Iibhodi zeesekethe zeCeramic ngokwenyani zenziwe ngezinto zombane ze-ceramic kwaye zingenziwa kwiimilo ezahlukeneyo.Phakathi kwabo, ibhodi yesekethe ye-ceramic ineempawu ezibalaseleyo zokumelana nokushisa okuphezulu kunye nokufakelwa kombane ophezulu.Inenzuzo ye-dielectric ephantsi rhoqo, ilahleko ye-dielectric ephantsi, i-conductivity ephezulu ye-thermal, ukuzinza okuhle kweekhemikhali, kunye ne-coefficients yokwandisa i-thermal efanayo yamacandelo.Iibhodi zeesekethe eziprintiweyo zeCeramic ziveliswa kusetyenziswa i-laser ye-laser quick activation metallization technology LAM technology.Isetyenziswa kwintsimi ye-LED, iimodyuli ze-semiconductor ezinamandla aphezulu, ii-semiconductor coolers, izifudumezi zombane, iisekethe zokulawula amandla, iisekethe ze-hybrid zamandla, izixhobo zamandla ezihlakaniphile, ukuhanjiswa kwamandla aphezulu, ukuhanjiswa kwelizwe eliqinileyo, i-automotive electronics, unxibelelwano, i-aerospace kunye ne-elektroniki yomkhosi. amacandelo.

Yahlukile kwimveli I-FR-4 (ifayibha yeglasi) , izinto ze-ceramic zinomsebenzi omhle we-high-frequency kunye neempawu zombane, kunye ne-conductivity ephezulu ye-thermal, ukuzinza kweekhemikhali kunye nokuzinza kwe-thermal.Izixhobo zokupakisha ezifanelekileyo zokuveliswa kweesekethe ezinkulu ezidibeneyo kunye neemodyuli ze-elektroniki zamandla.

Iingenelo eziphambili:
1. I-thermal conductivity ephezulu
2. Ukuthelekisa ngakumbi i-coefficient yokwandiswa kwe-thermal
3. Ibhodi yesekethe enzima, esezantsi yokuxhathisa ifilimu ye-alumina ceramic
4. I-solderability yezinto ezisisiseko zilungile, kwaye ukushisa kokusetyenziswa kuphezulu.
5. Ukugquma kakuhle
6. Ilahleko yefrikhwensi ephantsi
7. Hlanganisa ngoxinaniso oluphezulu
8. Ayinazithako zezinto eziphilayo, iyamelana nemitha ye-cosmic, inokuthembeka okuphezulu kwi-aerospace kunye ne-aerospace, kwaye inobomi benkonzo ende.
9. Uluhlu lobhedu aluqukethe i-oxide layer kwaye ingasetyenziselwa ixesha elide kwindawo yokunciphisa.

Iinzuzo zobugcisa

Intshayelelo kwinkqubo yokwenziwa kweceramic eprintiweyo ibhodi yesekethe iteknoloji-hole punching

Ngokuphuhliswa kweemveliso ze-elektroniki zamandla aphezulu kwicala le-miniaturization kunye nesantya esiphezulu, i-FR-4 yendabuko, i-aluminium substrate kunye nezinye izinto ze-substrate azisafanelekanga kuphuhliso lwamandla aphezulu kunye namandla aphezulu.

Ngenkqubela phambili yesayensi kunye nobuchwepheshe, ukusetyenziswa okukrelekrele koshishino lwePCB.Ubuchwephesha be-LTCC bendabuko kunye ne-DBC ngokuthe ngcembe bathatyathelwa indawo yi-DPC kunye ne-LAM technologies.Ithekhnoloji ye-laser emelwe yi-LAM iteknoloji ihambelana ngakumbi nokuphuhliswa koqhagamshelwano oluphezulu kunye nokulunga kweebhodi zeesekethe eziprintiweyo.Ukugrumba ngeLaser sisiphelo sangaphambili kunye neteknoloji yokomba eqhelekileyo kushishino lwePCB.Itekhnoloji iyasebenza, iyakhawuleza, ichanekile, kwaye inexabiso eliphezulu lesicelo.

