Bokhoni ba Kakaretso
- Lehlakore le le Leng
- Mahlakore a mabeli
- Multi Layer
- E patoa ka Via
- Sefofu Via
- Impedans Laolwa
- Micro Via
- Ho cheka Laser
- Ho latela RoHS
- Epoxy e tlatsitsoeng ka tsela
PCB e thata
Ntho
| Spec
|
Mekhahlelo
| 1-20
|
Botenya ba Boto
| 0.1mm-8.0mm
|
Lintho tse bonahalang
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, joalo-joalo.
|
Boholo ba Panel
| 600mmx1200mm
|
Min Hole Size
| 0.1 limilimithara
|
Min Line Width/Space
| 3mil(0.075mm)
|
Mamello ea Lethathamo la Boto
| Setšoantšo sa 0.10 mm
|
Insulation Layer Teckness
| 0.075mm-5.00mm
|
Out Layer Koporo Botenya
| 18um-350um
|
Hole Hole (Mechanical)
| 17um--175um
|
Qetella Hole (Mechanical)
| 17um--175um
|
Mamello ea Diameter (Mechanical)
| 0.05 limilimithara
|
Ngoliso (Mochini)
| 0.075 limilimithara
|
Aspect ratio
| 16:01
|
Mofuta oa Mask oa Solder
| LPI
|
SMT Min.Solder Mask Width
| 0.075 limilimithara
|
Min.Solder Mask Clearance
| 0.05 limilimithara
|
Plug Hole Diameter
| 0.25mm--0.60mm
|
Mamello ea Taolo ea Impedans
| 10%
|
Qetello ea bokaholimo
| ENIG, OSP, HASL, Chem.Tin/Sn, Khauta e Khanyang, etc
|
Soldermask
| Botala / Bosehla / Botsho / Bosoeu / Bofubelu / Boputsoa
|
Silkscreen
| Bokhubelu/Bosehla/Botsho/Bosweu
|
Setifikeiti
| UL, ISO 9001, ISO14001, IATF16949
|
Kopo e khethehileng
| Lesoba le foufetseng, monoana oa khauta, BGA, enke ea k'habone, maske a shebehang, ts'ebetso ea VIP, plating ea moeli, likoti tse halofo , etc
|
Bahlahisi ba Lintho
| Shengyi, ITEQ, Taiyo, joalo-joalo.
|
Sephutheloana se Tloaelehileng
| Vacuum+Carton
|
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