I-ABIS igxile kwiTurnkey epheleleyo kunye neenkonzo zeNdibano ezipheleleyo zePCB, siyakwazi nokulawula ii-odolo ngokuthengwa kwamaCandelo aThunyelwe ngokupheleleyo.Silandela ishedyuli yokuthenga ye-PCB ecwangciswe kakhulu kwaye ilungelelaniswe kakuhle, eyilelwe ukuba ilingane kakuhle kwiNkqubo yethu yeNdibano yePCB ukuqinisekisa ukusebenza kakuhle kweprojekthi yakho.Ngeli xesha, i-ABIS ifumana amacandelo ngokuthe ngqo namacandelo omvelisi wokuqala kunye nearhente esemthethweni.Ezinje ngeDigikey, Mouser, Future, Avnet njalo njalo.
I-ABIS ibonelela ngokwenziwa konikezelo lwekhonkco lonikezelo olunamandla kunye nocwangciso lwemeko ethi "yintoni-ukuba" ngexesha lokwenyani.Sikunceda uqhelane nemarike ngokukhawuleza nangempumelelo-ukudala amathuba amatsha kumbutho wakho.
Ukugcinwa kwamacandelo
(1) Emva kokuba amacandelo efikile kwindawo yokugcina impahla, umphathi wendawo yokugcina impahla uya kuthatha uluhlu lwempahla aze alubeke ukuba luhlolwe.Iimpahla ezininzi zinokubekwa ngokuthe ngqo kwindawo yokugcina iimpahla, kodwa kufuneka ziphawulwe njenge "zokuhlolwa".Emva koko i-QC iya kuqinisekisa kwaye ifake isicelo sokuhlolwa xa ifika.
Umxholo wokuqinisekisa uquka:
(1) Igama lemveliso, ukucaciswa kwemodeli, umenzi, umhla wokuvelisa okanye inombolo yebhetshi, ubomi beshelufu, ubuninzi, ubume bokupakisha kunye neziqinisekiso zokufaneleka, njl. Ukuba ayifanelekanga emva kokuqinisekiswa, umthengi uya kwaziswa ukuba athethe okanye aqhube ukubuyisela.
(2) Emva kokufumana ingxelo yokuhlola ephetha ngokuthi "ufanelekile", umgcini we-warehouse uya kudlula kwiinkqubo zokugcina impahla ngexesha, kwaye iimpahla ezikummandla wokuhlola zidluliselwa kwindawo efanelekileyo yendawo yokugcina impahla.Iimveliso eziza kuhlolwa ezibekwe kwindawo efanelekileyo yendawo yokugcina impahla ziya kususwa kuphawu oluthi "Pending Inspection";xa ingxelo yohlolo kunye nesiphelo sohlolo "unqualified" ifunyenwe, Yenza uphawu olungangqinelaniyo ngokwemigaqo kwaye ulinde imveliso engangqinelaniyo.
Ubuchule beNdibano yePCB
|
I-SMT/PTH enecala elinye namacala amabini
| Ewe
|
| Amalungu amakhulu kumacala omabini, BGA kumacala omabini | Ewe
|
Ubungakanani beChips ezincinci
| 0201 |
| Min BGA kunye Micro BGA pitch kunye nokubala kwebhola | 0.008 ngaphakathi. (0.2mm) ibala, ukubalwa kwebhola ngaphezulu kwe-1000 |
Min Leaded iindawo pitch
| 0.008 ngaphakathi (0.2 mm)
|
Ubukhulu beZahlulo zendibano ngomatshini
| 2.2 ngaphakathi x 2.2 ngaphakathi x 0.6 ngaphakathi.
|
Izihlanganisi zokunyuka komphezulu weNdibano
| Ewe
|
Amalungu efom engaqhelekanga:
| Ewe, iNdibano ngezandla
|
I-LED
|
I-resistor kunye ne-capacitor networks
|
I-Electrolytic capacitors
|
Izixhasi eziguquguqukayo kunye neecapacitors (iimbiza)
|
Iziseko
|
Ukuphinda kufakwe i-soldering
| Ewe
|
Ubungakanani obukhulu bePCB
| 14.5 ngaphakathi x 19.5 ngaphakathi.
|
Min PCB Ukutyeba
| 0.2
|
Amanqaku eFiducial
| Kukhethwa kodwa akufuneki
|
PCB Gqiba:
| 1. SMOBC/HASL
|
2.Igolide ye-Electrolytic
|
3.Igolide engenambane
|
4.Isilivere engenambane
|
5.Ukuntywiliselwa kwegolide
|
6.Itoti yokuntywiliselwa
|
7. OSP
|
Ubume bePCB
| Nayiphi na
|
PCB enephaneli
| 1.Ithebhu ihanjiswe
|
2
|
3.V-Inqaku
|
4.Routed+ V inqaku
|
Ukuhlolwa
| 1. Uhlalutyo lweX-reyi
|
2.Imakroskopu ukuya ku-20X
|
Phinda usebenze
| 1.BGA ukususwa kunye nesikhululo sokutshintshwa
|
2.Isikhululo sokusebenza kwakhona se-SMT IR
|
3
|
I-Firmware
| Nika iifayile zeprogram ye-firmware, i-irware + isoftware imiyalelo yokufaka |
Uvavanyo lomsebenzi
| Inqanaba lovavanyo elifunekayo kunye nemiyalelo yovavanyo
|
Ifayile yePCB:
| PCB Altium / Gerber / iifayile Ukhozi (Kubandakanya specs ezifana ubukhulu, ubukhulu bobhedu, umbala wemaski yesolder, ukugqiba, njl.njl) |
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