Kupisa kwechinhu, kunozivikanwawo sekudzoreredza moto, kuzvidzima, kuramba murazvo, kuramba murazvo, kuramba moto, kupisa uye kumwe kupisa, kuongorora kugona kwechinhu kuramba kupisa.

Muenzaniso wezvinhu zvinopisa unobatidzwa nemurazvo unoenderana nezvinodiwa, uye murazvo unobviswa mushure menguva yakatarwa.Chiyero chekupisa chinoongororwa maererano nehuwandu hwekupisa kwemuenzaniso.Pane nhanho nhatu.Iyo yakachinjika bvunzo nzira yemuenzaniso yakakamurwa kuita FH1, FH2, FH3 nhanho yetatu, yakatwasuka nzira yekuyedza yakakamurwa kuita FV0, FV1, VF2.
Iyo yakasimba PCB bhodhi yakakamurwa kuita HB board uye V0 board.

HB sheet rine low flame retardancy uye rinonyanya kushandiswa kune rimwe divi-mabhodhi.VO board ine high flame retardancy.Iyo inonyanya kushandiswa kune maviri-mativi uye akawanda-layer mabhodhi anosangana neV-1 moto rating zvinodiwa.Iyi mhando yePCB board inova FR-4 board.V-0, V-1, uye V-2 mamakisi asingapinde mumoto.

Bhodhi redunhu rinofanira kunge risingachinji murazvo, harigone kupisa pane imwe tembiricha, asi rinogona kupfaviswa chete.Tembiricha panguva ino inonzi tembiricha yegirazi (Tg point), uye kukosha uku kune hukama nekudzikama kweiyo PCB board.

Chii chepamusoro Tg PCB redunhu bhodhi uye zvakanakira kushandisa yakakwira Tg PCB?
Kana kutonhora kwepamusoro Tg yakadhindwa bhodhi ichikwira kune imwe nzvimbo, iyo substrate ichachinja kubva ku "girazi mamiriro" kuenda ku "rubber state".Tembiricha panguva ino inonzi tembiricha yegirazi (Tg) yebhodhi.Mune mamwe mazwi, Tg ndiyo tembiricha yepamusoro apo iyo substrate inochengetedza kuomarara.

Ndeapi marudzi chaiwo ePCB board?
Yakakamurwa negiredhi nhanho kubva pasi kusvika kumusoro sezvinotevera:

94HB - 94VO - 22F - CEM-1 - CEM-3 - FR-4 inotsanangurwa zvakadzama sezvinotevera: 94HB: makadhibhokisi akajairwa, kwete moto (iyo yakaderera giredhi zvinhu, kufa punching, haigone kushandiswa semagetsi board) 94V0: flame retardant cardboard (mold Punching) 22F: Single-sided half fiberglass board (fa punching) CEM-1: Single-sided fiberglass board (inofanira kucherwa nekombuta, kwete kufa kubaya) CEM-3: Kaviri-sided hafu fiberglass board ( kunze kwekaviri-mativi Cardboard ndiyo yakadzikira-inoperera mabhodhi ane mativi maviri. Mabhodhi akareruka ane mativi maviri anogona kushandisa chinhu ichi, chinova 5~10 yuan/square mita zvakachipa pane FR-4.)

FR-4: Kaviri-sided fiberglass board

Bhodhi redunhu rinofanira kunge risingachinji murazvo, harigone kupisa pane imwe tembiricha, asi rinogona kupfaviswa chete.Tembiricha panguva ino inonzi tembiricha yegirazi (Tg point), uye kukosha uku kune hukama nekudzikama kweiyo PCB board.

Chii chakakwira Tg PCB redunhu bhodhi uye zvakanakira kushandisa yakakwira Tg PCB

Kana tembiricha ichikwira kune imwe nzvimbo, iyo substrate inoshanduka kubva ku "girazi" kuenda ku "rubbery", uye tembiricha panguva ino inonzi tembiricha yegirazi (Tg) yendiro.Mune mamwe mazwi, Tg ndiyo tembiricha yepamusoro (° C) apo iyo substrate inochengetedza kuomarara.

Kureva kuti, zvakajairwa PCB substrate zvinhu hazvingoburitse kupfava, deformation, kunyunguduka uye zvimwe zviitiko pakupisa kwakanyanya, asi zvakare zvinoratidza kudzikira kwakanyanya mumakanika uye magetsi maitiro (ndinofunga haudi kuona kurongeka kwePCB mabhodhi. uye ona mamiriro aya mune zvigadzirwa zvako. ).

