I-Vias kwibhodi yesekethe zibizwa ngokuba yi-vias, ezahlulwe zibe yimingxuma, imingxuma eyimfama kunye nemingxuma engcwatyiweyo( Ibhodi yeSekethe yeHDI ).Zisetyenziselwa ikakhulu ukudibanisa iingcingo kwiileya ezahlukeneyo zothungelwano olufanayo kwaye azisetyenziswa ngokubanzi njengamacandelo e-soldering;

Iipads kwibhodi yesekethe zibizwa ngokuba yi-pads, ezahlulwe zibe yi-pin pads kunye ne-surface mount pads;iipads pin zinemingxuma solder, ezisetyenziswa ikakhulu amacandelo isikhonkwane soldering;ngelixa iipadi zokunyuswa komphezulu zingenamingxunya ye-solder kwaye zisetyenziselwa ikakhulu ukuthambisa amacandelo entaba yoMphezulu.

I-Via ikakhulu idlala indima yoqhagamshelo lombane, i-aperture ye-via incinci ngokubanzi, ngokuqhelekileyo nje ukuba iteknoloji yokucubungula ibhodi inokuyenza yanele, kwaye umphezulu we-via unokuqatywa nge-inki yemaski ye-solder okanye hayi;ngelixa i-pad ingasetyenziselwa kuphela umbane Indima yokudibanisa, kodwa kunye nendima yokulungiswa komatshini, i-aperture ye-pad (ngokuqinisekileyo ibhekisela kwi-pin pad) kufuneka ibe nkulu ngokwaneleyo ukudlula i-pin yecandelo, ngaphandle koko. iya kubangela iingxaki zemveliso;ukongeza, umphezulu wepadi kufuneka ungabinayo inki ye-Solder imaski, kuba iya kuchaphazela i-soldering, kwaye ngokubanzi umphezulu wepadi ugqunywe nge-flux xa usenza ibhodi;kunye nobubanzi be-pad's aperture (xa ubhekisela kwi-pin pad) kufuneka idibane nento ethile Kungenjalo, akuyi kuchaphazela kuphela i-welding, kodwa kubangele ukuba ufakelo lungazinzi.