Iyadoo ay soo ifbaxday da'da macluumaadka dhijitaalka ah, shuruudaha isgaadhsiinta degdegga ah, gudbinta xawaaraha sare, iyo kalsoonida sare ee isgaarsiintu waxay noqonayaan mid sare iyo sare.Sida badeecada taageerada lagama maarmaanka ah ee warshadaha tignoolajiyada macluumaadka elektiroonigga ah, PCB waxay u baahan tahay substrate si ay ula kulanto waxqabadka joogtada ah ee dielectric hooseeya, lumitaanka warbaahinta hoose, iska caabinta heerkulka sare, iwm, iyo si loo daboolo waxqabadkan baahida loo qabo isticmaalka soo noqnoqoshada sare ee gaarka Substrates, kuwaas oo inta badan la isticmaalo ay tahay Teflon (PTFE).Si kastaba ha ahaatee, in geeddi-socodka processing PCB, ay sabab u tahay waxqabadka qoynta dusha liidata ee alaabta Teflon, qoynta dusha by daaweynta balasmaha ayaa loo baahan yahay ka hor metallization godka, si loo hubiyo in horumarka siman ee habka metalization godka.

Waa maxay Plasma?

Plasma waa nooc ka mid ah walxo ka kooban electrons lacag la'aan ah iyo ion lacag la'aan ah, oo si weyn looga helo koonka, inta badan loo tixgeliyo inay tahay xaaladda afaraad ee maaddada, oo loo yaqaan plasma, ama "Ultra gaseous state", oo sidoo kale loo yaqaan "plasma".Plasma waxay leedahay koronto-qaadis sare waxayna si aad ah ugu lamaan tahay meelaha korantada.

Farsamaynta

Codsiga tamarta (tusaale tamarta korantada) ee molecule gaaska ee qolka faakuumka waxa sababa isku dhaca elektarooniga degdega ah, gubanaya electrons-ka kore ee molecules iyo atamka, iyo dhalisa ions, ama xagjiryo xor ah oo firfircoon.Sidaas awgeed ion-yada ka soo baxa, xagjirrada xorta ah ayaa si joogto ah isku dhaca oo ay dardargeliyaan xoogga goobta korantada, si ay ugu dhacdo dusha sare ee walxaha, oo ay burburiyaan curaarta molecular inta u dhaxaysa dhowr microns, waxay keenaysaa dhimista dhumuc gaar ah, waxay abuurtaa barar. dusha sare, iyo isla mar ahaantaana qaabeeya isbeddellada jirka iyo kiimikaad ee dusha sare sida kooxda shaqada ee ka kooban gaaska, waxay hagaajisaa xoogga isku xidhka naxaasta-plated, sun-saarid iyo saameyno kale.

Ogsajiinta, nitrogen, iyo gaaska Teflon ayaa caadi ahaan loo isticmaalaa balaasmaha kore.

Habaynta Plasma ee loo isticmaalo goobta PCB

• Dalool dalool dalool ah ka dib qodista, ka saar wasakhda dalool daloolka godka;
• Ka saar carbide ka dib godad indho la'aan qodista laser;
• Marka khadadka ganaaxa la sameeyo, haraaga filimka qalalan ayaa la saaraa;
• Dusha sare ee gidaarka daloolka ayaa la hawlgeliyaa ka hor inta aan walxaha Teflon lagu dhejin naxaas;
• Dhaqdhaqaaqa dusha sare ka hor lamination saxanka gudaha;
• Nadiifinta ka hor inta aan la quusin dahabka;
• Firfircoonida dusha sare ka hor qalajinta iyo filimka alxanka.
• Beddel qaabka dusha sare ee gudaha iyo qoynta, wanaaji xoogga isku xidhka dhexda;
• Ka saar daxaliyeyaasha iyo haraaga filimka alxanka;

Jaantus ka soo horjeeda saamaynta ka dib habaynta

1. Tijaabada hagaajinta biyaha

2. SEM-maxaas ah oo ku dhejisan godadka xaashida RF-35 ka hor iyo ka dib daaweynta balaasmaha

3. Dhigista Copper ee dusha sare ee guddiga PTFE Base ka hor iyo ka dib beddelka balaasmaha

4. Xaaladda maaskarada alxanka ee dusha sare ee guddiga saldhigga PTFE ka hor iyo ka dib beddelka balaasmaha

Sharaxaada ficilka balaasmaha

1, Daawaynta firfircoon ee walxaha Teflon

Laakiin dhammaan injineerada ku hawlanaa bidaynta godad walxaha polytetrafluoroethylene waxay leeyihiin khibraddan: isticmaalka caadiga ah FR-4 sabuurad wareeg ah oo daabacan oo badan habka farsamaynta biraha godka, ma aha guul PTFE godka biraha.Waxaa ka mid ah, daawaynta hore ee PTFE ka hor inta aan la dhigin naxaasta kiimikada waa dhib weyn iyo tallaabo muhiim ah.Daawaynta firfircoonida walxaha PTFE ka hor inta aan la dhigin kiimikada kiimikada, habab badan ayaa loo isticmaali karaa, laakiin guud ahaan, waxay dammaanad qaadi kartaa tayada alaabta, oo ku habboon ujeedooyinka wax soo saarka ballaaran waa labadan soo socda:

a) Habka habaynta kiimikada: birta sodium iyo radon, falcelinta ee dareerayaasha aan biyaha ahayn sida tetrahydrofuran ama glycol dimethyl ether xal, formation of nio-sodium adag, xal daaweynta sodium, ka dhigi kartaa atamka dusha sare ee Teflon ee godka waa uur leh, si loo gaaro ujeedada qoynta derbiga daloolka.Tani waa habka caadiga ah, saameyn wanaagsan, tayada xasilloon, ayaa si ballaaran loo isticmaalaa.

