Tun da COB ba shi da firam ɗin gubar na kunshin IC, amma an maye gurbinsa da PCB, ƙirar PCB pads yana da matukar mahimmanci, kuma Gama zai iya amfani da zinare na lantarki ko ENIG kawai, in ba haka ba waya ta gwal ko waya ta aluminum, ko ma The latest jan karfe wayoyi. za a sami matsalolin da ba za a iya bugawa ba. PCB Design Abubuwan da ake buƙata don COB 1. The ƙãre surface jiyya na PCB hukumar dole ne zinariya electroplating ko ENIG, kuma shi ne kadan thicker fiye da zinariya plating Layer na general PCB hukumar, don samar da makamashi da ake bukata domin Die Bonding da samar da zinariya-aluminum. ko zinariya-zinariya duka zinariya. 2. A cikin wiring matsayi na kushin kewaye a waje da Die Pad na COB, kokarin la'akari da cewa tsawon kowane waldi waya yana da tsayayyen tsawon, wato, nisa na solder hadin gwiwa daga wafer zuwa PCB. kushin ya kamata ya kasance daidai gwargwadon yiwuwar.Ana iya sarrafa matsayin kowace igiyar haɗin gwiwa don rage matsalar gajeriyar kewayawa lokacin da wayoyi masu haɗawa suka shiga tsakani.Sabili da haka, ƙirar kushin tare da layin diagonal bai dace da buƙatun ba.Ana ba da shawarar cewa za a iya gajarta tazarar kushin PCB don kawar da bayyanar pad ɗin diagonal.Hakanan yana yiwuwa a ƙirƙira wuraren kushin elliptical don rarraba daidaitattun matsayi tsakanin wayoyi masu haɗin gwiwa. 3. Ana ba da shawarar cewa wafer COB ya kasance yana da aƙalla maki biyu.Zai fi kyau kada a yi amfani da madaidaicin madauwari na SMT na al'ada, amma don amfani da madaidaicin madaidaicin ma'aunin giciye, saboda na'ura mai haɗawa ta Waya (waya bonding) na'ura tana yin atomatik Lokacin da sakawa, ana yin madaidaicin ta hanyar fahimtar madaidaiciyar layi. .Ina tsammanin wannan saboda babu wani wurin saka madauwari akan firam ɗin jagorar gargajiya, amma firam ɗin madaidaici kawai.Wataƙila wasu na'urorin haɗin gwiwar Waya ba iri ɗaya ba ne.Ana bada shawara don fara komawa zuwa aikin na'ura don yin zane.
4, girman kushin mutuwa na PCB ya kamata ya zama ɗan girma fiye da ainihin wafer, wanda zai iya iyakance kashewa lokacin sanya wafer, kuma yana hana wafer ɗin yin juyawa da yawa a cikin kushin mutu.Ana ba da shawarar cewa wafer pads a kowane gefe ya zama 0.25 ~ 0.3mm ya fi girma fiye da ainihin wafer.
5. Zai fi kyau kada a sami ta ramuka a cikin yankin da ake buƙatar cika COB da manne.Idan ba za a iya guje wa ba, ana buƙatar masana'antar PCB ta toshe waɗannan gaba ɗaya ta cikin ramuka.Manufar ita ce hana ramukan shiga cikin PCB yayin rarrabawar Epoxy.a gefe guda kuma yana haifar da matsalolin da ba dole ba. 6. Ana ba da shawarar buga tambarin Silkscreen a kan yankin da ake buƙatar rarrabawa, wanda zai iya sauƙaƙe aikin rarrabawa da sarrafa nau'i na rarrabawa.
Idan kuna kowace tambaya ko tambaya, da fatan za a tuntuɓe mu! nan .
San ƙarin game da mu! Nan.
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