I-Via hole yaziwa nangokuthi nge-hole.Ukuze kuhlangatshezwane nezidingo zamakhasimende, i
ibhodi lesifunda ngembobo kufanele ixhunywe.Ngemva kokuzijwayeza okuningi, inqubo yembobo yepulaki ye-aluminium evamile ishintshiwe, futhi imaski ye-solder yebhodi lesifunda kanye nepulaki kuqedwa nge-mesh emhlophe.umgodi.Ukukhiqizwa okuzinzile kanye nekhwalithi ethembekile.
I-Via holes idlala indima yokuxhuma kanye nokuqhuba imigqa.Ukuthuthukiswa kwemboni yezogesi nakho kukhuthaza ukuthuthukiswa kwama-PCB, futhi kubeka phambili izidingo eziphakeme zobuchwepheshe bokukhiqiza ibhodi eliphrintiwe kanye nobuchwepheshe bokukhweza phezulu.Ubuchwepheshe bokuxhuma imbobo buye baba khona, futhi lezi zidingo ezilandelayo kufanele zihlangatshezwe ngasikhathi sinye:
(1) Kukhona ithusi kuphela embobeni yokungena, futhi imaski ye-solder ingaxhunywa noma cha;
(2) Kumelwe kube nethayela nomthofu embotsheni ye-via, enesidingo esithile sokujiya (ama-microns ama-4), futhi akukho uyinki ongafakwanga embobeni okufanele ungene, okubangela ukuba ubuhlalu bethayela bufihlwe embobeni;
(3) Izimbobo zokungena ezimbotsheni kufanele zibe nezimbobo zepulaki kayinki ezimelana ne-solder, ezingacacile, futhi akumele zibe nendilinga kathayela, ubuhlalu bethayela, kanye nezidingo zokulinganisa.
Kungani amabhodi esekethe e-PCB edinga ukuvimba nge-vias?
Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni "kokukhanya, okuncane, okufushane nokuncane", ama-PCB nawo athuthukela ekuminyana okuphezulu kanye nobunzima obukhulu.Ngakho-ke, kuvele inani elikhulu lama-PCB e-SMT kanye ne-BGA, futhi amakhasimende adinga izimbobo zokuxhuma lapho ekhweza izingxenye, ikakhulukazi okuhlanganisa imisebenzi emihlanu:
(1) Vimbela ithini ekungeneni endaweni yengxenye ngokusebenzisa imbobo ukuze kubangele isekethe emfushane lapho i-PCB idlula ekusongelweni kwamagagasi;ikakhulukazi uma sibeka imbobo ye-via kuphedi ye-BGA, kufanele siqale senze imbobo yepulaki, bese sinamathisele igolide ukuze kube lula ukuhlanganisa i-BGA.
(2) Gwema izinsalela ezigelezayo emgodini odlula;
(3) Ngemva kokuphothulwa kokukhweza okungaphezulu kanye nokuhlanganiswa kwengxenye yefekthri kagesi, i-PCB kufanele ikhishwe emshinini wokuhlola ukuze yenze umfutho ongemuhle ngaphambi kokuba iqedwe:
(4) Vimbela ukunamathisela kwe-solder okungaphezulu ukuthi kungangeni emgodini ukuze kubangele ukushisela okubonakalayo, okuthinta ukukhwezwa;
(5) Vimbela ubuhlalu bukathayela bungaphumi phakathi nokusoda kwamagagasi, okubangela ukujikeleza okufushane.
