Ceramic circuit boards chaizvoizvo akagadzirwa nemagetsi ceramic zvinhu uye anogona kugadzirwa akasiyana maumbirwo.Pakati pavo, iyo ceramic circuit board ine yakanakisa hunhu hwekupisa tembiricha kuramba uye yakakwirira yemagetsi insulation.Iyo ine zvakanakira yakaderera dielectric inogara, yakaderera dielectric kurasikirwa, yakanyanya kupisa conductivity, yakanaka kugadzikana kwemakemikari, uye yakafanana thermal kuwedzera coefficients yezvikamu.Ceramic yakadhindwa redunhu mabhodhi anogadzirwa uchishandisa Laser kukurumidza activation metallization tekinoroji LAM tekinoroji.Inoshandiswa mumunda we LED, high-power semiconductor modules, semiconductor coolers, magetsi emagetsi, magetsi ekugadzirisa magetsi, magetsi emagetsi emagetsi, magetsi emagetsi emagetsi, high-frequency switching power supply, solid state relays, magetsi emotokari, kutaurirana, aerospace nemauto emagetsi. zvikamu.

Yakasiyana kubva pachinyakare FR-4 (girazi fiber) , Ceramic zvinhu zvine maitiro akanaka e-high-frequency performance uye magetsi emagetsi, pamwe chete nepamusoro pekushisa kwekushisa, kugadzikana kwemakemikari uye kugadzikana kwekushisa.Ideal packaging materials yekugadzira yakakura-scale integrated circuits uye simba electronic modules.

Zvakanakira:
1. Higher thermal conductivity
2. Kuwedzera kufananidza kupisa kwekuwedzera coefficient
3. A kuoma, yakaderera kuramba simbi firimu alumina zvedongo redunhu bhodhi
4. Iyo solderability yehwaro zvinhu zvakanaka, uye tembiricha yekushandisa yakakwira.
5. Kuvhara kwakanaka
6. Low frequency kurasikirwa
7. Unganidza nehupamhi hwepamusoro
8. Haina organic ingredients, inopesana nemirairo ye cosmic, ine kuvimbika kwepamusoro mune aerospace uye aerospace, uye ine hupenyu hurefu hwebasa.
9. Mhangura yemhangura haina oxide layer uye inogona kushandiswa kwenguva yakareba mumhepo inoderedza.

Technical zvakanakira

Nhanganyaya yekugadzira maitiro eceramic yakadhindwa redunhu bhodhi tekinoroji-gomba punching

Nekuvandudzwa kwezvigadzirwa zvemagetsi zvine simba repamusoro-soro munzira yeminiaturization uye yakakwirira-kumhanya, yechinyakare FR-4, aruminiyamu substrate uye zvimwe zvigadzirwa zve substrate hazvichakodzeri kuvandudzwa kwesimba repamusoro-simba uye nepamusoro-simba.

Nekufambira mberi kwesainzi uye tekinoroji, iko kwakangwara kushandisa kwePCB indasitiri.Iwo echinyakare LTCC uye DBC matekinoroji anotsiviwa zvishoma nezvishoma neDPC uye LAM tekinoroji.Iyo laser tekinoroji inomiririrwa neLAM tekinoroji inonyanya kuenderana nekuvandudzwa kwehupamhi-density yekubatanidza uye kunaka kweakadhindwa edunhu mabhodhi.Laser drilling ndiyo yekumberi-kuguma uye mainstream yekuchera tekinoroji muPCB indasitiri.Iyo tekinoroji inoshanda, inokurumidza, yakarurama, uye ine kukosha kwekushandisa kwepamusoro.

Iyo RayMingceramic redunhu bhodhi inogadzirwa ne laser kukurumidza activation metallization tekinoroji.Simba rekubatanidza pakati pesimbi nekeramic rakakwirira, magetsi emagetsi akanaka, uye welding inogona kudzokororwa.Ukobvu hwesimbi yesimbi inogona kugadziridzwa muhuwandu hwe1μm-1mm, iyo inogona kuwana L/S resolution.20μm, inogona kubatanidzwa zvakananga kuti ipe zvigadziriso zvevatengi

Lateral excitation yeatmospheric CO2 laser inogadzirwa nekambani yekuCanada.Kuenzaniswa nema lasers echinyakare, simba rekubuda rakakwira sezana kusvika kune chiuru nguva, uye iri nyore kugadzira.

