sebenzisa i-aluminiyam sheet ukuplaga imingxuma, ukunyanga, kunye nokusila ipleyiti ukwenzela ukuhanjiswa kwepateni
Kule nkqubo, umatshini wokomba we-CNC usetyenziselwa ukukhupha iphepha le-aluminiyam ekufuneka iplagwe, wenze ipleyiti yesikrini, kwaye uvale imingxuma ukuqinisekisa ukuba imingxuma igcwele, kwaye i-inki yokuplaga isetyenziselwa ukuplaga umngxuma. ., utshintsho lwe-resin shrinkage luncinci, kwaye amandla okudibanisa kunye nodonga lomngxuma lulungile.Inkqubo yokuhamba yile: unyango lwangaphambili → umngxuma weplagi → ipleyiti yokusila → ugqithiso lwepateni → ukudibanisa → isigqubuthelo somphezulu webhodi
Le ndlela inokuqinisekisa ukuba umngxuma weplagi ngomngxuma umngxuma uthe tyaba, kwaye umoya oshushu wokulinganisa awuyi kuba neengxaki zomgangatho ezifana nokuqhuma kweoli kunye nelahleko yeoli ekupheleni komngxuma, kodwa le nkqubo idinga ukutyeba kwexesha elinye lobhedu, ukuze ubukhulu bobhedu bodonga lomngxuma bunokuhlangabezana nomgangatho womthengi.Ngoko ke, iimfuno zokubeka ubhedu kwiplate yonke ziphezulu kakhulu, kwaye kukho iimfuno eziphezulu zokusebenza komatshini wokugaya ukuqinisekisa ukuba i-resin ebusweni bobhedu isuswe ngokupheleleyo, kwaye ubuso bobhedu bucocekile kwaye bukhululekile. ungcoliseko.Iifektri ezininzi ze-PCB azinayo inkqubo yobhedu yokutyebisa okwexesha elinye, kwaye ukusebenza kwezixhobo akuhlangabezani neemfuno, okubangela ukuba le nkqubo ingasetyenziswa kakhulu kwiifektri zePCB.
2.2 Emva kokuplaga imingxuma ngamashiti e-aluminiyam, jonga ngqo imaski ye-solder kumphezulu webhodi.
Kule nkqubo, umatshini wokugaya we-CNC usetyenziselwa ukukhupha iphepha le-aluminium elifuna ukuxhunywa ukwenza iplate yesikrini, efakwe kumatshini wokushicilela kwesikrini ukuze kufakwe iplagi.Emva kokuba iplagi igqityiwe, akufanele imiswe ngaphezu kwemizuzu engama-30.Inkqubo yokuhamba: Unyango lwangaphambili - umngxuma weplagi - isikrini sesilika - ukubhaka kwangaphambili - ukuvezwa - ukuphuhlisa - ukunyanga
Le nkqubo inokuqinisekisa ukuba i-via hole igutyungelwe kakuhle ngeoli, umngxuma weplagi usicaba, kwaye umbala wefilimu emanzi uyafana.IiPads, ezikhokelela ekuthengiseni kakubi;emva komgangatho womoya oshushu, umda we-bubbles kunye neoli iyasuswa.Kunzima ukulawula imveliso usebenzisa le ndlela yenkqubo, kwaye injineli yenkqubo kufuneka ithathe iinkqubo ezikhethekileyo kunye neeparitha zokuqinisekisa umgangatho weplagi yeplagi.
Kutheni iibhodi zesekethe PCB kufuneka ibhlokile vias?
2.3 Emva kokuba iphepha le-aluminium lifake imingxuma, iphuhlise, i-pre-cure, kwaye igaye ibhodi, ibhodi yebhodi iyathengiswa.
Sebenzisa umatshini wokomba we-CNC ukukhupha iphepha le-aluminiyam elifuna imingxunya yeplagi, wenze ipleyiti yesikrini, kwaye uyifake kumatshini wokushicilela wesikrini kwimingxuma yeplagi.Imingxunya yeeplagi kufuneka igcwale, kwaye omabini amacala akhethwa ukuba avele ngaphandle.Inkqubo yokuhamba yile: unyango lwangaphambili - umngxuma weplagi - ukubhaka kwangaphambili - uphuhliso - ukunyangwa kwangaphambili - imaski yomphezulu webhodi
Ngenxa yokuba le nkqubo ithatha i-plug-hole yokunyanga ukuze kuqinisekiswe ukuba umngxuma odlulayo awuzukuphulukana neoyile okanye uqhume ioyile emva kwe-HAL, kodwa emva kwe-HAL, kunzima ukuyisombulula ngokupheleleyo ingxaki ye-tin bead kumngxuma kunye ne-tin kumngxuma. abathengi abaninzi abayamkeli.
2.4 Imaski ye-solder kumphezulu webhodi kunye nomngxuma weplagi ugqitywe ngaxeshanye.
Le ndlela isebenzisa i-36T (43T) i-mesh yesikrini, efakwe kumatshini wokushicilela kwesikrini, usebenzisa i-backing plate okanye i-nail bed, kunye nokuplaga yonke imingxunya ngelixa ugqibezela umphezulu webhodi.Inkqubo yokuhamba yile: unyango lwangaphambili--ushicilelo lwesikrini--Pre-bake--Exposure--Development-Cure
Le nkqubo inexesha elifutshane kunye nesantya esiphezulu sokusetyenziswa kwesixhobo, esinokuqinisekisa ukuba imingxuma edlulayo ayizukulahlekelwa yioyile kwaye imingxuma edlulayo ayizukufakwa kwitoti emva kokumiswa komoya oshushu., Umoya uyanda kwaye uqhekeza imaski ye-solder, ebangela i-voids kunye nokungalingani.Kuya kubakho inani elincinci lemingxuma efihlwe kwitoti ngexesha lomgangatho womoya oshushu.Okwangoku, inkampani yethu iye yasombulula umngxuma kunye nokungalingani komngxuma emva kovavanyo oluninzi, ukukhetha iintlobo ezahlukeneyo zeinki kunye ne-viscosity, ukulungisa uxinzelelo loshicilelo lwesilika yesikrini, njl., kwaye le nkqubo yamkelwe kwimveliso yobuninzi. .
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