Nā papa kaapuni seramika hana maoli ʻia me nā mea uila uila a hiki ke hana ʻia i nā ʻano like ʻole.Ma waena o lākou, ʻo ka ceramic circuit board nā hiʻohiʻona koʻikoʻi loa o ke kūpaʻa wela kiʻekiʻe a me ka insulation uila kiʻekiʻe.Loaʻa iā ia nā pōmaikaʻi o ka haʻahaʻa dielectric mau, haʻahaʻa dielectric nalowale, kiʻekiʻe thermal conductivity, maikaʻi paʻa kemika, a me nā mea like me ka hoʻonui ʻana i ka wela o nā ʻāpana.Hana ʻia nā papa kaapuni paʻi seramika me ka hoʻohana ʻana i ka ʻenehana LAM hoʻōla wikiwiki i ka ʻenehana LAM.Hoʻohana ʻia ma ke kahua LED, nā modula semiconductor mana kiʻekiʻe, nā mea hoʻomaʻamaʻa semiconductor, nā mea hoʻomehana uila, nā kaʻa kaʻa mana, nā kaapuni hybrid mana, nā ʻāpana mana akamai, nā lako mana hoʻololi kiʻekiʻe, nā relays mokuʻāina paʻa, nā uila uila, kamaʻilio, aerospace a me ka uila uila. ʻāpana.

ʻOkoʻa mai ka kuʻuna FR-4 (wili aniani) , Loaʻa nā mea seramika i ka hana kiʻekiʻe kiʻekiʻe a me nā waiwai uila, a me ka conductivity thermal kiʻekiʻe, ke kūpaʻa kemika a me ke kūpaʻa wela.ʻO nā mea hoʻopihapiha kūpono no ka hana ʻana i nā kaʻapuni hoʻohui nui a me nā modula uila mana.

Nā pono nui:
1. ʻOi aku ka nui o ka wela wela
2. ʻOi aku ka nui o ka hoʻonui ʻana i ka wela
3. A paakiki, haʻahaʻa kū'ē metala kiʻiʻoniʻoni alumina ceramic kaapuni
4. He maikaʻi ka solderability o ka mea kumu, a he kiʻekiʻe ka mahana hoʻohana.
5. Hoʻopili maikaʻi
6. Pohō alapine haʻahaʻa
7. E hui me ke kiʻekiʻe kiʻekiʻe
8. ʻAʻole ia i loko o nā meaʻai kūlohelohe, kūʻē i nā kukuna cosmic, he hilinaʻi kiʻekiʻe i ka aerospace a me ka aerospace, a he lōʻihi kona ola lawelawe.
9. ʻAʻole i loaʻa i ka papa keleawe kahi papa oxide a hiki ke hoʻohana ʻia no ka manawa lōʻihi i kahi ea hoʻemi.

Nā pōmaikaʻi ʻenehana

Introduction to the manufacturing process of ceramic printed circuit board technology-hole punching

Me ka hoʻomohala ʻana o nā huahana uila kiʻekiʻe i ke kuhikuhi o ka miniaturization a me ka wikiwiki kiʻekiʻe, ʻo FR-4 kuʻuna, alumini substrate a me nā mea substrate ʻē aʻe ʻaʻole kūpono no ka hoʻomohala ʻana i ka mana kiʻekiʻe a me ka mana kiʻekiʻe.

Me ka holomua o ka ʻepekema a me ka ʻenehana, ka noi akamai o ka ʻoihana PCB.Hoʻololi mālie ʻia nā ʻenehana LTCC a me DBC e nā ʻenehana DPC a me LAM.ʻO ka ʻenehana laser i hōʻike ʻia e ka ʻenehana LAM ua ʻoi aku ka maikaʻi me ka hoʻomohala ʻana o ka pilina kiʻekiʻe a me ka maikaʻi o nā papa kaapuni paʻi.ʻO ka hoʻoheheʻe ʻana i ka laser ʻo ia ka ʻenehana hoʻoheheʻe mua a me ka ʻenehana nui i ka ʻoihana PCB.He kūpono ka ʻenehana, wikiwiki, pololei, a he waiwai hoʻohana kiʻekiʻe.

