Into esihlala sibhekisa kuyo kukuba " I-FR-4 ye-Fiber Class Material PCB Board " ligama lekhowudi yebakala lezinto ezikwazi ukumelana nomlilo. Imele inkcazo yezinto eziphathekayo ukuba i-resin imathiriyeli kufuneka ikwazi ukucima ngokwayo emva kokutshiswa. Ayilogama lezinto eziphathekayo, kodwa luhlobo lwezinto eziphathekayo. Ibakala lezinto eziphathekayo, ngoko ke kukho iintlobo ezininzi zezinto ze-FR-4 zebakala ezisetyenziswa kwiibhodi zeesekethe ngokubanzi ngoku, kodwa ezininzi zazo zenziwe ngento ebizwa ngokuba yi-Tera-Function epoxy resin plus filler (Filler) kunye nefiber yeglasi Izinto ezihlanganisiweyo ezenziweyo.
Ibhodi yesekethe ethambileyo eprintiweyo (Flexible Printed Circuit Board, i-FPC efinyeziweyo) ikwabizwa ngokuba yibhodi yesekethe eguquguqukayo eprintiweyo, okanye ibhodi yesekethe eguquguqukayo eprintiweyo.Ibhodi yesekethe eprintiweyo eguquguqukayo iyimveliso eyilwe kwaye yenziwe kwi-substrate eguquguqukayo ngokuprinta. 
Kukho iintlobo ezimbini eziphambili ze-substrate yebhodi yesekethe eprintiweyo: imathiriyeli ye-organic substrate kunye ne-inorganic substrate imathiriyeli, kunye nezixhobo ze-organic substrate zezona zisetyenziswa kakhulu.I-PCB substrates ezisetyenzisiweyo zahlukile kwiileya ezahlukeneyo.Ngokomzekelo, iibhodi ezi-3 ukuya kwezi-4 kufuneka zisebenzise izinto ezidibeneyo, kunye neebhodi eziphindwe kabini zisebenzisa izinto zeglasi-epoxy. Xa sikhetha iphepha, kufuneka siqwalasele impembelelo ye-SMT Kwinkqubo yendibano ye-elektroniki ekhokelayo, ngenxa yokunyuka kweqondo lokushisa, iqondo lokugoba ibhodi yesiphaluka eprintiweyo xa kushushu kunyuswa.Ngoko ke, kuyimfuneko ukusebenzisa ibhodi eneqondo elincinci lokugoba kwi-SMT, njenge-FR-4 uhlobo lwe-substrate.
Ekubeni ukwanda kunye nokunyanzeliswa kwengcinezelo ye-substrate emva kokufudumala kuchaphazela amacandelo, kuya kubangela ukuba i-electrode ikhuphe kwaye inciphise ukuthembeka.Ngoko ke, i-coefficient yokwandisa izinto kufuneka ihlawulwe ingqalelo xa ukhetha izinto eziphathekayo, ngakumbi xa icandelo likhulu kune-3.2 × 1.6mm.I-PCB esetyenziswa kubuchwephesha bendibano yomphezulu ifuna ukuhanjiswa okuphezulu kwe-thermal, ukumelana nobushushu obugqwesileyo (150 ℃, 60min) kunye ne-solderability (260 ℃, i-10s), ifoyile ephezulu yobhedu yokubambelela amandla (1.5 × 104Pa okanye ngaphezulu) kunye namandla okugoba (25 × 104Pa), i-conductivity ephezulu kunye ne-dielectric encinci, i-punchability enhle (ukuchaneka ± 0.02mm) kunye nokuhambelana nama-agent okucoca, ngaphezu koko, ukubonakala kuyadingeka ukuba kube lula kwaye kube flat, ngaphandle kokulwa, ukuqhekeka, izibazi kunye neendawo zokugqwala, njl. 
Ukukhetha ubukhulu bePCB Ubukhulu bebhodi yesekethe eprintiweyo yi-0.5mm, 0.7mm, 0.8mm, 1mm, 1.5mm, 1.6mm, (1.8mm), 2.7mm, (3.0mm), 3.2mm, 4.0mm, 6.4mm, apho 0.7 mm kunye ne-1.5 I-PCB enobunzima be-mm isetyenziselwa ukuyila iibhodi ezinamacala amabini aneminwe yegolide, kunye ne-1.8mm kunye ne-3.0mm azilinganisi eziqhelekileyo. Ngokombono wemveliso, ubukhulu bebhodi yesekethe eprintiweyo akufanele ibe ngaphantsi kwe-250 × 200mm, kwaye ubungakanani obufanelekileyo ngokuqhelekileyo (250 ~ 350mm) × (200 × 250mm).KwiiPCB ezinamacala amade angaphantsi kwe-125mm okanye amacala abanzi ngaphantsi kwe-100mm, kulula Ukusebenzisa indlela yejigsaw. Itekhnoloji yokunyuka komphezulu ichaza ubungakanani bokugoba kwe-substrate enobunzima obuyi-1.6mm njengephepha eliphezulu lokulwa ≤0.5mm kunye nephepha lemfazwe elisezantsi ≤1.2mm 
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