Ibhodi yesekethe yeRayMingceramic yenziwe ngeteknoloji ye-laser yokuvula i-metalization ngokukhawuleza.Amandla okudibanisa phakathi komgangatho wetsimbi kunye ne-ceramic iphezulu, iimpawu zombane zilungile, kwaye i-welding inokuphinda iphindwe.Ubuninzi bomgca wensimbi bunokulungelelaniswa kuluhlu lwe-1μm-1mm, olunokufikelela kwisisombululo se-L / S.I-20μm, inokudityaniswa ngokuthe ngqo ukubonelela ngezisombululo ezilungiselelwe abathengi

I-excitation ye-lateral ye-laser ye-CO2 ye-atmospheric iphuhliswa yinkampani yaseKhanada.Xa kuthelekiswa neelasesi zemveli, amandla aphumayo aphakame kangangekhulu ukuya kwiwaka lamaxesha, kwaye kulula ukuwenza.

Kwi-spectrum ye-electromagnetic, i-frequency yerediyo ikuluhlu lwamaza e-105-109 Hz.Ngophuhliso lwetekhnoloji yomkhosi kunye ne-aerospace, i-frequency yesibini iyakhutshwa.Amandla aphantsi naphakathi e-RF CO2 lasers anentsebenzo egqwesileyo yokumodareyitha, amandla azinzileyo kunye nokuthembeka okuphezulu kokusebenza.Iimpawu ezifana nobomi obude.I-UV eqinileyo ye-YAG isetyenziswa kakhulu kwiiplastiki kunye nesinyithi kwishishini le-microelectronics.Nangona inkqubo ye-CO2 yokugaya i-laser inzima kakhulu, umphumo wemveliso we-micro-aperture ungcono kune-UV eqinile ye-YAG, kodwa i-CO2 laser ineenzuzo zokusebenza okuphezulu kunye nokubetha ngesantya esiphezulu.Isabelo semarike yePCB laser micro-hole processing inokuba yilaser yasekhaya yokwenziwa komngxuma omncinci isaphuhliswa Kweli nqanaba, azikho iinkampani ezininzi ezinokufaka kwimveliso.

Ukwenziwa kwelaser microvia yasekhaya kusekwinqanaba lophuhliso.I-pulse emfutshane kunye ne-laser yamandla aphezulu aphezulu asetyenziselwa ukugrumba imingxuma kwi-PCB substrates ukuphumeza amandla aphezulu, ukususwa kwezinto kunye nokubunjwa kwemingxuma emincinci.I-Ablation ihlukaniswe ibe yi-photothermal ablation kunye ne-photochemical ablation.Ifotothermal ablation ibhekiselele ekugqityweni kwenkqubo yokwenziwa komngxuma ngokufunxwa ngokukhawuleza kokukhanya kwelaser ene-eneji eninzi nge-substrate material.I-Photochemical ablation ibhekisela ekudityanisweni kwamandla e-photon aphezulu kwingingqi ye-ultraviolet edlula i-2 eV electron volts kunye ne-laser wavelength edlula i-400 nm.Inkqubo yokuvelisa inokutshabalalisa ngokufanelekileyo iintambo ze-molecular ezinde zezinto eziphilayo ukuze zenze iincinci ezincinci, kwaye iinqununu ziyakwazi ukwenza ngokukhawuleza i-micropores phantsi kwesenzo samandla angaphandle.

Namhlanje, itekhnoloji yaseTshayina yokomba i-laser inamava athile kunye nenkqubela phambili yetekhnoloji.Xa kuthelekiswa netekhnoloji yesitampu yemveli, itekhnoloji yokomba i-laser inokuchaneka okuphezulu, isantya esiphezulu, ukusebenza kakuhle okuphezulu, ukubethelwa kwebhetshi enkulu, efanelekileyo kwezona zinto zithambileyo nezinzima, ngaphandle kokulahleka kwezixhobo, kunye nokuveliswa kwenkunkuma.Iingenelo zezinto ezincinci, ukukhuselwa kwendalo kwaye akukho ngcoliseko.