ʻO ka papa kaapuni RayMingceramic hana ʻia me ka ʻenehana hoʻōla wikiwiki ʻana i ka laser.He kiʻekiʻe ka ikaika paʻa ma waena o ka papa metala a me ka ceramic, maikaʻi nā waiwai uila, a hiki ke hana hou ʻia ka wili.Hiki ke hoʻololi i ka mānoanoa o ka papa metala ma ka laulā o 1μm-1mm, hiki ke hoʻokō i ka hoʻonā L / S.20μm, hiki ke hoʻopili pololei ʻia e hāʻawi i nā hoʻoponopono maʻamau no nā mea kūʻai aku

Hoʻokumu ʻia ka lateral excitation o ka atmospheric CO2 laser e kahi hui Kanada.Ke hoʻohālikelike ʻia me nā laser maʻamau, ʻoi aku ka kiʻekiʻe o ka mana hoʻopuka e like me hoʻokahi haneli a hoʻokahi tausani manawa, a maʻalahi ka hana ʻana.

I ka electromagnetic spectrum, aia ka lekiō ma ke alapine o 105-109 Hz.Me ka hoʻomohala ʻana o ka ʻenehana koa a me ka aerospace, ua hoʻokuʻu ʻia ke alapine lua.Loaʻa i nā lasers haʻahaʻa haʻahaʻa a me ka haʻahaʻa RF CO2 ka hana modulation maikaʻi, ka mana paʻa a me ka hilinaʻi kiʻekiʻe.Nā hiʻohiʻona e like me ke ola lōʻihi.Hoʻohana nui ʻia ʻo UV solid YAG i nā plastics a me nā metala i ka ʻoihana microelectronics.ʻOiai ʻoi aku ka paʻakikī o ke kaʻina hana hoʻoheheʻe laser CO2, ʻoi aku ka maikaʻi o ka hopena o ka micro-aperture ma mua o ka UV solid YAG, akā ʻo ka laser CO2 nā mea maikaʻi o ka hana kiʻekiʻe a me ka wikiwiki wikiwiki.ʻO ka māhele mākeke o ka PCB laser micro-hole processing hiki ke hoʻomohala ʻia ka hana ʻana o ka micro-hole laser home I kēia manawa, ʻaʻole nui nā hui i hiki ke hoʻokomo i ka hana.

Aia nō ka hana ʻana o ka microvia laser home i ka pae hoʻomohala.Hoʻohana ʻia ka pulse pōkole a me nā lasers mana kiʻekiʻe e wili i nā lua i nā substrates PCB e hoʻokō ai i ka ikehu kiʻekiʻe, ka wehe ʻana i nā mea a me ka hoʻokumu ʻana o ka micro-hole.Hoʻokaʻawale ʻia ʻo Ablation i ka ablation photothermal a me ka ablation photochemical.ʻO ka Photothermal ablation e pili ana i ka hoʻopau ʻana i ke kaʻina hana puka ma o ka hoʻopili wikiwiki ʻana o ke kukui laser kiʻekiʻe e ka mea substrate.ʻO ka ablation Photochemical e pili ana i ka hui pū ʻana o ka ikehu photon kiʻekiʻe ma ka ʻāpana ultraviolet ma mua o 2 eV electron volts a me ka lōʻihi hawewe laser ma mua o 400 nm.Hiki i ke kaʻina hana ke hoʻopau maikaʻi i nā kaulahao molekala lōʻihi o nā mea kūlohelohe e hana i nā mea liʻiliʻi liʻiliʻi, a hiki i nā ʻāpana ke hana wikiwiki i nā micropores ma lalo o ka hana o ka ikaika o waho.

I kēia lā, loaʻa i ka ʻenehana hoʻoheheʻe laser o Kina kekahi ʻike a me ka holomua ʻenehana.Ke hoʻohālikelike ʻia me ka ʻenehana stamping kuʻuna, ʻo ka ʻenehana hoʻoheheʻe laser he kiʻekiʻe kiʻekiʻe, kiʻekiʻe ka wikiwiki, kiʻekiʻe kiʻekiʻe, kiʻekiʻe kiʻekiʻe o ka pahu punching, kūpono no ka nui o nā mea palupalu a paʻakikī, me ka ʻole o ka nalowale o nā mea hana, a me ka hana ʻōpala.ʻO nā mea maikaʻi o nā mea liʻiliʻi, palekana kaiapuni a ʻaʻohe pollution.

