Ukutsha kwezinto, okukwaziwa ngokuba yi-flame retardancy, ukuzicima, ukumelana nomlilo, ukumelana nomlilo, ukumelana nomlilo, ukutsha kunye nokunye ukutsha, kukuvavanya amandla ezinto eziphathekayo ukuxhathisa ukutsha.

Isampuli yezinto ezinokutsha zivutha ngumlilo ohlangabezana neemfuno, kwaye ilangatye liyasuswa emva kwexesha elichaziweyo.Inqanaba lokutsha livavanywa ngokweqondo lokutsha kwesampulu.Kukho amanqanaba amathathu.Indlela yokuvavanya ethe tye yesampulu ihlulwe kwi-FH1, FH2, i-FH3 inqanaba lesithathu, indlela yokuvavanya ngokuthe nkqo ihlukaniswe kwi-FV0, FV1, VF2.
Okuqinileyo ibhodi PCB yahlulwe kwibhodi HB kunye V0 ibhodi.

Iphepha le-HB linedangatye eliphantsi kwaye lisetyenziswa kakhulu kwiibhodi ezicalanye.Ibhodi ye-VO inedangatye eliphezulu lokulibaziseka.Isetyenziswa kakhulu kwiibhodi eziphindwe kabini kunye neebhodi ezininzi ezihlangabezana neemfuno zokulinganisa umlilo we-V-1.Olu hlobo lwebhodi yePCB iba yibhodi yeFR-4.I-V-0, i-V-1, kunye ne-V-2 ngamabakala angangeni emlilweni.

Ibhodi yesekethe kufuneka ikwazi ukumelana nomlilo, ayikwazi ukutshisa kwiqondo lokushisa elithile, kodwa inokuthamba kuphela.Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition yeqondo lobushushu (inqaku leTg), kwaye eli xabiso linxulumene nozinzo lwedimensional yebhodi yePCB.

Yintoni ibhodi yesekethe yeTg PCB ephezulu kunye neenzuzo zokusebenzisa i-Tg PCB ephezulu?
Xa ubushushu bebhodi eprintiweyo ye-Tg ephakamileyo iphakama kwindawo ethile, i-substrate iya kutshintsha ukusuka "kwi-glass state" ukuya kwi "rubber state".Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition temperature (Tg) yebhodi.Ngamanye amazwi, i-Tg lelona qondo lobushushu liphezulu apho i-substrate igcina ukuqina.

Zeziphi iintlobo ezithile iibhodi PCB?
Yahlulwe ngokwenqanaba ukusuka ezantsi ukuya phezulu ngolu hlobo lulandelayo:

94HB - 94VO - 22F - CEM-1 Ikhadibhodi ye-flame retardant (i-mold Punching) 22F: Ibhodi ye-fiberglass enecala elinye icala elinye (i-die punching) CEM-1: Ibhodi ye-fiberglass enecala elinye (kufuneka igrunjwe ngekhompyutha, ingafi ukubethelwa) CEM-3: Ibhodi yefiberglass enamacala amabini ( ngaphandle kwekhadibhodi enamacala amabini yeyona nto inesiphelo esisezantsi kwiibhodi ezinamacala amabini.

I-FR-4: Ibhodi ye-fiberglass enamacala amabini

Ibhodi yesekethe kufuneka ikwazi ukumelana nomlilo, ayikwazi ukutshisa kwiqondo lokushisa elithile, kodwa inokuthamba kuphela.Iqondo lobushushu ngeli xesha libizwa ngokuba yi-glass transition yeqondo lobushushu (inqaku leTg), kwaye eli xabiso linxulumene nozinzo lwedimensional yebhodi yePCB.

Yintoni ibhodi yesekethe yeTg PCB ephezulu kunye neenzuzo zokusebenzisa i-Tg PCB ephezulu

Xa iqondo lokushisa liphakama kwindawo ethile, i-substrate iya kutshintsha ukusuka "kwiglasi" ukuya kwi "rubbery", kwaye iqondo lokushisa ngeli xesha libizwa ngokuba yi-glass transition temperature (Tg) yeplate.Ngamanye amazwi, i-Tg lelona qondo lobushushu liphezulu (°C) apho i-substrate igcina ukuqina.

Oko kukuthi, izinto eziqhelekileyo ze-substrate ze-PCB azivelisi kuphela ukuthambisa, ukuguqulwa, ukunyibilika kunye nezinye izinto kumaqondo aphezulu, kodwa zibonisa ukwehla okubukhali kwimpawu zoomatshini kunye nombane (ndicinga ukuba awufuni ukubona ukuhlelwa kweebhodi zePCB. kwaye ubone le meko kwiimveliso zakho. ).

Ipleyiti ye-Tg ngokubanzi ingaphezulu kwe-130 degrees, i-Tg ephakamileyo idla ngokungaphezulu kwe-170 degrees, kwaye i-Tg ephakathi imalunga ne-150 degrees.