Iyo general Tg ndiro inodarika 130 madhigirii, iyo yakakwira Tg inowanzopfuura 170 madhigirii, uye yepakati Tg inodarika 150 madhigirii.

Kazhinji PCB yakadhindwa mapuranga ane Tg ≥ 170 ° C inonzi yakakwirira Tg yakadhindwa mabhodhi.Sezvo Tg ye substrate inowedzera, kupisa kwekushisa, kupikisa kwehunyoro, kupikisa kwemakemikari, kugadzikana uye mamwe maitiro ebhodhi rakadhindwa zvichavandudzwa uye kuvandudzwa.Iyo yakakwira iyo TG kukosha, zviri nani kupikisa tembiricha yebhodhi, kunyanya mukutungamira-isina maitiro, uko yakakwirira Tg maapplication akajairika.

High Tg inoreva kupisa kwakanyanya.Nekukurumidza kukurumidza kweindasitiri yemagetsi, kunyanya zvigadzirwa zvemagetsi zvinomiririrwa nemakomputa, kusimudzira kwekushanda kwepamusoro uye yakakwirira multilayers kunoda kupisa kwakanyanya kwePCB substrate zvinhu sevimbiso yakakosha.Kubuda nekusimudzirwa kwehunyanzvi hwekusimudzira tekinoroji inomiririrwa neSMT neCMT yakaita kuti maPCB awedzere kuparadzaniswa kubva pakutsigirwa kwekupisa kwakanyanya kwema substrates maererano nekuvhura kudiki, wiring yakanaka, uye kutetepa.

Naizvozvo, musiyano pakati peyakajairwa FR-4 uye yakakwira Tg FR-4: iri munzvimbo inopisa, kunyanya mushure mekutora unyoro.
Pasi pekupisa, kune misiyano musimba remagetsi, kugadzikana kwedimensional, kunamatira, kunyura kwemvura, kuparara kwemafuta, uye kuwedzera kwekupisa kwezvinhu.High Tg zvigadzirwa zviri pachena zviri nani pane zvakajairwa PCB substrate zvinhu.Mumakore achangopfuura, nhamba yevatengi inoda kugadzirwa kwepamusoro Tg mabhodhi akadhindwa yakawedzera gore negore.

Nekuvandudzwa uye kuenderera mberi kwehunyanzvi hwemagetsi, zvinodiwa zvitsva zvinogara zvichiiswa mberi kune zvakadhindwa redunhu bhodhi substrate zvinhu, nekudaro zvichisimudzira kuenderera mberi kwemhangura yakapfeka laminate zviyero.Parizvino, iwo makuru zviyero zve substrate zvinhu ndeaya anotevera.

① Mayero eNyika Parizvino, nyika yangu miyero yemhando yePCB zvinhu zve substrate zvinhu zvinosanganisira GB/T4721-47221992 uye GB4723-4725-1992.Iyo copper clad laminate standard muTaiwan, China ndiyo CNS chiyero, iyo yakavakirwa pane yeJapan JIs standard., Yakabudiswa muna 1983.
②Mimwe mitemo yenyika inosanganisira: Japanese JIS standards, American ASTM, NEMA, MIL, IPc, ANSI, UL standards, British Bs standards, German DIN neVDE standards, French NFC neUTE standards, uye Canadian CSA Standards, AS mwero muAustralia, FOCT zviyero mune yaimbova Soviet Union, epasi rose IEC zviyero, nezvimwe.

Vatengesi vepakutanga PCB dhizaini zvinhu zvakajairika uye zvinowanzo shandiswa: Shengyi \ Jiantao \ International, nezvimwe.

● Zvinyorwa zvakagamuchirwa: protel autocad powerpcb orcad gerber kana chaiyo bhodhi kopi bhodhi, nezvimwewo.