ʻO ka papa kaapuni seramika ma o ke kaʻina hana hoʻoheheʻe laser, kiʻekiʻe ka ikaika hoʻopaʻa ma waena o ka ceramic a me ka metala, ʻaʻole e hāʻule, huʻihuʻi, a me nā mea ʻē aʻe, a me ka hopena o ka ulu pū ʻana, pālahalaha kiʻekiʻe o ka ʻili, roughness ratio o 0.1 micron a 0.3 micron, anawaena puka hahau laser Mai 0.15 mm a i 0.5 mm, a i ole 0.06 mm paha.


ʻO ka hana ʻana o ka papa kaapuni seramika

ʻO ka pahu keleawe i waiho ʻia ma ka ʻaoʻao o waho o ka papa kaapuni, ʻo ia hoʻi, ke ʻano kaapuni, ua uhi mua ʻia me kahi ʻāpana pale-tin resistance, a laila hoʻopaʻa ʻia ka ʻaoʻao ʻaʻole conductor o ke keleawe i kemika e hana i kahi. kaapuni.

E like me nā ʻano kaʻina hana like ʻole, ua māhele ʻia ka etching i loko o ka etching layer a me waho etching etching.ʻO ka etching o loko ka acid etching, ʻo ke kiʻi ʻoniʻoni a i ʻole ke kiʻi maloʻo m ke hoʻohana ʻia i mea kūʻē;ʻO ka etching papa waho he alkaline etching, a hoʻohana ʻia ka tin-lead i mea pale.Agena.

ʻO ke kumu kumu o ka etching reaction

1. Alkalization o ka waika copper chloride


1, Acidic keleawe chloride alkalization

Hōʻike: ʻO ka ʻāpana o ka kiʻiʻoniʻoni maloʻo ʻaʻole i hoʻomālamalama ʻia e nā kukuna ultraviolet e hoʻoheheʻe ʻia e ka sodium carbonate alkaline nāwaliwali, a koe ka ʻāpana irradiated.

ʻO ke kalai ʻana: Wahi a kekahi mahele o ka hopena, ua hoʻoheheʻe ʻia ka ʻili keleawe i hōʻike ʻia ma ka hoʻoheheʻe ʻana i ke kiʻiʻoniʻoni maloʻo a i ʻole ke kiʻi ʻoniʻoni ʻeleʻele e hoʻoheheʻe ʻia e ka waika copper chloride etching solution.

ʻO ke kiʻiʻoniʻoni maloʻo: Hoʻoheheʻe ʻia ka kiʻiʻoniʻoni pale ma ka laina hana ma kahi ʻāpana o ka mahana a me ka wikiwiki.

Loaʻa i ka acidic copper chloride catalyst nā hiʻohiʻona o ka mana maʻalahi o ka etching speed, kiʻekiʻe copper etching efficiency, maikaʻi maikaʻi, a me ka maʻalahi o ka hoʻihoʻi ʻana i ka hopena etching.

2. Alkaline etching



ʻAkaʻalaʻala

ʻO ke kiʻiʻoniʻoni maloʻo: E hoʻohana i ka wai meringue e wehe i ke kiʻiʻoniʻoni mai ka ʻili kiʻiʻoniʻoni, e hōʻike ana i ka ʻili keleawe i hana ʻole ʻia.

ʻO ke kalai ʻana: Hoʻopili ʻia ka papa lalo pono ʻole me kahi etchant e wehe i ke keleawe, e waiho ana i nā laina mānoanoa.I waena o lākou, e hoʻohana ʻia nā mea kōkua.Hoʻohana ʻia ka accelerator e hāpai i ka hopena oxidation a pale i ka ua o nā ion cuprous;hoʻohana ʻia ka mea hoʻomaʻamaʻa iniseti e hōʻemi i ka ʻili ʻaoʻao;Hoʻohana ʻia ka mea paʻa e pale i ka hoʻopuehu ʻana o ka amonia, ka ua o ke keleawe, a me ka wikiwiki i ka oxidation o ke keleawe.

Emulsion hou: E hoʻohana i ka wai amonia monohydrate me nā iona keleawe ʻole e wehe i ke koena ma ka pā me ka solution ammonium chloride.

