ʻO ka hoʻopau ʻana o kahi mea, ʻike ʻia hoʻi ʻo ka lapalapa ahi, ka hoʻopau ʻana iā ia iho, ka pale ʻana i ke ahi, ka pale ʻana i ke ahi, ke kū ʻana o ke ahi, ka flammability a me nā mea hoʻopau ʻē aʻe, ʻo ia ka loiloi i ka hiki o ka mea ke pale i ka puhi ʻana.

Hoʻopau ʻia ka laʻana mea flammable me kahi lapalapa e kū ana i nā koi, a wehe ʻia ka lapalapa ma hope o ka manawa i ʻōlelo ʻia.ʻIke ʻia ka pae flammability e like me ke ʻano o ka puhi ʻana o ka hāpana.ʻEkolu pae.Hoʻokaʻawale ʻia ke ʻano hoʻāʻo pae o ka hāpana i FH1, FH2, FH3 pae ʻekolu, ua māhele ʻia ke ʻano hoʻāʻo kū i FV0, FV1, VF2.
ʻO ka paʻa Papa PCB ua maheleia i ka papa HB a me ka papa V0.

ʻO ka pepa HB he haʻahaʻa haʻahaʻa ahi a hoʻohana nui ʻia no nā papa ʻaoʻao hoʻokahi.Loaʻa i ka papa VO ke ahi ahi kiʻekiʻe.Hoʻohana nui ʻia no nā papa ʻaoʻao ʻelua a me nā papa he nui e kū ana i nā koi helu ahi V-1.Lilo kēia ʻano papa PCB i ka papa FR-4.ʻO V-0, V-1, a me V-2 nā māka pale ahi.

Pono ka papa kaapuni e pale i ka lapalapa ahi, ʻaʻole hiki ke wela i kekahi mahana, akā hiki ke hoʻopalupalu wale ʻia.Ua kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg point), a pili kēia waiwai i ke kūpaʻa dimensional o ka papa PCB.

He aha ka papa kaapuni Tg PCB kiʻekiʻe a me nā pono o ka hoʻohana ʻana i kahi Tg PCB kiʻekiʻe?
Ke piʻi ka mahana o kahi papa paʻi Tg kiʻekiʻe i kahi ʻāpana, e hoʻololi ka substrate mai "ke aniani" a i "ke aupuni Ruber".Kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg) o ka papa.ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa e mālama ai ka substrate i ka rigidity.

He aha nā ʻano kikoʻī o nā papa PCB?
Māhele ʻia e ka pae papa mai lalo a kiʻekiʻe penei:

94HB － 94VO － 22F － CEM-1 － CEM-3 － FR-4 i wehewehe ʻia penei: 94HB: pepa pahu maʻamau, ʻaʻole pale ahi (ʻo ka mea haʻahaʻa haʻahaʻa, make punching, ʻaʻole hiki ke hoʻohana ʻia e like me ka papa mana) 94V0: pahu pahu pale ahi (hoʻoheheʻe ʻia) 22F: ʻO ka ʻaoʻao hoʻokahi hapalua papa fiberglass (make kuʻi) CEM-1: ʻO ka papa fiberglass ʻaoʻao hoʻokahi (pono e wili ʻia e ka kamepiula, ʻaʻole make ke kuʻi) CEM-3: ʻaoʻao ʻelua ʻaoʻao fiberglass papa (pono e wili ʻia e ka lolouila, ʻaʻole e make ke kuʻi) CEM-3: ʻO ka papa fiberglass ʻaoʻao ʻelua. koe wale no ka pepa pahu lua, o ka mea haahaa loa ia no na papa elua.

FR-4: Papa fiberglass ʻaoʻao ʻelua

Pono ka papa kaapuni e pale i ka lapalapa ahi, ʻaʻole hiki ke wela i kekahi mahana, akā hiki ke hoʻopalupalu wale ʻia.Ua kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg point), a pili kēia waiwai i ke kūpaʻa dimensional o ka papa PCB.

He aha ka papa kaapuni Tg PCB kiʻekiʻe a me nā pono o ka hoʻohana ʻana i ka PCB Tg kiʻekiʻe

Ke piʻi ka mahana i kekahi wahi, e hoʻololi ka substrate mai ka "glassy" a i ka "rubbery", a ʻo ka mahana i kēia manawa ua kapa ʻia ʻo ke aniani hoʻololi wela (Tg) o ka pā.ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa (°C) kahi e mālama ai ka substrate i ka paʻakikī.

