Qhov peb feem ntau hais txog yog " FR-4 Fiber Class Material PCB Board " yog lub npe code rau qib ntawm cov khoom siv hluav taws xob. Nws sawv cev rau cov khoom siv tshwj xeeb uas cov khoom siv cob yuav tsum tuaj yeem tua nws tus kheej tom qab raug hlawv. Nws tsis yog lub npe ntawm cov khoom siv, tab sis yog hom khoom. muaj ntau hom FR-4 qib cov ntaub ntawv siv nyob rau hauv dav Circuit Court boards tam sim no, tab sis feem ntau ntawm lawv yog ua los ntawm thiaj li hu ua Tera-Function epoxy resin ntxiv muab tub lim (Filler) thiab iav fiber ntau cov khoom ua.
Flexible luam tawm Circuit Board (Flexible Printed Circuit Board, abbreviated FPC) kuj yog hu ua flexible printed circuit board, los yog flexible printed circuit board.Lub flexible printed circuit board yog ib yam khoom uas tau tsim thiab tsim los ntawm kev hloov pauv hloov tau los ntawm kev luam ntawv. 
Muaj ob lub ntsiab ntawm cov ntawv luam tawm Circuit Board substrates: cov ntaub ntawv organic substrate thiab inorganic substrate cov ntaub ntawv, thiab cov ntaub ntawv organic substrate yog siv ntau tshaj.PCB substrates siv yog sib txawv rau ntau txheej.Piv txwv li, 3 mus rau 4 txheej boards yuav tsum tau siv prefabricated composite cov ntaub ntawv, thiab ob-sided boards feem ntau siv cov iav-epoxy. Thaum xaiv ib daim ntawv, peb yuav tsum xav txog qhov cuam tshuam ntawm SMT Nyob rau hauv cov txheej txheem kev sib dhos tsis muaj hlau lead, vim qhov kub thiab txias, qhov degree ntawm dabtsi yog khoov ntawm lub rooj tsavxwm luam tawm thaum rhuab yog nce.Yog li, nws yuav tsum tau siv lub rooj tsavxwm nrog me me ntawm kev khoov hauv SMT, xws li FR-4 hom substrate.
Txij li thaum lub expansion thiab contraction kev nyuaj siab ntawm substrate tom qab cua sov cuam tshuam rau lub Cheebtsam, nws yuav ua rau lub electrode tev tawm thiab txo qhov kev cia siab.Yog li, cov khoom siv nthuav dav coefficient yuav tsum tau them nyiaj mloog thaum xaiv cov khoom, tshwj xeeb tshaj yog thaum cov khoom siv loj dua 3.2 × 1.6mm.PCB siv nyob rau hauv qhov chaw sib dhos tshuab yuav tsum muaj thermal conductivity, zoo heev tshav kub tsis kam (150 ℃, 60min) thiab solderability (260 ℃, 10s), siab tooj liab foil adhesion zog (1.5 × 104Pa los yog ntau tshaj) thiab dabtsi yog khoov zog (25 × 104Pa), siab conductivity thiab me me dielectric tas li, zoo punchability (qhov tseeb 0.02mm) thiab compatibility nrog tu cov neeg ua hauj, ntxiv rau, cov tsos yuav tsum du thiab tiaj tus, tsis muaj warping, tawg, nti thiab xeb me ntsis, thiab lwm yam. 
PCB thickness xaiv Lub thickness ntawm cov ntawv luam tawm yog 0.5mm, 0.7mm, 0.8mm, 1mm, 1.5mm, 1.6mm, (1.8mm), 2.7mm, (3.0mm), 3.2mm, 4.0mm, 6.4mm, ntawm 0.7mm mm thiab 1.5 Lub PCB nrog lub thickness ntawm mm yog siv rau kev tsim ntawm ob-sided boards nrog kub ntiv tes, thiab 1.8mm thiab 3.0mm yog tsis-tus qauv ntau thiab tsawg. Los ntawm qhov kev xav ntawm ntau lawm, qhov loj ntawm lub rooj tsav xwm luam tawm yuav tsum tsis pub tsawg dua 250 × 200mm, thiab qhov loj tshaj plaws yog feem ntau (250 ~ 350mm) × (200 × 250mm).Rau PCBs nrog sab ntev tsawg dua 125mm lossis dav sab tsawg dua 100mm, yooj yim Siv jigsaw txoj kev. Cov txheej txheem mounting txheej txheem qhia qhov khoov tus nqi ntawm lub substrate nrog ib tug tuab ntawm 1.6 hli raws li sab sauv warpage ≤0.5 hli thiab qis warpage ≤1.2 hli 
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