b) Habka daaweynta Plasma: habkani waa sahlan tahay in la shaqeeyo, tayada waxsoosaarka xasilloon oo lagu kalsoonaan karo, oo ku habboon wax soo saarka ballaaran, isticmaalka habka qalajinta plasma.Xalka daaweynta sodium-crucible ee ay diyaarisay habka daaweynta kiimikaad way adagtahay in la isku daro, sunta sare, nolosha shelf gaaban, waxay u baahan tahay in la habeeyo iyadoo loo eegayo xaaladda wax soo saarka, shuruudaha badbaadada sare.Sidaa darteed, wakhtigan xaadirka ah, daaweynta firfircoonida ee dusha PTFE, habka daaweynta plasma oo badan, fududahay in la shaqeeyo, oo si weyn u yareeya daaweynta biyaha wasakhda ah.

2, Daloolin darbiga godka / godka resin qodista qodista

Wixii FR-4 multi-lakab ah oo daabacan guddiga wareegga wareegga, ay CNC qodista ka dib daloolka resin resin daloolka iyo walxaha kale ka saarida, sida caadiga ah iyadoo la isticmaalayo daawaynta sulfuric acid xoog, daaweynta chromic acid, daaweynta potassium permanganate alkaline, iyo daaweynta balasmaha.Si kastaba ha ahaatee, in guddiga wareegga daabacan dabacsan iyo qallafsanaan-dabcan guddiga wareegga daabacan si meesha looga saaro daaweynta wasakh qodida, ay sabab u tahay kala duwanaansho ee sifooyinka alaabta, haddii isticmaalka hababka daaweynta kiimikada ee kor ku xusan, saamaynta ma fiicna, iyo isticmaalka plasma. si aad u qoddo wasakh iyo ka saarista qulqulka, waxaad ka heli kartaa qallafsanaanta derbiga godka wanaagsan, oo ku habboon dahaadhka macdan ee godka, laakiin sidoo kale wuxuu leeyahay sifooyin iskuxiran oo "saddex-cabbir ah".

3, Kaarbiid oo meesha laga saaro

Habka daaweynta Plasma, ma aha oo kaliya noocyada kala duwan ee qodista xaashida saamaynta daaweynta wasakheynta waa cad, laakiin sidoo kale qalabka resin isku dhafan iyo micropores daweynta wasakhda qodista, laakiin sidoo kale waxay muujinaysaa ay ka sarreeyaan.Intaa waxaa dheer, ay sabab u tahay kororka baahida wax soo saarka ee lakabyo multi-lakabka daabacan loox wareeg ah oo leh cufnaanta interconnect sare, godad badan oo qodista indha la'aan ah ayaa la soo saaray iyadoo la isticmaalayo technology laser, taas oo ah by-product ee codsiyada dalool dalool laser - carbon, taas oo u baahan in laga saaro ka hor habka biraha daloolka.Waqtigan xaadirka ah, tignoolajiyada daaweynta balasmaha, iyada oo aan ka labalabayn in la qaado mas'uuliyadda qaadista kaarboonka.

4, Internal pre-processing

Sababtoo ah baahida sii kordheysa ee wax soo saarka ee looxyada wareegyada daabacan ee kala duwan, shuruudaha tignoolajiyada ee u dhigma ayaa sidoo kale ka sarreeya oo sarreeya.Pretreatment The gudaha ee guddiga wareegga daabacan dabacsan iyo qallafsan oo dabacsan loox daabacan kara kordhin kara qallafsanaanta dusha iyo degree firfircoonida, kordhinta xoogga isku xidhka u dhexeeya lakabka gudaha, iyo sidoo kale waxay leeyihiin muhiimad weyn si loo hagaajiyo dhalidda wax soo saarka.

