Nā Mana Nui
- ʻaoʻao hoʻokahi
- ʻaoʻao ʻelua
- Lapa nui
- Kanu ia Via
- Makapo Via
- Hoʻomalu ʻia ka Impedance
- Micro Via
- ʻO ka wili laser
- Hoʻokō RoHS
- Epoxy hoʻopiha i nā vias
PCB paakiki
'ikamu
| Spec
|
Nā ʻāpana
| 1~20
|
Mānoanoa Papa
| 0.1mm-8.0mm
|
Mea waiwai
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc.
|
Nui Nui o ka Panel
| 600mm×1200mm
|
Min Hole Nui
| 0.1mm
|
Min Laina Laulā/Lua
| 3mil(0.075mm)
|
Papa Outline tolerance
| 士0.10mm
|
Mānoanoa Layer Insulation
| 0.075mm--5.00mm
|
Ka Manoanoa keleawe o waho
| 18um--350um
|
Luwaha wili (Mechanical)
| 17um--175um
|
Hole Hoʻopau (Mechanical)
| 17um--175um
|
ʻO ka hoʻomanawanui ʻana (Mechanical)
| 0.05mm
|
Kakau inoa (Mechanical)
| 0.075mm
|
ʻAspect Ratio
| 16:01
|
ʻAno Māka Solder
| LPI
|
SMT Min.Laulā Māka Solder
| 0.075mm
|
Min.Hoʻomaʻemaʻe Palekana Solder
| 0.05mm
|
Anawaena Puka Puka
| 0.25mm--0.60mm
|
Ka hoʻomanawanui impedance
| 士10%
|
Hoʻopau ʻili
| ENIG, OSP, HASL, Chem.Tin/Sn, Flash Gula, etc
|
Soldermask
| ʻOmaomao/melemele/ʻeleʻele/keʻokeʻo/ʻulaʻula/uliuli
|
Silkscreen
| ʻulaʻula/melemele/ʻeleʻele/keʻokeʻo
|
Palapala
| UL, ISO 9001, ISO14001, IATF16949
|
Noi Kuikawa
| Puka makapō, manamana gula, BGA, ʻīnika kalapona, pale maka nānā, kaʻina VIP, ka uhi ʻaoʻao, ʻAlua lua , etc
|
Mea Hoolako Mea
| Shengyi, ITEQ, Taiyo, etc.
|
Pūʻolo maʻamau
| Māmā + Kāpena
|
English en 