ʻO ia hoʻi, ʻaʻole wale nā ​​​​mea hoʻoheheʻe PCB maʻamau e hana i ka palupalu, deformation, hoʻoheheʻe a me nā mea ʻē aʻe i nā mahana kiʻekiʻe, akā hōʻike pū kekahi i ka emi ʻana o nā ʻano mechanical a me nā uila (manaʻo wau ʻaʻole makemake ʻoe e ʻike i ka hoʻokaʻawale ʻana o nā papa PCB. a ʻike i kēia kūlana i kāu huahana ponoʻī. ).

ʻOi aku ka nui o ka pā Tg ma mua o 130 degere, ʻoi aku ka nui o ka Tg kiʻekiʻe ma mua o 170 degere, a ʻoi aku ka nui o ka Tg ma mua o 150 degere.

ʻO ka maʻamau, ua kapa ʻia nā papa paʻi PCB me Tg ≥ 170 ° C he mau papa paʻi Tg kiʻekiʻe.Ke piʻi aʻe nei ka Tg o ka substrate, e hoʻomaikaʻi a hoʻomaikaʻi ʻia ka pale ʻana o ka wela, ka pale ʻana i ka wai, ke kūpaʻa kemika, ke kūpaʻa a me nā ʻano ʻē aʻe o ka papa i paʻi ʻia.ʻOi aku ka kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka pale wela o ka papa, ʻoi aku ka maikaʻi ma ke kaʻina alakaʻi ʻole, kahi e maʻa mau ai nā noi Tg kiʻekiʻe.

ʻO ka Tg kiʻekiʻe e pili ana i ka pale wela kiʻekiʻe.Me ka hoʻomohala wikiwiki ʻana o ka ʻoihana uila, ʻoi aku ka nui o nā huahana uila i hōʻike ʻia e nā kamepiula, ʻo ka hoʻomohala ʻana i nā hana kiʻekiʻe a me nā multilayers kiʻekiʻe e koi ai i ka pale wela kiʻekiʻe o nā mea PCB substrate i mea hōʻoia nui.ʻO ka puka ʻana a me ka hoʻomohala ʻana o nā ʻenehana hoʻokiʻekiʻe kiʻekiʻe i hōʻike ʻia e SMT a me CMT ua hana i nā PCB i ʻoi aku ka ʻole o ke kākoʻo ʻana o ke kūpaʻa wela kiʻekiʻe o nā substrates ma ke ʻano o ka puka liʻiliʻi, nā wili maikaʻi, a me ka thinning.

No laila, ʻo ka ʻokoʻa ma waena o ka FR-4 maʻamau a me ka Tg FR-4 kiʻekiʻe: aia ia i ka mokuʻāina wela, ʻoi aku ka nui ma hope o ka lawe ʻana i ka wai.
Ma lalo o ka wela, aia nā ʻokoʻa i ka ikaika mechanical, dimensional stability, adhesion, absorption wai, thermal decomposition, a me ka hoʻonui wela o nā mea.ʻOi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea substrate PCB maʻamau.I nā makahiki i hala iho nei, ua hoʻonui ʻia ka nui o nā mea kūʻai aku e koi ana i ka hana ʻana i nā papa paʻi kiʻekiʻe Tg i kēlā me kēia makahiki.

Me ka hoʻomohala ʻana a me ka hoʻomau mau ʻana o ka ʻenehana uila, hoʻopuka mau ʻia nā koi hou no nā mea substrate papa kaapuni paʻi paʻi, a laila e hoʻoikaika nei i ka hoʻomohala mau ʻana o nā kūlana laminate copper clad.I kēia manawa, ʻo nā kūlana nui no nā mea substrate e like me kēia.

① Nā Kūlana Kūlana I kēia manawa, ʻo GB/T4721-47221992 a me GB4723-4725-1992 koʻu ʻāina no ka hoʻokaʻawale ʻana i nā mea PCB no nā mea substrate.ʻO ka maʻamau laminate copper clad ma Taiwan, ʻo Kina ka maʻamau CNS, i hoʻokumu ʻia ma ka maʻamau JIs Iapana., Hoʻokuʻu ʻia i ka makahiki 1983.
② ʻO nā kūlana aupuni ʻē aʻe he: Japanese JIS standard, American ASTM, NEMA, MIL, IPc, ANSI, UL standards, British Bs standards, German DIN and VDE standards, French NFC and UTE standards, and Canadian CSA Standards, AS standards in Australia, FOCT nā kūlana ma ka Soviet Union mua, nā kūlana IEC honua, etc.

He mea maʻamau a hoʻohana mau ʻia nā mea hoʻolako o nā mea hoʻolālā PCB mua: Shengyi \ Jiantao \ International, etc.

● Nā palapala i ʻae ʻia: protel autocad powerpcb orcad gerber a i ʻole papa kope papa maoli, etc.