Ngokuqhelekileyo iibhodi eziprintiweyo ze-PCB ezine-Tg ≥ 170 ° C zibizwa ngokuba ziibhodi eziprintiweyo eziphezulu zeTg.Njengoko i-Tg ye-substrate iyanda, ukuchasana nokushisa, ukunyanzeliswa komswakama, ukuchasana kweekhemikhali, ukuzinza kunye nezinye iimpawu zebhodi eprintiweyo ziya kuphuculwa kwaye ziphuculwe.Ukuphakama kwexabiso le-TG, bhetele ukumelana nokushisa kwebhodi, ngokukodwa kwinkqubo yokukhokela, apho izicelo eziphezulu ze-Tg zixhaphake kakhulu.

I-Tg ephezulu ibhekisela ekuxhathiseni ukushisa okuphezulu.Ngophuhliso olukhawulezayo lweshishini lombane, ngakumbi iimveliso ze-elektroniki ezimelwe ziikhompyuter, uphuhliso lwentsebenzo ephezulu kunye ne-multilayers ephezulu ifuna ukuxhathisa ubushushu obuphezulu bezinto ezincinci ze-PCB njengesiqinisekiso esibalulekileyo.Ukuvela kunye nophuhliso lobuchwepheshe obuphezulu obuphezulu obumelwe yi-SMT kunye ne-CMT buye benza ii-PCBs ngakumbi kwaye zahluke kakhulu kwinkxaso yokumelana nobushushu obuphezulu be-substrates ngokubhekiselele kwi-aperture encinci, i-wiring emihle, kunye nokunciphisa.

Ngoko ke, umahluko phakathi kwe-FR-4 jikelele kunye ne-Tg FR-4 ephezulu: ikwimeko eshushu, ngakumbi emva kokufunxa umswakama.
Ngaphantsi kobushushu, kukho ukungafani kumandla omatshini, ukuzinza kwe-dimensional, i-adhesion, i-absorption yamanzi, ukuchithwa kwe-thermal, kunye nokwandiswa kwe-thermal yezinto.Iimveliso ze-Tg eziphakamileyo ngokucacileyo zingcono kunezixhobo eziqhelekileyo ze-PCB substrate.Kwiminyaka yakutshanje, inani labathengi abafuna ukuveliswa kweebhodi eziphezulu zeTg eziprintiweyo liye landa unyaka nonyaka.

Ngophuhliso kunye nenkqubela phambili yobuchwepheshe be-elektroniki, iimfuno ezintsha zihlala zibekwe phambili kwizinto eziprintiweyo zebhodi yesekethe ye-substrate, ngaloo ndlela kukhuthazwa uphuhliso oluqhubekayo lwemigangatho yobhedu ye-laminate.Okwangoku, imigangatho ephambili yezinto ze-substrate zilandelayo.

① ImiGangatho yeSizwe Okwangoku, imigangatho yelizwe lam yokuhlelwa kwezixhobo ze-PCB kwizinto ze-substrate ziquka i-GB/T4721-47221992 kunye ne-GB4723-4725-1992.Umgangatho we-copper clad laminate eTaiwan, eChina ngumgangatho we-CNS, osekelwe kumgangatho we-JIs yaseJapan., Yakhutshwa ngowe-1983.
②Eminye imigangatho yelizwe iquka: imigangatho ye-JIS yaseJapan, i-ASTM yaseMelika, i-NEMA, i-MIL, i-IPc, i-ANSI, imigangatho ye-UL, imigangatho ye-Bs yaseBritani, imigangatho ye-DIN yaseJamani kunye ne-VDE, imigangatho ye-NFC yaseFransi kunye ne-UTE, kunye neMigangatho ye-CSA yaseCanada, imigangatho ye-AS e-Australia, i-FOCT imigangatho kwindawo eyayisakuba yiSoviet Union, imigangatho ye-IEC yamazwe ngamazwe, njl.

Ababoneleli bezinto zokuqala zoyilo zePCB zixhaphakile kwaye zisetyenziswa ngokuqhelekileyo: Shengyi \ Jiantao \ International, njl.

● Amaxwebhu amkelweyo: i-protel autocad powerpcb orcad gerber okanye ibhodi yekopi yebhodi yokwenene, njl.

