Tšebeletso ea kopano ea boto ea potoloho e hatisitsoeng ka senotlolo sa senotlolo

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau

PCBA Projects Selelekela ABIS CIRCUITS Company fana ka litšebeletso, eseng feela lihlahisoa.Re fana ka tharollo, eseng feela thepa.Ho tloha tlhahiso ea PCB, likarolo tse rekang ho ea ho likarolo lia bokana.E kenyelletsa: PCB Custom PCB ho taka / moralo ho latela sets'oants'o sa hau sa moralo oa PCB Component sourcing. Sqm khoeli le khoeli-E fana ka tlhahiso ea PCB e tlase le e batloang, hape le lihlahisoa tse kholo Lihlopha tsa boenjiniere ba litsebi-40 lienjiniere le ntlo ea bona ea lisebelisoa, e matla ho OEM.E fana ka mekhoa e 'meli e bonolo: Tsebo e tloaelehileng le e tloaelehileng-ka botebo ba IPC Class II le III Standards Re fana ka ts'ebeletso e felletseng ea EMS ho bareki ba batlang hore re bokelle PCB ho PCBA, ho kenyeletsoa prototypes, morero oa NPI, tse nyane le tse mahareng. bophahamo ba modumo.Re boetse re khona ho fumana likarolo tsohle tsa morero oa hau oa kopano oa PCB.Baenjineri ba rona le sehlopha sa lits'ebeletso ba na le boiphihlelo bo bongata indastering ea phepelo le indastering ea EMS, ba nang le tsebo e tebileng kopanong ea SMT e lumellang ho rarolla mathata ohle a tlhahiso.Litšebeletso tsa rona li boloka chelete e ngata, lia tenyetseha ebile lia tšepahala.Re khotsofetse bareki ho pholletsa le liindasteri tse ngata ho kenyeletsa bongaka, indasteri, likoloi le lisebelisoa tsa motlakase tsa bareki.PCBA Bokgoni 1 SMT kopano ho akarelletsa le BGA kopano 2 Amohela SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Karolo bophahamo: 0.2-25mm 4 Min paka: 0204 5 Min sebaka har'a BGA : 0.25-2.0mm 6 Min BGA boholo: 01. -0.63mm 7 Min QFP sebaka: 0.35mm 8 Min kopano boholo: (X * Y): 50 * 30mm 9 Max kopano boholo: (X * Y): 350 * 550mm 10 Khetha-placement ho nepahala: ± 0.01mm 11 Ho beha bokhoni : 0805, 0603, 0402 12 High pin count fit fit available 13 SMT capacity per day: 80,000 points --Capability - SMT Lines 9(5 Yamaha,4KME) Capacity 52 million placements per month Max Board Size 457*356mm.(18” X14”) Min Component size 0201-54 sq.mm.(0.084 sq.inch), sehokelo se selelele,CSP,BGA,QFP Speed ​​0.15 sec/chip,0.7 sec/QFP -Capability - PTH Lines 2 Max boto bophara 400 mm Mofuta Dual wave Pbs boemo ba mothapo o sa etelleng pele Tšehetso ea mohala oa 399 degree C Spray flux add-on Pre-heat 3 Production Processes Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Tlhahlobo ea Maikutlo → Tlhahlobo e Ikemetseng ea Optical (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Quality Control AOI Tests Checks for solder paste E hlahloba likarolo ho fihla ho 0201 Checks bakeng sa likarolo tse sieo, offset, likarolo tse fosahetseng, polarity X-Ray Inspection X -Ray e fana ka tlhahlobo e phahameng ea: BGAs / Micro BGAs / Chip scale packages / Bare boards In-Circuit Testing In-Circuit Testing e atisa ho sebelisoa hammoho le AOI e fokotsang liphoso tsa ts'ebetso tse bakoang ke mathata a likarolo.Teko ea Matla-up E tsoetseng pele Teko ea Ts'ebetso ea Flash Sesebelisoa Teko e sebetsang Tlhahlobo ea IOC e kenang tlhahlobo ea SPI ea pente ea solder Online AOI tlhahlobo ea sengoloa sa pele SMT tlhahlobo ea kantle ea tlhahlobo ea X-RAY-welding ea BGA rework QA tlhahlobo ea Anti-static warehousing le thomello ea Kopo ea Lipuisano Litsi tsa Taolo ea Indasteri. Medical Devices Automotive Units Network Devices Gateway Control Packaging & Delivery ABIS CIRCUITS Company ha e leke feela ho fa bareki sehlahisoa se setle, empa hape e ela hloko ho fana ka sephutheloana se feletseng le se sireletsehileng.Hape, re lokisa lits'ebeletso tse ikhethileng bakeng sa liodara tsohle.-Sephutheloana se tloaelehileng: PCB: Mokotla o tiisitsoeng, mekotla ea Anti-static, lebokose le loketseng.PCBA: Mekotla ea foam ea Antistatic, mekotla ea Anti-static, lebokose le loketseng.Sephutheloana se Ikemetseng: Lebokose le kantle le tla hatisoa lebitso la aterese ea moreki, letšoao, moreki o hloka ho hlakisa sebaka le lintlha tse ling.-Delivery Tips: Bakeng sa sephutheloana se senyenyane, re eletsa ho khetha ka Express kapa tšebeletso ea DDU ke tsela e potlakileng ka ho fetisisa.Bakeng sa sephutheloana se boima, tharollo e molemohali ke ka lipalangoang tsa leoatle.Melao ea Khoebo -Accepted Delivery Terms FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF --Accepted Payment Currency USD, EUR, CNY.-Accepted Tefo Type T/T, PayPal, Western Union.Khoutu e tsoang ho ABIS Ho netefatsa qotso e nepahetseng, etsa bonnete ba hore o kenyelletsa lintlha tse latelang bakeng sa projeke ea hau: Tlatsa lifaele tsa GERBER ho kenyeletsoa le lenane la BOM Quantities Turn time Panelization Requirements Requirements Litlhoko tsa Qetella quote ea hau ea tloaelo e tla tlisoa ka lihora tse 2-24 feela. mabapi le ho rarahana ha moralo.Ka kopo, re tsebise mabapi le lithahasello life kapa life!ABIS e tsotella ntho e 'ngoe le e 'ngoe ea hau