● Mhando dzebhodhi: CEM-1, CEM -3 FR4, yakakwirira TG zvinhu;

● Maximum bhodhi saizi: 600mm * 700mm (24000mil * 27500mil)

● Kugadzira bhodhi ukobvu: 0.4mm-4.0mm (15.75mil-157.5mil)

● Maximum processing layers: 16Layers

● Copper foil layer Hukobvu: 0.5-4.0 (oz)

● Akapedza bhodhi ukobvu kushivirira: +/-0.1mm (4mil)

● Kugadzira dimension tolerance: kugaya kombiyuta: 0.15mm (6mil) Die punching plate: 0.10mm (4mil)

● Minimum mutsetse upamhi / spacing :0.1mm(4mil) Mutsetse upamhi kudzora kugona: <+-20%

● Iyo shoma yekuchera gomba dhayamita yechigadzirwa chakapedzwa: 0.25mm (10mil) Hushoma hwegomba dhayamita yechigadzirwa chakapedzwa: 0.9mm (35mil) Kushivirira kwedhayamita yegomba rakapedzwa: PTH: + -0.075mm(3mil) NPTH : +-0.05mm(2mil)

● Yakapera gomba madziro mhangura ukobvu: 18-25um (0.71-0.99mil)

● Minimum SMT chigamba spacing: 0.15mm (6mil)

● Kuputira pamusoro: kemikari kunyudza goridhe, tin spray , Bhodhi rose rine nickel-plated goridhe (mvura / goridhe rakapfava), silk screen blue glue, nezvimwewo.

● Solder mask ukobvu pabhodhi: 10-30μm (0.4-1.2mil)

● Kusvuura simba: 1.5N/mm (59N/mil)

● Resistance Solder firimu kuoma: > 5H

● Solder resistance plug gole kugona: 0.3-0.8mm (12mil-30mil)

● Dielectric nguva dzose: ε = 2.1-10.0

● Insulation resistance: 10KΩ-20MΩ

● Hunhu impedance: 60 ohm±10%

● Thermal shock : 288℃, 10 sec

● Warpage yebhodhi rakapedzwa: <0.7%

● Chigadzirwa chekushandisa: midziyo yekukurukurirana, motokari yemagetsi, instrumentation, global positioning system, kombiyuta, MP4, magetsi, midziyo yeimba, nezvimwewo.

Zvinoenderana nePCB board reinforcement materials, inowanzo patsanurwa kuva anotevera marudzi:
1. Phenolic PCB bepa substrate
Nokuti rudzi urwu rwePCB bhodhi rinoumbwa nepepa repepa, pulp yehuni, nezvimwewo, dzimwe nguva inova makadhibhokisi, V0 bhodhi, bhodhi rinopisa moto uye 94HB, nezvimwewo. Chinhu chayo chikuru imapuranga pulp fiber paper, inova rudzi rwePCB. yakagadzirwa ne phenolic resin pressure.ndiro.Rudzi urwu rwepepa substrate haripindire moto, rinogona kubaiwa, rine mutengo wakaderera, mutengo wakaderera, uye kuderera kwehama.Tinowanzoona phenolic paper substrates dzakadai seXPC, FR-1, FR-2, FE-3, nezvimwewo. Uye 94V0 ndeyepepa-retardant paperboard, iyo isingatsva.

2. Composite PCB substrate
Iri rudzi rwehupfu bhodhi rinonziwo bhodhi rehupfu, rine huni pulp fiber bepa kana donje pulp fiber bepa sechinhu chekusimbisa, uye girazi fiber jira sechinhu chinosimbisa pamusoro panguva imwe chete.Zvinhu zviviri izvi zvakagadzirwa nemurazvo-retardant epoxy resin.Kune imwechete-sided hafu-girazi faibha 22F, CEM-1 uye kaviri-sided hafu-girazi faibha bhodhi CEM-3, pakati payo CEM-1 uye CEM-3 ndiwo anonyanya kuumbwa base copper clad laminates.

3. Girazi fiber PCB substrate
Dzimwe nguva inovawo epoxy board, girazi faibha bhodhi, FR4, faibha bhodhi, etc. Inoshandisa epoxy resin sekunamira uye girazi faibha jira sekusimbisa zvinhu.Rudzi urwu rwebhodhi redunhu rine tembiricha yepamusoro yekushanda uye haina kukanganiswa nenharaunda.Iri rudzi rwebhodhi rinowanzo shandiswa mumbiri-mativi PCB, asi mutengo unodhura kupfuura inoumbwa PCB substrate, uye iyo yakajairika ukobvu i1.6MM.Rudzi urwu rwe substrate rwakakodzerwa akasiyana emagetsi emagetsi mabhodhi, epamusoro-level redunhu mabhodhi, uye anoshandiswa zvakanyanya mumakomputa, midziyo yekutenderera, uye midziyo yekutaurirana.

FR-4

4. Vamwe