● Iintlobo zebhodi: CEM-1, CEM -3 FR4, izinto eziphezulu zeTG;

● Ubungakanani bebhodi enkulu: 600mm * 700mm (24000mil * 27500mil)

● Ubukhulu bebhodi yokulungisa: 0.4mm-4.0mm (15.75mil-157.5mil)

● Amanqanaba aphezulu okusebenza: I-16Layers

● Umaleko wefoyile yobhedu Ukutyeba: 0.5-4.0 (oz)

● Ukunyamezela ubukhulu bebhodi egqityiweyo: +/-0.1mm (4mil)

● Ukwenza ukunyamezela kwedimension: ukugaya ikhompyutha: 0.15mm (6mil) Die punching plate: 0.10mm (4mil)

● Ubuncinane bobubanzi bomgca/isithuba :0.1mm(4mil) isakhono sokulawula ububanzi bomgca: <+-20%

● Ubuncinane bomngxuma wokugrumba idayamitha yemveliso egqityiweyo: 0.25mm (10mil) Ubuncinane bomngxuma wokugqobhoza idayamitha yemveliso egqityiweyo: 0.9mm (35mil) Ukunyamezela kwedayamitha yomngxuma ogqityiweyo: PTH: +-0.075mm( 3mil) NPTH : +-0.05mm(2mil)

● Umngxuma ogqitywe ukutyeba kobhedu: 18-25um (0.71-0.99mil)

● Ubuncinane besithuba sesithuba se-SMT: 0.15mm (6mil)

● Ukugquma komhlaba: igolide yokucwiliswa kweekhemikhali, isitshizi se-tin , Ibhodi yonke i-nickel-plated gold (amanzi / igolide ethambileyo), i-silk screen blue glue, njl.

● Ubukhulu bemaski yeSolder ebhodini: 10-30μm (0.4-1.2mil)

● Amandla okuxobula: 1.5N/mm (59N/mil)

● Ukumelana nokuqina kwefilimu ye-Solder: > 5H

● Iplagi yokuxhathisa iplagi umthamo womngxuma: 0.3-0.8mm (12mil-30mil)

● I-Dielectric engatshintshiyo: ε = 2.1-10.0

● Ukuxhatshazwa kwe-insulation: 10KΩ-20MΩ

● Ukuphazamiseka kophawu: 60 ohm±10%

● Ukothuso lobushushu : 288℃, 10 sec

● I-Warpage yebhodi egqityiweyo: <0.7%

● Ukusetyenziswa kwemveliso: izixhobo zonxibelelwano, i-automotive electronics, i-instrumentation, inkqubo yokumisa ihlabathi, ikhompyutha, i-MP4, umbane, izixhobo zasekhaya, njl.

Ngokwezixhobo zokuqinisa ibhodi yePCB, yahlulwe ngokubanzi kwezi ntlobo zilandelayo:
1. Phenolic PCB iphepha substrate
Ngenxa yokuba olu hlobo lwebhodi ye-PCB yenziwe nge-pulp yephepha, i-pulp yomthi, njl., ngamanye amaxesha iba yikhadibhodi, ibhodi ye-V0, ibhodi ye-flame-retardant kunye ne-94HB, njl. yenziwe ngoxinzelelo lwe-phenolic resin.ipleyiti.Olu hlobo lwesubstrate yephepha ayinamlilo, inokubethelwa ngenqindi, inexabiso eliphantsi, ixabiso eliphantsi, kunye noxinano oluphantsi.Sihlala sibona i-phenolic paper substrates ezifana ne-XPC, FR-1, FR-2, FE-3, njl. Kwaye i-94V0 yeyamaphepha e-flame-retardant paperboard, engenamlilo.

2. Inxalenye yePCB ehlanganisiweyo
Olu hlobo lwebhodi yomgubo ikwabizwa ngokuba yibhodi yomgubo, kunye nephepha lefiber yenkuni okanye iphepha lomqhaphu lefiber njengemathiriyeli yokuqinisa, kunye nelaphu leglasi yefayibha njengesixhobo sokuqinisa umphezulu ngaxeshanye.Ezi zinto zimbini zenziwe nge-epoxy-retardant epoxy resin.Kukho icala elinye isiqingatha-iglasi ifayibha 22F, CEM-1 kunye kabini-macala isiqingatha-iglasi ifayibha ibhodi CEM-3, phakathi apho CEM-1 kunye CEM-3 zezona zixhaphakileyo isiseko ezidityanisiweyo laminates ubhedu clad.

3. I-Glass fiber PCB substrate
Ngamanye amaxesha iphinda ibe yibhodi ye-epoxy, i-glass fiberboard, i-FR4, i-fiber board, njl. Isebenzisa i-epoxy resin njenge-adhesive kunye ne-glass fiber cloth njengento yokuqinisa.Olu hlobo lwebhodi yesiphaluka lunobushushu obuphezulu bokusebenza kwaye aluchaphazeli ngokusingqongileyo.Olu hlobo lwebhodi luhlala lusetyenziswa kwi-PCB enamacala amabini, kodwa ixabiso libiza kakhulu kune-substrate ye-PCB edibeneyo, kwaye ubukhulu obuqhelekileyo yi-1.6MM.Olu hlobo lwe-substrate lufanelekile kwiibhodi zonikezelo lwamandla ezahlukeneyo, iibhodi zesekethe ezikwinqanaba eliphezulu, kwaye zisetyenziswa kakhulu kwiikhompyuter, izixhobo zeperipheral, kunye nezixhobo zonxibelelwano.

FR-4

4. Abanye