Ibhodi yesekethe ye-ceramic ngenkqubo yokugaya i-laser, amandla okudibanisa phakathi kwe-ceramic kunye nentsimbi iphezulu, ayiwi, igwebu, njl. 0.3 micron, laser ukubetha umngxuma ububanzi ukusuka 0.15 mm ukuya 0.5 mm, okanye nokuba 0.06 mm.


Ukwenziwa kwebhodi yesekethe yeCeramic

I-foil yobhedu eseleyo kumaleko angaphandle ebhodi yesekethe, oko kukuthi, ipateni yesekethe, ifakwe ngaphambili kunye ne-lead-tin resistant, kwaye ke inxalenye engakhuselekanga engeyo-conductor yobhedu ifakwe ngokwekhemikhali ukwenza isiphaluka.

Ngokweendlela ezahlukeneyo zenkqubo, i-etching yahlulwe ibe yi-etching yangaphakathi kunye ne-etching yangaphandle.I-inner layer etching i-acid etching, ifilimu emanzi okanye ifilimu eyomileyo m isetyenziselwa ukuchasana;i-layer etching yangaphandle yi-alkaline etching, kunye ne-tin-lead isetyenziswa njengento yokuxhathisa.Ummeli.

Umgaqo osisiseko we-etching reaction

1. I-Alkalization ye-asidi yobhedu yekloride


I-1, i-Acidic copper chloride alkalization

Ukungakhuseleki: Inxalenye yefilimu eyomileyo engakhange ifakwe kwimisebe ye-ultraviolet ichithwa yi-alkaline ebuthakathaka ye-alkaline carbonate, kwaye inxalenye ye-irradiated ihleli.

Etching: Ngokomlinganiselo othile wesisombululo, indawo yobhedu evezwe ngokunyibilikisa ifilimu eyomileyo okanye ifilimu emanzi iyachithwa kwaye igxininiswe ngesisombululo se-acid copper chloride etching.

Ifilimu ephumayo: Ifilimu ekhuselayo kumgca wokuvelisa inyibilika kwinqanaba elithile lobushushu kunye nesantya.

I-Acidic copper chloride catalyst ineempawu zolawulo olulula lwesantya sokukrola, ukusebenza kakuhle kobhedu, umgangatho olungileyo, kunye nokulula ukubuyiswa kwesisombululo se-etching.

2. I-alkaline etching



Ukufakwa kwealkaline

Ifilimu ephumayo: Sebenzisa ulwelo lwe-meringue ukususa ifilimu kwifilimu, ukuveza ubhedu obungalungiswanga.

Etching: Umaleko ongezantsi ongadingekiyo uxhonywe kunye ne-etchant yokususa ubhedu, ushiya imigca eshinyeneyo.Phakathi kwazo, izixhobo ezincedisayo ziya kusetyenziswa.I-accelerator isetyenziselwa ukukhuthaza ukusabela kwe-oxidation kunye nokuthintela imvula ye-cuprous ion;isixhobo sokugxotha izinambuzane sisetyenziselwa ukunciphisa ukhukuliseko olusecaleni;i-inhibitor isetyenziselwa ukuvimbela ukusabalalisa kwe-ammonia, ukuchithwa kobhedu, kunye nokukhawuleza i-oxidation yobhedu.

I-emulsion entsha: Sebenzisa i-monohydrate ammonia amanzi ngaphandle kweeoni zobhedu ukususa intsalela kwiplate ngesisombululo se-ammonium chloride.

Umngxuma ogcweleyo: Le nkqubo ifanelekile kuphela kwinkqubo yokuntywiliselwa kwegolide.Susa ubukhulu becala iiyoni zepalladium ezigqithileyo kwizinto ezingafakwanga kwimingxunya ukunqanda iiyoni zegolide ekuzikeni kwinkqubo yemvula yegolide.

