ibhodi HDI , uqhagamshelwano oluphezulu ibhodi yesekethe eprintiweyo
Iibhodi zeHDI zezinye zetekhnoloji ezikhula ngokukhawuleza kwiiPCB kwaye ngoku ziyafumaneka kwi-ABIS Circuits Ltd.
Iibhodi ze-HDI ziqulethe ii-vias ezingaboniyo kunye / okanye ezingcwatywe, kwaye zihlala ziqulethe i-microvias ye-0.006 okanye i-diameter encinci.Banoxinzelelo lwesekethe ephezulu kuneebhodi zesekethe zemveli.
Kukho iintlobo ezi-6 ezahlukeneyo ze Iibhodi ze-HDI PCB , ukusuka kumphezulu ukuya kumphezulu ngokusebenzisa imingxunya, kunye nemingxuma engcwatyiweyo kunye nemingxuma, iileya ezimbini okanye ngaphezulu ze-HDI ezinemingxuma, i-substrates e-passive ngaphandle koqhagamshelo lombane, usebenzisa izibini zomaleko Isakhiwo esitshintshanayo sesakhiwo esingenasiphelo kunye nesakhiwo esingenasiphelo sisebenzisa izibini zomaleko.
Ibhodi yesekethe eprintiweyo enobuchwepheshe be-HDI Itekhnoloji eqhutywa ngabathengi I-in-pad ngenkqubo ixhasa itekhnoloji eninzi kumaleko ambalwa, ebonisa ukuba inkulu ayisoloko ingcono.Ukusukela ngasekupheleni kweminyaka yoo-1980, siye sabona iikhamkhoda zisebenzisa iikhatriji ze-inki ezinobungakanani, zishwabene ukuze zilingane intende yesandla sakho.Ikhompyuter ephathwayo kunye nokusebenza ekhaya kunetekhnoloji eqhubela phambili, okwenza iikhompyuter zikhawuleze kwaye zibe khaphukhaphu, zivumela abathengi ukuba basebenze bekude naphi na. Ubuchwephesha beHDI sesona sizathu solu tshintsho.Imveliso inemisebenzi emininzi, ubunzima obulula kunye nomthamo omncinci.Izixhobo ezikhethekileyo, izixhobo ezincinci kunye nezixhobo ezincinci zenza ukuba iimveliso ze-elektroniki zicuthe ngobukhulu ngelixa zisandisa iteknoloji, umgangatho kunye nesantya. Vias kwinkqubo pad Impefumlelo evela kwitekhnoloji yokunyuka komphezulu ngasekupheleni kweminyaka yoo-1980 ityhale imida ye-BGA, COB, kunye ne-CSP ukuya kwi-intshi encinci yesikwere.I-in-pad ngenkqubo ivumela i-vias ukuba ibekwe kumphezulu we-flat pad.Imingxunya edlulayo ifakwe kwaye izaliswe nge-epoxy eqhubayo okanye engaqhubekiyo, emva koko igqunywe kwaye ihlanganiswe ukuze ingabonakali. Ivakala ilula, kodwa ithatha umyinge wamanyathelo ongezelelweyo asibhozo ukugqiba le nkqubo ikhethekileyo.Izixhobo zobuchwephesha kunye neengcali eziqeqeshwe kakuhle zinika ingqwalasela enkulu kwinkqubo yokufezekisa efihliweyo ngokugqibeleleyo ngemingxuma. Ngendlela yokuzalisa Kukho iintlobo ezininzi zezixhobo zokuzaliswa komngxuma: i-epoxy engaqhubekiyo, i-epoxy conductive, i-copper-filled, i-silver-filled, kunye ne-electrochemical plating.Oku kuya kubangela imingxunya engcwatywe kumhlaba othe tyaba ukuba ithengiswe ngokupheleleyo kumhlaba wesiqhelo.Ukugrumba, ukungaboni okanye ukungcwatywa kwe-vias, ukuzaliswa, ukubethelwa kunye nokufihla phantsi kwee-SMT pads.Ukucutshungulwa kolu hlobo lomngxuma kufuna izixhobo ezikhethekileyo kwaye kuthatha ixesha.Imijikelo yokomba emininzi kunye nobunzulu obulawulwayo bokomba bonyusa ixesha lokuqhuba. I-HDI eyonga iindleko Nangona ubungakanani bezinye iimveliso zabathengi bunciphile, umgangatho useyeyona nto ibalulekileyo yabathengi emva kwexabiso.Ukusebenzisa iteknoloji ye-HDI kuyilo, i-8-layer ngokusebenzisa-umngxuma PCB inokuncitshiswa ibe yi-4-layer HDI micro-hole technology package PCB.Ikhono locingo lwe-PCB eyilwe kakuhle ye-HDI ye-4-layer inokufezekisa imisebenzi efanayo okanye engcono njengomgangatho we-8-layer PCB. Nangona inkqubo ye-microvia inyusa iindleko ze-HDI PCB, uyilo olufanelekileyo kunye nokunciphisa inani leeleya kunokunciphisa kakhulu iindleko zee-intshi zesikwere zezinto kunye nenani leeleya. Yakha iibhodi ze-HDI ezingaqhelekanga Ukwenziwa ngempumelelo kwe-HDI PCB kufuna izixhobo ezikhethekileyo kunye neenkqubo, ezifana nokubhola kwelaser, ukuplaga, umfanekiso othe ngqo we-laser, kunye nemijikelo eqhubekayo yokulahla.Umgca webhodi we-HDI uncinci, isithuba sincinci, i-ring iyaqina, kwaye kusetyenziswe izinto ezikhethekileyo ezinqabileyo.Ukuze uvelise ngempumelelo olu hlobo lwebhodi, ixesha elongezelelweyo kunye notyalo-mali olukhulu kwiinkqubo zokuvelisa kunye nezixhobo ezifunekayo. Itekhnoloji yokomba iLaser Ukugrumba eyona mibhobho mincinci incinci ivumela ubuchule obuninzi bokusetyenziswa kumphezulu webhodi yesekethe.Usebenzisa umqadi obubanzi obuziimicrons ezingama-20 (1 mil), lo mqadi unempembelelo ephezulu unokugqobhoza isinyithi kunye neglasi ukuze wenze imingxunya emincinane.Iimveliso ezintsha ziye zavela, ezifana ne-laminates ephantsi-ilahleko kunye nezixhobo zeglasi ezifanayo kunye ne-dielectric constants ephantsi.Ezi zixhobo zinokumelana nokushisa okuphezulu kwindibano engenalo i-lead kwaye zivumela ukusetyenziswa kwemingxuma emincinci. HDI ibhodi lamination kunye nemathiriyeli Itekhnoloji ye-multilayer ephucukileyo ivumela abaqulunqi ukuba bongeze izibini zomaleko ezongezelelweyo ngokulandelelana ukwenza i-PCB ye-multilayer.Ukusebenzisa i-laser drill ukwenza imingxunya kumaleko angaphakathi kuvumela ukucwenga, ukwenza umfanekiso kunye nokukrola ngaphambi kokucinezela.Le nkqubo yokongeza ibizwa ngokuba lulwakhiwo olulandelelanayo.Ukuveliswa kwe-SBU kusebenzisa i-vias ezaliswe ngokupheleleyo ukuvumela ulawulo olungcono lobushushu 
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