Gabaɗaya iyawa
- Gefe guda ɗaya
- Gefe Biyu
- Multi Layer
- An binne ta Via
- Makaho Via
- An Sarrafa Matsala
- Micro Via
- Laser Drilling
- Amincewa da RoHS
- Epoxy cike ta hanyar
PCB mai ƙarfi
Abu
| Spec
|
Yadudduka
| 1 ~ 20
|
Kaurin allo
| 0.1mm-8.0mm
|
Kayan abu
| FR-4, CEM-1 / CEM-3, PI, High Tg, Rogers, PTEF, Alu / Cu Base, da dai sauransu
|
Girman Panel Max
| 600mm × 1200mm
|
Girman Ramin Min
| 0.1mm
|
Min Layin Nisa/Sarari
| 3mil(0.075mm)
|
Haƙuri na Ƙimar allo
| 0.10mm
|
Insulation Layer Kauri
| 0.075mm - 5.00mm
|
Out Layer Copper Kauri
| 18 - 350
|
Ramin Hakowa (Mechanical)
| 17 - 175 pm
|
Ƙarshen Ramin (Mechanical)
| 17 - 175 pm
|
Haƙurin Diamita (Mechanical)
| 0.05mm
|
Rajista (Makanikanci)
| 0.075mm
|
Rabo Halaye
| 16:01
|
Nau'in Mashin Solder
| LPI
|
SMT Min.Nisa Mashin Solder
| 0.075mm
|
Min.Solder Masks
| 0.05mm
|
Toshe Ramin Diamita
| 0.25mm - 0.60mm
|
Haƙuri na Kula da Cututtuka
| 10%
|
Ƙarshen saman
| ENIG, OSP, HASL, Chem.Tin/Sn, Flash Gold, da dai sauransu
|
Soldermask
| Kore/Yellow/Baki/Fara/Ja/Blue
|
Silkscreen
| Ja/Yellow/Baki/Fara
|
Takaddun shaida
| UL, ISO9001, ISO14001, IATF16949
|
Buƙatar Musamman
| Ramin makafi, Yatsan Zinare, BGA, Tawada Carbon, abin rufe fuska, tsarin VIP, Plating Edge, Rabin ramuka , da dai sauransu
|
Kayayyakin Kayayyaki
| Shengyi, ITEQ, Taiyo, da dai sauransu.
|
Kunshin gama gari
| Vacuum+Carton
|
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