Faa'iidooyinka iyo khasaaraha ka mid ah processing balaasmaha

Habaynta Plasma waa hab ku habboon, hufan oo tayo sare leh oo wasakhaysan iyo dib u xoqidda looxa wareegga daabacan.Daaweynta Plasma waxay si gaar ah ugu habboon tahay walxaha Teflon (PTFE) sababtoo ah way yar yihiin firfircoonida kiimikaad iyo daaweynta balasma waxay kicisaa dhaqdhaqaaqa.Iyada oo loo marayo koronto-dhaliye-sare (caadi ahaan 40KHZ), tignoolajiyada balasmaha ayaa la aasaasay iyadoo la adeegsanayo tamarta beerta korantada si loo kala saaro gaaska wax-qabadka ee xaaladaha faakuumka.Kuwani waxay kiciyaan gaasaska kala soocida ee aan degganayn ee wax ka beddelaya oo duqeeya dusha sare.Hababka daawaynta sida nadiifinta UV-ga fiican, kicinta, isticmaalka iyo is-goysyada, iyo polymerization plasma waa doorka daaweynta dusha balaasmaha.Habka habaynta Plasma waa ka hor inta aan la qodin naxaasta, inta badan daaweynta godadka, habka guud ee processing plasma waa: qodista - daaweynta balaasmaha - copper.Daaweynta Plasma waxay xallin kartaa dhibaatooyinka daloolka daloolka, hadhaaga haraaga, xiritaanka koronto ee liita ee lakabka naxaasta gudaha iyo daxalka aan ku filneyn.Gaar ahaan, daawaynta balasmaha waxay si wax ku ool ah uga saari kartaa hadhaagii haraaga geeddi-socodka qodista, oo sidoo kale loo yaqaan wasakhowga qodista.Waxay caqabad ku tahay isku xirka naxaasta godka iyo lakabka naxaasta gudaha inta lagu jiro birta.Si loo hagaajiyo xoogga isku xidhka ee u dhexeeya dhejinta iyo resinka, fiberglass iyo naxaasta, dharbaaxadan waa in si nadiif ah looga saaraa.Sidaa darteed, dawaynta balaasmaha iyo daxalka ayaa hubiya isku xirka korantada ka dib dhigista naxaasta.

Mashiinnada balaasmaha guud ahaan waxay ka kooban yihiin qolal farsamayn oo lagu hayo meel faaruq ah waxayna ku yaalliin inta u dhaxaysa laba taarikada korantada, kuwaas oo ku xidhan koronto dhaliyaha RF si ay u sameeyaan tiro badan oo balaasmooyinka qolka wax lagu sameeyo.Qolka farsamaynta ee u dhexeeya labada taarikada korantada, goobta siman waxay leedahay dhowr lammaane oo kaarar iska soo horjeeda si ay u sameeyaan meel hoy ah oo garaamyo badan leh waxay qaadi karaan looxyada wareegga wareegga.Habka wax ka beddelka balaasmaha ee hadda jira ee guddiga PCB, marka substrate PCB la geliyo mashiinka balaasmaha ee loogu talagalay diyaarinta balaasmaha, substrate PCB ayaa guud ahaan la dhigayaa si u dhiganta inta u dhaxaysa booska kaarka qaraabada ee qolka farsamaynta balaasmaha guddiga wareegga), balaasmaha waxaa loo isticmaalaa in lagu daawaynta balaasmaha ee godka on substrate PCB si loo hagaajiyo qoyaanka dusha daloolka.

Mashiinka Plasma ka baaraandegida booska godka waa yar yahay, sidaas darteed, guud ahaan inta u dhaxaysa labada qol ee saxan saxan electrode la qotomiyey afar lammaane oo ka soo horjeeda jeexdin saxan kaarka, in uu yahay, formation of afar blocks qaadi karaan Plasma meelaynta guddiga wareegga guddiga hoy hoy.Guud ahaan, cabbirka shabakad kasta oo meel hoyga ah waa 900mm (dheer) x 600mm (dherer) x 10mm (ballaaran, ie dhumucda looxa), marka loo eego habka PCB ee hadda jira nidaamka habaynta balaasmaha. waxay leedahay awood qiyaas ahaan 2 guri (900mm x 600mm x 4), halka wakhtiga wareegga wax-ka-qabashada balaasmaha kastaa uu yahay 1.5 saacadood, sidaas darteed waxa uu siinayaa awood hal maalin ah oo ku saabsan 35 mitir oo laba jibbaaran.Waxaa la arki karaa in awoodda wax-qabadka balaasmaha ee guddiga PCB aysan ahayn mid sare iyadoo la adeegsanayo habka wax-qabadka balaasmaha ee guddiga PCB ee jira.

Soo koobid

Daaweynta Plasma waxaa inta badan lagu isticmaalaa saxanka soo noqnoqda, HDI , isku-dhafka adag iyo jilicsan, gaar ahaan ku habboon qalabka Teflon (PTFE).Awoodda wax-soo-saarka hooseeya, qiimaha sare ayaa sidoo kale faa'iido u leh, laakiin faa'iidooyinka daaweynta plasma ayaa sidoo kale cad, marka la barbardhigo hababka kale ee daaweynta dusha sare, waxay ku jirtaa daaweynta firfircoonida Teflon, hagaajinta hydrophilicity, si loo hubiyo in biraha godadka, daaweynta godka laser. ka saarista xariiqda saxda ah ee haraaga filimka qalalan, roughing, hore u xoojinta, alxanka iyo silkscreen pretreatment, faa'iidooyinka ay yihiin kuwo aan la bedeli karin, iyo sidoo kale waxay leeyihiin nadiif ah, sifooyinka deegaanka saaxiibtinimo.