● Nā ʻano papa: CEM-1, CEM -3 FR4, mea kiʻekiʻe TG;

● Nui papa nui: 600mm*700mm (24000mil*27500mil)

● Mānoanoa papa hana: 0.4mm-4.0mm (15.75mil-157.5mil)

● Nā papa hana kiʻekiʻe: 16Layers

● Pāpaʻa pepa keleawe mānoanoa: 0.5-4.0 (oz)

● Hoʻopau ʻia ka mānoanoa o ka papa: +/-0.1mm (4mil)

● Hoʻokumu ana i ka hoʻomanawanui: wili lolouila: 0.15mm (6mil) Die punching pā: 0.10mm (4mil)

● Ka laulā laina liʻiliʻi loa: <+-20%

● ʻO ka liʻiliʻi liʻiliʻi wili lua anawaena o ka huahana i pau: 0.25mm (10mil) Ka palena iki punching puka anawaena o ka pau ana huahana: 0.9mm (35mil) Ke ahonui o ka huahana puka anawaena: PTH: +-0.075mm(3mil) NPTH : +-0.05mm(2mil)

● Hoʻopau pā puka keleawe mānoanoa: 18-25um (0.71-0.99mil)

● Mākaʻikaʻi SMT hoʻopaʻa ʻana: 0.15mm (6mil)

● ili uhi: kemika immersion gula, tin spray , ʻO ka papa holoʻokoʻa he nickel-plated gula (wai / palupalu gula), siliki pale uliuli glue, etc.

● Solder mask mānoanoa ma ka papa: 10-30μm (0.4-1.2mil)

● Ka ikaika ʻili: 1.5N/mm (59N/mil)

● Resistance Solder film paakiki: >5H

● hiki ke hoʻopaʻa ʻia ka puka hoʻoheheʻe kūʻai kūʻai: 0.3-0.8mm (12mil-30mil)

● Dielectric mau: ε= 2.1-10.0

● Kū'ē kū'ē: 10KΩ-20MΩ

● Impedance hiʻona: 60 ohm±10%

● Haʻalulu wela : 288 ℃, 10 sec

● Warpage o ka papa i pau: <0.7%

● Hoʻohana huahana: nā lako kamaʻilio, nā uila uila, nā mea kani, ka ʻōnaehana hoʻonohonoho honua, kamepiula, MP4, lako mana, nā mea hana hale, etc.

Wahi a nā mea hoʻoikaika o ka papa PCB, ua māhele ʻia i nā ʻano aʻe:
1. Phenolic PCB pepa substrate
No ka mea, ua haku ʻia kēia ʻano papa PCB me ka pulp pepa, ka pulp lāʻau, a me nā mea ʻē aʻe, i kekahi manawa e lilo ia i ka pepa pahu, V0 papa, lapalapa-retardant papa a me 94HB, etc. ʻO kāna mea nui he lāʻau pulp fiber pepa, he ʻano PCB. synthesized e ke kaomi resin phenolic.pā.ʻAʻole pale ahi kēia ʻano substrate pepa, hiki ke kuʻi, haʻahaʻa ke kumu kūʻai, haʻahaʻa ke kumu kūʻai, a haʻahaʻa haʻahaʻa pili.ʻIke pinepine mākou i nā substrate pepa phenolic e like me XPC, FR-1, FR-2, FE-3, a me nā mea ʻē aʻe.

2. Papahana PCB hui
Kapa ʻia kēia ʻano papa pauka i ka papa pauka, me ka lāʻau pulp fiber pepa a i ʻole ka pulupulu pulp fiber pepa ma ke ʻano he mea hoʻoikaika, a me ka lole aniani e like me ka mea hoʻoikaika kino i ka manawa like.Hana ʻia nā mea ʻelua i ka resin epoxy pale ahi.Aia kekahi ʻaoʻao hapa aniani fiber 22F, CEM-1 a me ʻelua ʻaoʻao hapalua aniani fiber papa CEM-3, ma waena o ka CEM-1 a me CEM-3 ka mea maʻamau i hoʻopaʻa ʻia i nā laminates keleawe.

3. Ke aniani fiber PCB substrate
I kekahi manawa, lilo ia i papa epoxy, papa aniani aniani, FR4, papa fiber, a pela aku.He kiʻekiʻe ka wela hana o kēia ʻano papa kaapuni a ʻaʻole pili i ke kaiapuni.Hoʻohana pinepine ʻia kēia ʻano papa i ka PCB ʻaoʻao ʻelua, akā ʻoi aku ke kumukūʻai ma mua o ka substrate PCB composite, a ʻo ka mānoanoa maʻamau ʻo 1.6MM.He kūpono kēia ʻano substrate no nā papa lako mana, nā papa kaapuni kiʻekiʻe, a hoʻohana nui ʻia i nā kamepiula, nā mea pili, a me nā lako kamaʻilio.

FR-4

4. ʻO nā mea ʻē aʻe