Muaj peev xwm
- Ib Sab
- Ob Sab
- Multi Txheej
- Burried Via
- Qhov muag tsis pom Via
- Impedance tswj
- Micro Via
- Laser Drilling
- RoHS Ua Raws Cai
- Epoxy puv vias
Rigid PCB
Yam khoom
| Spec
|
Txheej
| 1 ~ 20
|
Board Thickness
| 0.1mm-8.0 hli
|
Khoom siv
| FR-4, CEM-1 / CEM-3, PI, Siab Tg, Rogers, PTEF, Alu / Cu Base, thiab lwm yam
|
Max Vaj Huam Sib Luag Loj
| 600mm × 1200mm
|
Min Qhov Loj
| 0.1 hli
|
Min Kab Dav / Qhov Chaw
| 3mil (0.075 hli)
|
Board Outline Tolerance
| 0.10 hli
|
Rwb thaiv tsev txheej Thickness
| 0.075mm-5.00 hli
|
Tawm Txheej Copper Thickness
| 18-350 Nws
|
Drilling qhov (Mechanical)
| 17-175 Nws
|
Finish Hole (Mechanical)
| 17-175 Nws
|
Txoj kab uas hla Tolerance (Mechanical)
| 0.05 hli
|
Kev Sau Npe (Mechanical)
| 0.075 hli
|
Aspect Ratio
| 16:01 Nws
|
Solder Mask Hom
| LPI
|
SMT Min.Solder Mask Dav
| 0.075 hli
|
Min.Solder Mask Clearance
| 0.05 hli
|
Plug Qhov Diameter
| 0.25mm-0.60 hli
|
Impedance Control kam rau ua
| 士10%
|
Nto tiav
| ENIG, OSP, HASL, Chem.Tin/Sn, Flash Kub, lwm
|
Soldermask
| Ntsuab / Daj / Dub / Dawb / Liab / Xiav
|
Silkscreen
| Liab / Daj / Dub / Dawb
|
Daim ntawv pov thawj
| UL, ISO 9001, ISO14001, IATF16949
|
Thov tshwj xeeb
| Qhov muag qhov muag, Kub ntiv tes, BGA, Carbon number case, peekable daim npog qhov ncauj, VIP txheej txheem, Ntug plating, Ib nrab qhov , lwm
|
Cov khoom siv
| Shengyi, ITEQ, Taiyo, thiab lwm yam.
|
Ntim Pob
| Nqus + Carton
|
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