Nekuuya kwezera reruzivo rwemadhijitari, zvinodiwa zvekufambiswa kwepamusoro-soro, kutapurirana nekukurumidza, uye kuvanzika kwepamusoro kwekutaurirana zviri kuramba zvichikwira.Sechinhu chakakosha kutsigira chigadzirwa chemagetsi ruzivo tekinoroji indasitiri, PCB inoda iyo substrate kuti isangane nekuita kweyakaderera dielectric nguva dzose, yakaderera midhiya kurasikirwa chinhu, yakakwirira-tembiricha kuramba, nezvimwewo, uye kusangana nekuita uku kunoda kushandisa yakakosha yakakwirira-frequency. substrates, iyo inonyanya kushandiswa ndeyeTeflon (PTFE) zvinhu.Nekudaro, muPCB yekugadzirisa maitiro, nekuda kwehurombo hwekunyorova kweTeflon zvinhu, kunyorova kwepamusoro neplasma kurapwa kunodiwa pamberi pegomba metallization, kuve nechokwadi chekufambira mberi kwegomba metalization process.

Chii chinonzi Plasma?

Plasma imhando yenyaya inosanganisira kunyanya maerekitironi emahara uye maion anochajiwa, anowanikwa zvakanyanya muchadenga, anowanzoonekwa seyechina mamiriro ezvinhu, anozivikanwa seplasma, kana "Ultra gaseous state", inozivikanwawo se "plasma".Plasma ine high conductivity uye yakanyatsobatanidzwa nemagetsi emagetsi.

Mechanism

Kushandiswa kwesimba (semuenzaniso simba remagetsi) mumorekuru wegasi mukamuri yevacuum kunokonzerwa nekudhumhana kwemaerekitironi anomhanyisa, kupisa maerekitironi ekunze emamorekuru nemaatomu, uye maion anoburitsa, kana kuti maredhiyori emahara akanyanya.Saka maion anozobuda, mahara radicals anoramba achiroverana uye anokwidziridzwa nesimba remagetsi, zvekuti anodhumhana nepamusoro pechinhu, uye anoparadza mamolecular bond mukati mehuwandu hwemamicrons akati wandei, anoita kudzikiswa kwehumwe ukobvu, anogadzira bumpy. nzvimbo, uye panguva imwechete inoumba shanduko yemuviri uye yemakemikari pamusoro pepamusoro senge boka rekushanda rekuumbwa kwegasi, inovandudza mhangura-yakaputirwa bonding simba, decontamination uye mamwe maitiro.

Oxygen, nitrogen, uye Teflon gasi zvinowanzoshandiswa muplasma iri pamusoro.

Plasma processing inoshandiswa mumunda wePCB

• Gomba remadziro dent mushure mekuchera, bvisa gomba madziro ekuchera tsvina;
• Bvisa iyo carbide mushure mekuchera laser maburi mapofu;
• Kana mitsetse yakanaka ichigadzirwa, zvakasara zvefirimu yakaoma zvinobviswa;
• Nzvimbo yemadziro egomba inogadziriswa isati yaiswa Teflon zvinhu mumhangura;
• Surface activation pamberi pemukati ndiro lamination;
• Kuchenesa kusati kwanyura goridhe;
• Surface activation isati yaoma uye welding firimu.
• Shandura chimiro chemukati chepamusoro uye kunyorova, vandudza interlayer kusunga simba;
• Bvisa corrosion inhibitors uye welding film residues;

Chati yekusiyanisa yemhedzisiro mushure mekugadzirisa

1. Hydrophilic kunatsiridza kuedza

2. Mhangura-yakapfatwa SEM muRF-35 mapepa maburi pamberi uye mushure mekurapa kweplasma

3. Kuiswa kwemhangura pamusoro pePTFE Base board pamberi uye mushure mekugadzirisa plasma

4. Iyo Solder mask mamiriro epamusoro pePTFE base board pamberi uye mushure mekugadzirisa plasma

Tsanangudzo ye plasma chiito

1, Activated kurapwa kweTeflon zvinhu

Asi vese mainjiniya vanga vachiita metallization ye polytetrafluoroethylene zvinhu maburi vane chiitiko ichi: kushandiswa kwakajairwa. FR-4 yakawanda-layer yakadhindwa redunhu bhodhi gomba metalization kugadzirisa nzira, haina kubudirira PTFE gomba metalization.Pakati pavo, pre-activation treatment yePTFE pamberi pemakemikari yemhangura deposition idambudziko guru uye danho rinokosha.Mu activation kurapa kwePTFE zvinhu pamberi pemakemikari copper deposition, nzira dzakawanda dzinogona kushandiswa, asi pazere, dzinogona kuvimbisa kunaka kwezvigadzirwa, zvakafanira kugadzirwa kwemazhinji ndeaya anotevera maviri:

a) Chemical processing nzira: simbi sodium uye radon, maitiro mune zvisiri-mvura zvinonyungudutsa senge tetrahydrofuran kana glycol dimethyl ether mhinduro, kuumbwa kweiyo nio-sodium yakaoma, iyo sodium yekurapa mhinduro, inogona kugadzira maatomu epamusoro eTeflon mukati. gomba vanoiswa pamuviri, kuzadzisa chinangwa chekunyorovesa gomba remadziro.Iyi ndiyo nzira yakajairika, mhedzisiro yakanaka, yakagadzikana mhando, inoshandiswa zvakanyanya.

b) Plasma nzira yekurapa: iyi nzira iri nyore kushanda, yakagadzikana uye yakavimbika yekugadzirisa mhando, yakakodzera kugadzirwa kwakawanda, kushandiswa kweplasma kuomesa kugadzirwa.Iyo sodium-crucible kurapwa mhinduro inogadzirwa nemakemikari nzira yekurapa yakaoma kugadzira, yakakwira toxicity, hupenyu hupfupi hwesherufu, inoda kugadzirwa zvinoenderana nemamiriro ekugadzira, yakakwirira kuchengetedza zvinodiwa.Nokudaro, panguva ino, kushandiswa kwekugadzirisa kwePTFE pamusoro, nzira yekurapa yeplasma yakawanda, iri nyore kushanda, uye inoderedza zvikuru kurapwa kwemvura yakasviba.

2, Gomba rusvingo cavitation / gomba rusvingo resin kuchera kubviswa

For FR-4 multi-layer akadhindwa redunhu bhodhi kugadzirisa, ayo CNC kuchera mushure gomba madziro resin kuchera uye zvimwe zvinhu kubviswa, kazhinji kushandisa concentrated sulfuric acid kurapwa, chromic acid kurapwa, alkaline potassium permanganate kurapwa, uye plasma kurapwa.Zvisinei, mu flexible akadhindwa redunhu bhodhi uye rigid-inoshanduka akadhindwa redunhu bhodhi kubvisa kuchera tsvina kurapwa, nokuda kusiyana zvinhu unhu, kana kushandiswa pamusoro makemikari nzira kurapwa, mugumisiro haana kunaka, uye kushandiswa kweplasma. kuchera tsvina uye concave kubviswa, unogona kuwana nani gomba rusvingo roughness, zvakakodzera kuti esimbi plating yegomba, asiwo ane "matatu-dimensional" concave kubatana unhu.

3, Kubviswa kwecarbide

Plasma kurapwa nzira, kwete chete kune akasiyana pepa kuchera kusvibiswa kurapwa maitiro ari pachena, asiwo kune inoumbwa resin zvinhu uye micropores kuchera kusvibiswa kurapwa, asi zvakare kuratidza hukuru hwayo.Pamusoro pezvo, nekuda kwekuwedzera kuri kuita kugadzirwa kweakaturikidzana akawanda-layer akadhindwa edunhu mabhodhi ane yakakwira interconnect density, maburi akawanda ekuchera mapofu anogadzirwa uchishandisa laser tekinoroji, inova-chigadzirwa chelaser drilling bofu maapplication - kabhoni, inoda kubviswa pamberi pegomba metallization muitiro.Panguva ino, tekinoroji yekurapa kweplasma, pasina kuzeza kutora mutoro wekubvisa kabhoni.

4, Yemukati pre-kugadzirisa

Nekuda kwekuwedzera kuri kuita kugadzirwa kweakasiyana akadhindwa edunhu mabhodhi, inoenderana yekugadzirisa tekinoroji zvinodiwa zvakare yakakwirira uye yakakwirira.Iyo yemukati pretreatment yeinochinjika yakadhindwa yedunhu bhodhi uye yakasimba inochinjika yakadhindwa yedunhu bhodhi inogona kuwedzera pamusoro roughness uye activation dhigirii, kuwedzera inosunga simba pakati yemukati layer, uye zvakare kuve nekukosha kukuru kuvandudza goho rekugadzira.