Mune electromagnetic spectrum, redhiyo frequency iri mu frequency renji ye105-109 Hz.Nekuvandudzwa kwehunyanzvi hwemauto uye aerospace, iyo yechipiri frequency inoburitswa.Yakaderera uye yepakati simba RF CO2 lasers ine yakanakisa modulation performance, yakagadzikana simba uye yakakwirira kushanda kuvimbika.Zvimiro zvakadai sehupenyu hurefu.UV yakasimba YAG inoshandiswa zvakanyanya mumapurasitiki nesimbi muindasitiri yemicroelectronics.Kunyangwe iyo CO2 laser drilling process yakanyanya kuomarara, kugadzirwa kweiyo micro-aperture iri nani pane iyo UV yakasimba YAG, asi iyo CO2 laser ine zvakanakira kushanda kwepamusoro uye kumhanya-kumhanya kubaya.Mugove wemusika wePCB laser micro-hole processing inogona kuve yemumba laser micro-gomba kugadzira ichiri kusimukira Panguva ino, haasi makambani mazhinji anogona kuisa mukugadzira.

Kugadzirwa kwemukati laser microvia kuchiri mudanho rekusimudzira.Short pulse uye yakakwirira peak simba lasers anoshandiswa kuchera makomba muPCB substrates kuwana yakakwirira-density simba, kubviswa kwezvinhu uye micro-gomba kuumbwa.Ablation yakakamurwa kuita photothermal ablation uye photochemical ablation.Photothermal ablation inoreva kupedzwa kwegomba rekugadzira nzira kuburikidza nekukurumidza kutorwa kweyepamusoro-simba laser mwenje neiyo substrate zvinhu.Photochemical ablation inoreva kusanganiswa kwesimba repamusoro rephoton munzvimbo yeultraviolet inodarika 2 eV electron volts uye laser wavelength inodarika 400 nm.Iyo nzira yekugadzira inogona kunyatso paradza marefu mamorekuru maketani ezve organic zvinhu kuti aumbe madiki madiki, uye zvimedu zvinogona kukurumidza kuumba micropores pasi pechiito chekunze kwesimba.

Nhasi, tekinoroji yekuChina yekuchera laser ine humwe ruzivo uye kufambira mberi kwetekinoroji.Kuenzaniswa neyechinyakare stamping tekinoroji, laser drilling tekinoroji ine yakanyanya kurongeka, kumhanya kwakanyanya, kunyatsoshanda, hombe-batch punching, yakakodzera kune yakanyanya kupfava uye yakaoma zvinhu, pasina kurasikirwa kwezvishandiso, uye kugadzirwa kwemarara.Zvakanakira zvinhu zvishoma, kuchengetedzwa kwezvakatipoteredza uye hapana kusvibiswa.

Ceramic circuit board iri kuburikidza nelaser drilling process, simba rekubatanidza pakati peceramic nesimbi rakakwirira, haridonhe, richipupuma furo, zvichingodaro, uye mhedzisiro yekukura pamwe chete, kureba kwepamusoro, roughness ratio ye0.1 micron kusvika 0.3 micron, laser inorova gomba dhayamita Kubva 0.15 mm kusvika 0.5 mm, kana kunyange 0.06 mm.


Ceramic circuit board kugadzira-etching

Iyo foil yemhangura inosara pachikamu chekunze chebhodhi redunhu, ndiko kuti, dhizaini yedunhu, inofanoputirwa neturu yelead-tin kuramba, uyezve iyo isina kudzivirirwa isiri-conductor chikamu chemhangura inoiswa kemikari kuti iite circuit.

Zvinoenderana neakasiyana maitiro maitiro, etching inokamurwa kuita yemukati layer etching uye yekunze layer etching.Iyo yemukati layer etching ndeye acid etching, yakanyorova firimu kana yakaoma firimu m inoshandiswa seanopikisa;iyo yekunze layer etching ndeye alkaline etching, uye tin-lead inoshandiswa seanopikisa.Agent.

Nheyo yekutanga ye etching reaction

1. Alkalization yeasidhi mhangura chloride


1, Acdic copper chloride alkalization

Kusadziviririka: Chikamu chemufirimu wakaoma usina kusvibiswa nemirairo ye ultraviolet inonyungudutswa neasina simba alkaline sodium carbonate, uye chikamu chinopisa chinoramba chiripo.

Etching: Zvinoenderana nechimwe chikamu chemushonga, iyo mhangura inofumurwa nekunyungudutsa firimu rakaoma kana firimu rakanyorova rinonyungudutswa uye rakaiswa ne acid copper chloride etching solution.

Firimu inopera: Iyo firimu inodzivirira pamutsara wekugadzira inonyungudika pane imwe chikamu chetembiricha chaiyo uye kumhanya.

Acidic copper chloride catalyst ine hunhu hwekudzora kuri nyore kwekumhanyisa kumhanya, yakakwira copper etching kunyatsoita, kunaka kwakanaka, uye nyore kudzoreredza etching mhinduro.