Ukugcwaliseka kwe-Conductive Hole Plugging Technology
Kumabhodi okukhweza angaphezulu, ikakhulukazi okukhwezwa kwe-BGA ne-IC, izimbobo ezidlula ngendlela kufanele zibe sicaba, zibe ne-convex ne-concave plus noma khipha i-1 mil, futhi akumele kube khona ithini elibomvu onqenqemeni lwembobo edlula;ubuhlalu bethayela bufihliwe embobeni, ukuze kuzuzwe ukwaneliseka kwekhasimende Izidingo zenqubo yokuxhuma ngembobo zingachazwa njengezinhlobonhlobo, ukugeleza kwenqubo kude kakhulu, futhi ukulawula inqubo kunzima.Kuvame ukuba nezinkinga ezifana nokulahlekelwa uwoyela ngesikhathi sokulinganisa komoya oshisayo kanye nokuhlolwa kokumelana ne-solder kawoyela oluhlaza;ukuqhuma kwamafutha ngemva kokwelapha.Manje ngokwezimo zangempela zokukhiqiza, izinqubo ezahlukahlukene zembobo yepulaki ye-PCB ziyafingqwa, futhi ezinye iziqhathaniso nezincazelo zenziwa kule nqubo, izinzuzo kanye nokubi:
Qaphela: Isimiso sokusebenza sokulinganisa komoya oshisayo ukusebenzisa umoya oshisayo ukususa i-solder eyeqile ebusweni bebhodi lesifunda eliphrintiwe nasezimbotsheni, futhi i-solder esele imbozwe ngokulinganayo kumaphedi, imigqa ye-solder engamelani nangaphezulu. amaphuzu okupakisha, okuyindlela yokwelapha engaphezulu yebhodi lesifunda eliphrintiwe.eyodwa.
1. Inqubo yokuxhuma imbobo ngemva kokulinganisa komoya oshisayo
Ukugeleza kwenqubo ithi: imaski yesoda yebhodi → HAL → imbobo yokuxhuma → ukuphulukisa.Inqubo yokungaxhumi isetshenziselwa ukukhiqiza.Ngemuva kokuthi umoya oshisayo ulinganisiwe, isikrini se-aluminium noma isikrini sokuvimba uyinki sisetshenziselwa ukuqedela ukuxhuma ngembobo kuzo zonke izinqaba ezidingwa ikhasimende.Uyinki wokuxhuma ungaba uyinki we-photosensitive noma uyinki we-thermosetting.Endabeni yokuqinisekisa umbala ofanayo wefilimu emanzi, inki yokuxhuma ingcono kakhulu ukusebenzisa inki efanayo nebhodi lebhodi.Le nqubo ingaqinisekisa ukuthi i- via hole ayiwawisi uwoyela ngemva kokuba umoya oshisayo ulinganisiwe, kodwa kulula ukubangela ukuthi uyinki wembobo yepulaki ungcolise ingaphezulu lebhodi futhi ungalingani.Kulula kumakhasimende ukuthi abangele i-soldering ebonakalayo (ikakhulukazi ku-BGA) lapho ikhuphuka.Ngakho amakhasimende amaningi awayamukeli le ndlela.
2. Faka inqubo yembobo ngaphambi kokulinganisa komoya oshisayo
2.1 Sebenzisa ishidi le-aluminium ukuze uxhume izimbobo, ulungise, futhi ugaye ipuleti ukuze udlulise iphethini
Kule nqubo, umshini wokumba we-CNC usetshenziselwa ukukhipha ishidi le-aluminium elidinga ukuxhunywa, wenze ipuleti lesikrini, futhi uxhume izimbobo ukuqinisekisa ukuthi izimbobo zigcwele, futhi uyinki wokuxhuma usetshenziselwa ukuxhuma imbobo. ., ukuguqulwa kwe-resin shrinkage kuncane, futhi amandla okubopha ngodonga lwembobo kuhle.Inqubo yokugeleza ithi: ukwelashwa kusengaphambili → imbobo yepulaki → ipuleti lokugaya → ukudluliswa kwephethini → i-etching → imaski ye-solder yebhodi
Le ndlela ingaqinisekisa ukuthi imbobo yepulaki ye-via hole iyisicaba, futhi ukulinganisa komoya oshisayo ngeke kube nezinkinga zekhwalithi njengokuqhuma kukawoyela nokulahlekelwa uwoyela emaphethelweni omgodi, kodwa le nqubo idinga ukujiya ngesikhathi esisodwa kwethusi, ukuze ugqinsi lwethusi lodonga lwembobo lungahlangabezana nezinga lekhasimende.Ngakho-ke, izidingo ze-copper plating kulo lonke ipuleti ziphakeme kakhulu, futhi kunezidingo eziphakeme zokusebenza komshini wokugaya ukuze kuqinisekiswe ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ayinalutho. ukungcola.Izimboni eziningi ze-PCB azinayo inqubo yethusi yokuqina ngesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekutheni le nqubo ingasetshenziswa kakhulu ezimbonini ze-PCB.