Zvakanakira uye kuipa kweplasma processing

Plasma processing inzira iri nyore, inoshanda uye yemhando yepamusoro yekubvisa tsvina uye kumashure etching yemabhodhi edunhu akadhindwa.Kurapa kwePlasma kunonyanya kukodzera Teflon (PTFE) zvinhu nokuti hazvinyanyi kushandiswa kwemakemikari uye kurapa kweplasma kunomutsa basa.Kuburikidza ne-high-frequency generator (yakajairika 40KHZ), tekinoroji yeplasma inotangwa nekushandisa simba remunda wemagetsi kuparadzanisa gasi rekugadzirisa pasi pemamiriro evacuum.Izvi zvinokurudzira magasi ekuparadzanisa asina kugadzikana anoshandura nekubhomba pamusoro.Maitiro ekurapa akadai seakanaka UV kucheneswa, activation, kushandiswa uye kuyambuka, uye plasma polymerization ibasa rekurapa kwepamusoro peplasma.Plasma processing process iri pamberi pekuchera mhangura, kunyanya kurapwa kwemakomba, iyo general plasma process process ndeye: kuchera - plasma kurapwa - mhangura.Kurapa kwePlasma kunogona kugadzirisa matambudziko egomba, zvisaririra zvakasara, kusungirirwa kwemagetsi kwemukati memhangura yemukati uye kutadza kukwana.Kunyanya, kurapwa kweplasma kunogona kunyatso bvisa masara eresin kubva pakudhirowa, inozivikanwawo sekusvibiswa kwekuchera.Iyo inotadzisa kubatana kwegomba mhangura kune yemukati mhangura layer panguva ye metalization.Kuti uvandudze simba rekusunga pakati peplating uye resin, fiberglass nemhangura, aya slags anofanira kubviswa akachena.Naizvozvo, plasma degluing uye corrosion kurapwa inovimbisa kubatana kwemagetsi mushure mekuisa mhangura.

Michina yePlasma inowanzo sanganisira makamuri ekugadzirisa anobatwa muvacuum uye anowanikwa pakati pemahwendefa maviri e electrode, akabatana nejenareta reRF kuti aumbe huwandu hukuru hweplasma mukamuri yekugadziridza.Mukamuri yekugadziridza iri pakati pemahwendefa maviri e electrode, iyo equidistant yekumisikidza ine akati wandei maviri epakatarisana nekadhi slots kuti igadzire nzvimbo yekugara yeakawanda-giramu inogona kugarisa plasma kugadzirisa edunhu mabhodhi.Mune iripo plasma process process yePCB board, kana iyo substrate yePCB yakaiswa mumushini weplasma wekugadzirisa plasma, substrate yePCB inowanzoiswa zvinoenderana pakati pekadhi kadhi slot yekamuri yekugadziridza plasma (kureva, kamuri ine plasma kugadzirisa. circuit board), iyo plasma inoshandiswa kuplasma kune plasma kurapwa kwegomba paPCB substrate kuvandudza hunyoro hwepamusoro hwegomba.

Plasma machine processing cavity space idiki, saka, kazhinji pakati pema electrode plate processing chamber inogadzikwa nemapaya mana epakatarisana nekadhi plate grooves, ndiko kuti, kuumbwa kwezvidhinha zvina zvinogona kugarisa plasma kugadzirisa redunhu bhodhi pekugara nzvimbo.Kazhinji, saizi yegedhi yega yega yenzvimbo yekugara i900mm (kureba) x 600mm (kureba) x 10mm (yakafara, kureva ukobvu hwebhodhi), maererano neiyo iripo PCB board plasma process process, nguva imwe neimwe Iyo plasma processing board. ine huwandu hunosvika 2 flat (900mm x 600mm x 4), nepo imwe neimwe yeplasma yekugadzirisa nguva imaawa 1.5, nekudaro ichipa simba rezuva rimwe remamita makumi matatu nemashanu.Zvinogona kuonekwa kuti simba rekugadzirisa plasma rePCB board harina kukwirira nekushandisa plasma processing process yePCB board iripo.

Summary

Kurapa kweplasma kunonyanya kushandiswa mundiro yakakwira-frequency, HDI , yakaoma uye yakapfava kusanganiswa, kunyanya yakakodzera Teflon (PTFE) zvinhu.Yakaderera kugadzirwa kwesimba, mutengo wakakwira zvakare usiri wayo, asi plasma kurapwa zvakanakira zvakare pachena, zvichienzaniswa nedzimwe nzira dzekurapa dzepamusoro, iyo mukurapwa kweTeflon activation, inovandudza hydrophilicity yayo, kuve nechokwadi chekuti simbi yemakomba, laser gomba kurapwa, kubviswa kweiyo chaiyo mutsara yasara yakaoma firimu, roughing, pre-reinforcement, welding uye silkscreen character pretreatment, mabhenefiti ayo haadzoreki, uye zvakare ane akachena, ane hushamwari hunhu.