Ukuxobula itoti: I-tin-lead layer isuswa ngokusebenzisa isisombululo se-nitric acid.

Iziphumo ezine zokurhweba

1. Isiphumo sephuli
Ngethuba lenkqubo yokuvelisa i-etching, i-liquid iya kwenza ifilimu yamanzi ebhodini ngenxa ye-gravity, ngaloo ndlela ikhusela ulwelo olutsha ukuba ludibanise nobhedu.




2. Impembelelo yeGroove
Ukubambelela kwisisombululo sekhemikhali kubangela ukuba isisombululo seekhemikhali sibambelele kwisithuba phakathi kombhobho kunye nombhobho, okuya kubangela umlinganiselo ohlukeneyo wokudibanisa kwindawo exineneyo, kunye nommandla ovulekileyo.




3. Isiphumo sokupasa
Iyeza lolwelo liqukuqela lisihla ngomngxuma, elonyusa isantya sohlaziyo lweyeza ezingamanzi elijikeleze umngxuma wepleyiti ngexesha lenkqubo yokukrola, kwaye inani le-etching liyanda.




4. Isiphumo sokujinga umlomo wombhobho
Umgca ohambelana necala lokujingisa lombhobho, kuba iyeza elitsha lolwelo linokuchitha ngokulula iyeza lolwelo phakathi kwemigca, iyeza lolwelo lihlaziywa ngokukhawuleza, kwaye ubungakanani be-etching bukhulu;

Umgca perpendicular ukuya ujingi ulwalathiso umlomo wombhobho, ngenxa yokuba ulwelo imichiza emitsha akukho lula ukutshabalalisa iyeza elulwelo phakathi kwemigca, iyeza elulwelo lihlaziywa ngesantya esiphantsi, kwaye isixa etching lincinci.




Iingxaki eziqhelekileyo kwimveliso ye-etching kunye neendlela zokuphucula

1. Imuvi ayinasiphelo
Ngenxa yokuba ukuxinwa kwesiraphu kuphantsi kakhulu;isantya somgca sikhawuleza kakhulu;ukuvala umlomo kunye nezinye iingxaki ziya kubangela ukuba ifilimu ingapheli.Ngoko ke, kuyimfuneko ukujonga ukuxinwa kwesiraphu kwaye ulungelelanise ukuxinwa kwesiraphu kuluhlu olufanelekileyo;lungisa isantya kunye neeparamitha ngexesha;uze ucoce umbhobho.

2. Umphezulu webhodi i-oxidized
Ngenxa yokuba i-concentration ye-syrup iphezulu kakhulu kwaye iqondo lokushisa liphezulu kakhulu, liya kubangela ukuba umphezulu webhodi ube ne-oxidize.Ngoko ke, kuyimfuneko ukulungelelanisa ukugxininiswa kunye nokushisa kwesiraphu ngexesha.

3. IThetecopper ayigqitywanga
Ngenxa yokuba isantya etching ikhawuleza kakhulu;ukubunjwa kwesiraphu kuxhomekeke;umphezulu wobhedu ungcolile;umlomo uvaliwe;ubushushu buphantsi kwaye ubhedu alugqitywanga.Ngoko ke, kuyimfuneko ukulungelelanisa isantya sokuhambisa i-etching;jonga kwakhona ukubunjwa kwesiraphu;kulumkele ukungcoliseka kobhedu;coca umbhobho ukukhusela ukuvala;lungisa ubushushu.

4. Ubhedu lwe-etching luphezulu kakhulu
Ngenxa yokuba umatshini uhamba kancinci, iqondo lobushushu liphezulu kakhulu, njl.Ngoko ke, amanyathelo afana nokulungelelanisa isantya somatshini kunye nokulungelelanisa ukushisa kufuneka kuthathwe.