2. Alkaline etching



Alkaline etching

Firimu inopera: Shandisa meringue mvura kuti ubvise firimu kubva pane firimu pamusoro, uchibudisa pachena mhangura isina kushandiswa.

Etching: Iyo isingadikanwi yepasi layer inonamirwa kure ne etchant kubvisa mhangura, ichisiya mitsetse yakakora.Pakati pavo, midziyo yebetsero ichashandiswa.Iyo accelerator inoshandiswa kukurudzira iyo oxidation reaction uye kudzivirira kunaya kweiyo cuprous ions;mushonga wezvipembenene unoshandiswa kuderedza kukukurwa kweparutivi;iyo inhibitor inoshandiswa kudzivisa kupararira kweammonia, kunaya kwemhangura, uye kukurumidza kusvibiswa kwemhangura.

New emulsion: Shandisa monohydrate ammonia mvura isina maion emhangura kubvisa zvakasara pandiro neammonium chloride solution.

Gomba rakazara: Iyi nzira inokodzera chete kunyudza goridhe process.Kunyanya bvisa yakawandisa palladium ions mune isina-yakaputirwa nemumakomba kudzivirira maion egoridhe kuti asanyura mukunaya kwegoridhe.

Tin peeling: Iyo tin-lead layer inobviswa uchishandisa nitric acid solution.

Zvina zvinokonzeresa etching

1. Pool effect
Munguva yekugadzira etching, iyo mvura ichaita firimu remvura pabhodhi nekuda kwesimba rinokwevera zvinhu pasi, nekudaro ichidzivirira iyo nyowani nyowani kubva pakubata pamusoro pemhangura.




2. Groove effect
Kusungirirwa kwemushonga wemakemikari kunoita kuti mushonga wemakemikari unamate kune mukaha pakati pepombi uye pombi, izvo zvinozoita kuti pave neyakasiyana etching yakawanda munzvimbo ine dense, uye nzvimbo yakashama.




3. Pass effect
Mushonga wemvura unoyerera uchidzika nemugomba, izvo zvinowedzera kukurumidza kuvandudzwa kwemushonga wemvura kutenderedza gomba replate panguva yekugadzira, uye huwandu hweetching hunowedzera.




4. Nozzle swing effect
Mutsara unoenderana neinozunguza nzira yemuromo, nekuti mushonga mutsva wemvura unogona kuparadzira nyore mushonga wemvura pakati pemitsetse, mushonga wemvura unokurumidza kuvandudzwa, uye huwandu hweetching hwakakura;

Mutsara wakatarisana neinozungunuka nzira yemuromo, nekuti nyowani kemikari mvura haisi nyore kuparadzira mushonga wemvura pakati pemitsetse, mushonga wemvura unozorodzwa nekumhanya kunononoka, uye iyo etching huwandu idiki.




Matambudziko akajairika mukugadzira etching uye nzira dzekuvandudza

1. Bhaisikopo hariperi
Nokuti kuwanda kwesyrup kwakaderera zvikuru;iyo linear velocity inokurumidza;iyo muromo inovhara uye mamwe matambudziko achaita kuti firimu rive risingaperi.Nokudaro, zvinodikanwa kutarisa kusanganiswa kwesyrup uye kugadzirisa kuiswa kwesirasi kune imwe nzvimbo yakakodzera;gadzirisa kumhanya uye parameter munguva;wobva wachenesa muromo.

2. Kumusoro kwebhodhi kune oxidized
Nekuti sirasi yekumisikidza yakawandisa uye tembiricha yakanyanya, zvinokonzeresa kuti pamusoro pebhodhi ive oxidize.Naizvozvo, zvinodikanwa kugadzirisa kusungirirwa uye tembiricha yesyrup nenguva.

3. Thetecopper haina kupera
Nokuti etching speed inokurumidza;kuumbwa kwesyrup kwakashata;nzvimbo yemhangura yakasvibiswa;muromo wakavharwa;tembiricha yakaderera uye mhangura haina kupera.Naizvozvo, zvinodikanwa kugadzirisa etching kutapurirana kumhanya;ongorora zvakare kuumbwa kwesyrup;chenjererai kusvibiswa kwemhangura;chenesa muromo kudzivirira kuvhara;gadzirisa tembiricha.

4. Iyo etching mhangura yakanyanya
Nekuti muchina unofamba zvishoma nezvishoma, tembiricha yakakwira zvakanyanya, nezvimwewo, inogona kukonzera ngura yakawandisa yemhangura.Naizvozvo, matanho akadai sekugadzirisa kumhanya kwemuchina uye kugadzirisa tembiricha inofanira kutorwa.