Puka piha: He kūpono wale kēia kaʻina hana no ke kaʻina gula immersion.E hoʻoneʻe nui i nā ion palladium nui i loko o nā lua i hoʻopaʻa ʻole ʻia e pale i nā ion gula mai ke pohō ʻana i ke kaʻina o ka ua gula.

ʻili ʻili: Hoʻopau ʻia ka papa tin-lead me ka hoʻohana ʻana i ka wai nitric acid.

ʻEhā hopena o ke kalai ʻana

1. Ka hopena loko
I ka wā o ke kaʻina hana etching, e hana ka wai i kahi kiʻiʻoniʻoni wai ma ka papa ma muli o ka umekaumaha, a laila e pale ai i ka wai hou mai ka hoʻopili ʻana i ka ʻili keleawe.




2. Ka hopena o ka Groove
ʻO ka hoʻopili ʻana o ka hopena kemika e hoʻopili ai ka hopena kemika i ke āpau ma waena o ka pipeline a me ka pipeline, e hopena i kahi nui etching ʻē aʻe i loko o ka ʻāpana paʻa, a me ka wahi ākea.




3. Ka hopena hala
Kahe ka lāʻau lapaʻau i lalo i ka lua, e hoʻonui ai i ka wikiwiki hou o ka lāʻau wai a puni ka lua pā i ka wā o ke kaʻina hana etching, a piʻi ka nui o ka etching.




4. Nozzle swing hopena
ʻO ka laina e like me ke kuhikuhi ʻana o ka nozzle, no ka mea hiki i ka lāʻau wai hou ke hoʻopau maʻalahi i ka lāʻau wai ma waena o nā laina, ua hoʻonui koke ʻia ka lāʻau wai, a nui ka nui o ka etching;

ʻO ka laina perpendicular i ke kuhikuhi ʻana o ka nozzle, no ka mea, ʻaʻole maʻalahi ka wai kemika hou e hoʻopau i ka lāʻau lapaʻau ma waena o nā laina, ua hōʻoluʻolu ʻia ka lāʻau lapaʻau i ka wikiwiki, a liʻiliʻi ka nui o ka etching.




Nā pilikia maʻamau i ka hana etching a me nā ʻano hoʻomaikaʻi

1. ʻAʻole pau ke kiʻiʻoniʻoni
No ka mea, he haʻahaʻa loa ka manaʻo o ka syrup;wikiwiki loa ka laina laina;ʻo ka hoʻopaʻa ʻana o ka nozzle a me nā pilikia ʻē aʻe e pau ʻole ke kiʻiʻoniʻoni.No laila, pono e nānā i ka manaʻo o ka syrup a hoʻololi i ka manaʻo o ka syrup i kahi kūpono kūpono;hoʻololi i ka wikiwiki a me nā palena i ka manawa;a laila e hoʻomaʻemaʻe i ka nozzle.

2. ʻO ka ʻili o ka papa i hoʻoheheʻe ʻia
No ka mea, he kiʻekiʻe loa ka manaʻo o ka syrup a he kiʻekiʻe loa ka mahana, e hoʻoneʻe ʻia ka ʻili o ka papa.No laila, pono e hoʻoponopono i ka ʻike a me ka mahana o ka syrup i ka manawa.

3. ʻAʻole i pau ka Thetecopper
No ka wikiwiki loa o ka etching;ʻo ka hoʻohui ʻana o ka syrup i hoʻohālikelike ʻia;ua haumia ka ʻili keleawe;paʻa ka nozzle;haʻahaʻa ka mahana a ʻaʻole i pau ke keleawe.No laila, pono e hoʻoponopono i ka wikiwiki o ka hoʻouna ʻana;e nānā hou i ke ʻano o ka syrup;e makaʻala i ka haumia keleawe;e hoʻomaʻemaʻe i ka nozzle e pale ai i ka pipili;hoʻoponopono i ka mahana.

4. Kiʻekiʻe loa ke keleawe etching
No ka lohi loa o ka holo ʻana o ka mīkini, kiʻekiʻe loa ka mahana, a me nā mea ʻē aʻe, hiki ke hoʻoulu i ka corrosion keleawe.No laila, pono e lawe ʻia nā hana e like me ka hoʻoponopono ʻana i ka wikiwiki o ka mīkini a me ka hoʻoponopono ʻana i ka mahana.