Waxa aan inta badan tixraacno waa " FR-4 Guddiga Qalabka PCB ee Heerka Fiber "waa magac kood ah oo loogu talagalay darajada alaabta dabka u adkaysata. Waxay ka dhigan tahay sheyga sheyga ah in walxaha resinku ay tahay inay awoodaan inay is bakhtiiyaan ka dib marka la gubo. Waxaa jira noocyo badan oo ah qalabka darajada FR-4 ee loo isticmaalo looxyada wareegga guud ee hadda, laakiin intooda badan waxay ka samaysan yihiin waxa loogu yeero Tera-Function epoxy resin oo lagu daray filler (Filler) iyo fiber galaas Walxaha isku dhafan ee la sameeyay.
Guddi wareeg ah oo daabacan oo dabacsan (Guddiga Wareegga Daabici kara ee Daabici kara, FPC la soo gaabiyo) waxa kale oo loo yaqaan sabuur wareeg daabacan oo dabacsan, ama sabuur wareeg daabacan oo dabacsan.Looxa wareegtada daabacan ee dabacsan waa badeecad loo qaabeeyey laguna soo saaray substrate dabacsan iyadoo la adeegsanayo daabacaad. 
Waxaa jira laba nooc oo waaweyn oo ka mid ah substrate-ka wareegyada daabacan: Walxaha substrate-ka dabiiciga ah iyo kuwa aan noolaha ahayn, iyo walxaha substrate-ka organic ayaa ah kuwa ugu isticmaalka badan.Substrate-yada PCB-ga loo isticmaalo way kala duwan yihiin lakabyo kala duwan.Tusaale ahaan, 3 ilaa 4 looxyada lakabka ah waxay u baahan yihiin inay isticmaalaan agab isku dhafan oo la sii diyaariyay, iyo looxyada laba-geesoodka ah inta badan waxay adeegsadaan walxaha galaas-epoxy. Markaad dooranayso xaashida, waxaan u baahanahay inaan tixgelinno saameynta SMT Habka isku dhafka elektaroonigga ah ee bilaashka ah ee rasaasta, sababtoo ah kororka heerkulka, heerka foorarsiga guddiga wareegga daabacan marka la kululeeyo waa la kordhiyaa.Sidaa darteed, waxaa loo baahan yahay in la isticmaalo loox leh darajo yar oo foorarsan SMT, sida substrate nooca FR-4.
Maadaama balaadhinta iyo cadaadiska foosha ee substrate ka dib kuleylku ay saameeyaan qaybaha, waxay keeni doontaa in korantadu ay ka baxdo oo ay yareyso kalsoonida.Sidaa darteed, isugeynta balaadhinta walxaha waa in fiiro gaar ah loo yeesho marka la dooranayo walxaha, gaar ahaan marka qaybtu ka weyn tahay 3.2 × 1.6mm.PCB ee loo isticmaalo tikniyoolajiyada isu imaatinka dusha sare waxay u baahan tahay kuleylka kuleylka sare, iska caabinta kulaylka aad u fiican (150 ℃, 60min) iyo alxanka (260 ℃, 10s), xoogga xabagta bireed ee naxaasta ah (1.5 × 104Pa ama ka badan) iyo xoog foorarsiga (25 × 104Pa), conductivity sare iyo dielectric yar joogto ah, punchability wanaagsan (sax ± 0.02mm) iyo waafaqsan yihiin wakiilada nadiifinta, marka lagu daro, muuqaalka ayaa loo baahan yahay si siman oo siman, iyada oo aan warping, dildilaaca, nabarrada iyo dhibco miridhku, iwm. 
Xulashada dhumucda PCB Dhumucdiisuna waxay tahay 0.5mm, 0.7mm, 0.8mm, 1mm, 1.5mm, 1.6mm, (1.8mm), 2.7mm, (3.0mm), 3.2mm, 4.0mm, 6.4mm, kuwaas oo 0.7. mm iyo 1.5 PCB oo leh dhumucdiisuna tahay mm waxa loo isticmaalaa naqshadaynta looxa laba-geesoodka ah ee faraha dahabka ah, iyo 1.8mm iyo 3.0mm waa cabbirro aan caadi ahayn. Marka laga eego dhinaca wax soo saarka, cabbirka guddiga wareegga daabacan waa inuusan ka yarayn 250 × 200mm, cabbirka ugu habboonna waa guud ahaan (250 ~ 350mm) × (200 × 250mm).PCB-yada leh dhinacyo dhaadheer oo ka yar 125mm ama dhinacyo ballaadhan oo ka yar 100mm, fudud Isticmaalka habka jigsaw. Tiknoolajiyada buurta dusha sare waxay qeexaysaa qadarka foorarsiga ee substrate leh dhumucdiisuna tahay 1.6mm sida bogga sare ee ≤0.5mm iyo bogga hoose ≤1.2mm 
English en 