2.2 Ngemva kokuxhuma izimbobo ngamashidi e-aluminium, vula ngokuqondile imaski ye-solder endaweni yebhodi.
Kule nqubo, umshini wokumba we-CNC usetshenziselwa ukukhipha ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe ipuleti lesikrini, elifakwa emshinini wokuphrinta wesikrini ukuze lixhunywe.Ngemuva kokuthi ukuxhuma kuqediwe, akufanele kumiswe ngaphezu kwemizuzu engama-30.Ukugeleza kwenqubo ukuthi: ukwelashwa ngaphambi kwesikhathi - imbobo yepulaki - isikrini sikasilika - ukubhaka kwangaphambili - ukuchayeka - ukuthuthukisa - ukwelapha
Le nqubo ingaqinisekisa ukuthi i-via hole imbozwe kahle ngamafutha, imbobo yepulaki isicaba, futhi umbala wefilimu emanzi uyafana.Amaphedi, okuholela ekungabini kahle kwe-solderability;ngemva kokulinganisa komoya oshisayo, unqenqema lwamabhamuza omgodi namafutha luyasuswa.Kunzima ukulawula ukukhiqiza usebenzisa le ndlela yenqubo, futhi unjiniyela wenqubo kufanele athathe izinqubo ezikhethekile nemingcele yokuqinisekisa ikhwalithi yembobo yepulaki.
Kungani amabhodi esekethe e-PCB edinga ukuvimba nge-vias?
2.3 Ngemuva kokuthi ishidi le-aluminium lixhume izimbobo, lithuthuke, liphulukise ngaphambili, futhi ligaye ibhodi, ingaphezulu lebhodi liyathengiswa.
Sebenzisa umshini wokumba we-CNC ukuze ukhiphe ishidi le-aluminium elidinga izimbobo zokuxhuma, wenze ipuleti lesikrini, futhi ulifake emshinini wokuphrinta wesikrini se-shift wezimbobo zamapulaki.Izimbobo zamapulaki kufanele zigcwale, futhi izinhlangothi zombili kungcono ziphume.Ukugeleza kwenqubo ithi: ukwelashwa kwangaphambili - imbobo yepulaki - ukubhaka kwangaphambili - ukuthuthukiswa - ukuphulukiswa kwangaphambili - imaski ye-solder yebhodi
Ngoba le nqubo isebenzisa ukuphulukiswa kwe-plug-hole ukuze kuqinisekiswe ukuthi i-via hole ngeke ilahlekelwe uwoyela noma uwoyela uqhume ngemva kwe-HAL, kodwa ngemva kwe-HAL, kunzima ukuxazulula ngokuphelele inkinga ye-tin bead embobeni nethini embobeni, ngakho amakhasimende amaningi awakwamukeli.
2.4 Imaski ye-solder endaweni yebhodi kanye nembobo yepulaki kuyaqedwa kanyekanye.
Le ndlela isebenzisa isikrini sesikrini esingu-36T (43T), esifakwa emshinini wokuphrinta wesikrini, kusetshenziswa i-backing plate noma umbhede wezinzipho, nokuxhuma zonke izimbobo ngenkathi kuqedwa indawo yebhodi.Inqubo yokugeleza ithi: ukwelashwa kusengaphambili--ukuphrinta isikrini- -Pre-bhaka--Exposure--Development--Cure
Le nqubo inesikhathi esifushane kanye nezinga eliphezulu lokusetshenziswa kwemishini, engaqinisekisa ukuthi izimbobo zokudlula ngeke zilahlekelwe uwoyela kanye nezimbobo ezidlulayo ngeke zifakwe ithini ngemva kokulinganisa komoya oshisayo., Umoya uyakhula futhi uhlephule imaskhi ye-solder, ubangele i-voids nokungalingani.Kuzoba khona inani elincane lemigodi efihlwe ethini ngesikhathi sokulinganisa komoya oshisayo.Njengamanje, inkampani yethu isixazulule ngokuyisisekelo imbobo nokungalingani kwe-via hole ngemva kokuhlolwa okuningi, ukukhetha izinhlobo ezahlukene zikayinki kanye ne-viscosity, ukulungisa ingcindezi yokuphrinta isikrini sikasilika, njll., futhi le nqubo yamukelwa ukukhiqizwa ngobuningi. .
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