1. Kutheni i-BGA ibekwe kumngxuma wemaski we-solder?Uthini umgangatho wokwamkela?
Re: Okokuqala, i solder imaski iplagi umngxuma kukukhusela ubomi benkonzo ye via, kuba umngxuma efunekayo kwisithuba BGA jikelele encinane, phakathi 0.2 kunye 0.35mm.Enye isiraphu akulula ukuba yomiswe okanye ibe ngumphunga, kwaye kulula ukushiya iintsalela.Ukuba i-solder imaski ayiplagi umngxuma okanye iplagi ayigcwalanga, kuya kubakho intsalela yento yangaphandle okanye amaso enkcenkce kwinkqubo elandelayo efana nokutshiza inkonkxa kunye nokuntywiliselwa kwegolide.Ngokukhawuleza xa umthengi etshisa icandelo ngexesha lobushushu obuphezulu be-soldering, izinto zangaphandle okanye i-tin beads emngxunyeni ziya kuphuma kwaye zihambelane necandelo, ezibangela iziphene ekusebenzeni kwecandelo, njengezijikelezo ezivulekileyo nezifutshane.I-BGA ibekwe kumngxunya wemaski ye-solder A, kufuneka igcwele B, akukho bubomvu okanye ukuvezwa kobhedu lobuxoki kuvunyelwe, C, akukho kugcwele kakhulu, kwaye i-protrusion iphezulu kunepadi ekufuneka ithengiswe ecaleni kwayo (eya kuchaphazela isiphumo sokuxhoma icandelo). 
2. Uthini umahluko phakathi kweglasi ephezulu yetafile yomatshini wokuvezwa kunye neglasi eqhelekileyo?Kutheni le nto isibonisi sesibane sokuvezwa singalingani? Impendulo: Iglasi yetafile yomatshini wokuvezwa ayiyi kuvelisa ukukhanya okukhanyayo xa ukukhanya kudlula kuyo.Ukuba i-reflector yesibane sokuvezwa sithe tyaba kwaye sigudileyo, ngoko xa ukukhanya kukhanya kuyo, ngokomgaqo wokukhanya, yenza kuphela ukukhanya okubonakalayo okukhanyayo okukhanyayo ebhodini ukuba kuvezwe.Ukuba umngxuma u-convex kwaye ungalingani ngokuhambelana nokukhanya Umgaqo-siseko kukuba ukukhanya okukhanya kwi-recesses kunye nokukhanya okukhanya kwi-protrusions kuya kwenza ukukhanya okungenakubaleka okuthe saa, okwenza ukukhanya okungaqhelekanga kodwa okufanayo kwibhodi ukuba kuvezwe, ukuphucula ukukhanya. isiphumo sokuvezwa. 
3. Yintoni uphuhliso olusecaleni?Ziziphi iziphumo zomgangatho obangelwa kuphuhliso olusecaleni? Re: Ububanzi bommandla ophantsi kwenxalenye apho ioli eluhlaza kwelinye icala lefestile yemaski ye-solder iye yaphuhliswa ibizwa ngokuba nguphuhliso lwecala.Xa uphuhliso lwecala lukhulu kakhulu, lithetha ukuba indawo yeoli eluhlaza yecandelo eliphuhliswayo kwaye lidibene ne-substrate okanye ulusu lobhedu likhulu, kwaye iqondo lokuxhoma okwenziwe yiyo likhulu.Ukusetyenzwa okulandelayo okufana nokutshiza i-tin, ukucwiliswa kwe-tin, ukuntywiliselwa kwegolide kunye namanye amacandelo akhulayo ahlaselwe ngubushushu obuphezulu, uxinzelelo kunye nezinye iipotions ezinobundlobongela kwioli eluhlaza.I-oyile iya kuhla.Ukuba kukho ibhuloho yeoli eluhlaza kwi-IC isikhundla, kuya kubangelwa xa umthengi efaka amacandelo e-welding.Iza kubangela ibhulorho emfutshane yesekethe.
4. Yintoni i-solder engafanelekanga yokuvezwa kwemaski?Iza kubangela ziphi iziphumo zomgangatho? Re: Emva kokucutshungulwa yinkqubo ye-mask ye-solder, ibonakaliswe kwiipads zamacandelo okanye iindawo ezifuna ukuthengiswa kwinkqubo kamva.Ngexesha lokulungelelaniswa kwemaski ye-solder / inkqubo yokuvezwa, ibangelwa ngumqobo wokukhanya okanye amandla okuvezwa kunye neengxaki zokusebenza.Umphandle okanye yonke ioli eluhlaza egqunywe yile nxalenye ibonakaliswe ekukhanyeni ukuze kubangele ukusabela kwe-cross-linking.Ngethuba lophuhliso, ioli eluhlaza kule nxalenye ayiyi kuchithwa sisisombululo, kwaye ingaphandle okanye yonke i-pad yokuthengiswa ayinakubonakaliswa.Oku kubizwa ngokuba yi-soldering.Ukuvezwa kakubi.Ukuvezwa kakubi kuya kubangela ukungaphumeleli ukunyuswa kwamacandelo kwinkqubo elandelayo, i-solder engafanelekanga, kwaye, kwiimeko ezinzima, isekethe evulekileyo. 5. Kutheni kufuneka silungise kwangaphambili ipleyiti yokusila yee-wiring kunye ne-solder mask? Re: 1. Umphezulu webhodi yesekethe iquka i-foil-clad board substrate kunye ne-substrate enobhedu olufakwe ngaphambili emva kwe-metallization yomngxuma.Ukuze kuqinisekiswe ukunamathela okuqinileyo phakathi kwefilimu eyomileyo kunye ne-substrate surface, i-substrate surface iyadingeka ukuba ingabikho kwiingqimba ze-oxide, amabala e-oyile, iminwe yeminwe kunye nolunye ukungcola, akukho bhobho yokugaya, kwaye akukho ngqungquthela enzima.Ukuze ukwandise indawo yokudibanisa phakathi kwefilimu eyomileyo kunye nomgangatho we-substrate, i-substrate nayo iyadingeka ukuba ibe ne-micro-rough surface.Ukuze kuhlangatyezwane nezi mfuno zimbini zingasentla, i-substrate kufuneka icutshungulwe ngocoselelo phambi kokwenziwa kwefilimu.Iindlela zonyango zinokushwankathelwa njengokucoca ngoomatshini kunye nokucoca imichiza.
2. Umgaqo ofanayo uyinyaniso kwimaski ye-solder efanayo.Ukugaya ibhodi phambi kwemaski ye-solder kukususa ezinye iileyile ze-oxide, amabala e-oyile, iminwe yeminwe kunye nolunye ukungcola kumphezulu webhodi, ukwenzela ukwandisa indawo yoqhagamshelwano phakathi kwe-inki ye-mask ye-solder kunye nomphezulu webhodi kwaye uyenze iqine.Umphezulu webhodi uyafuneka kwakhona ukuba ube ne-micro-rough surface (njengevili lokulungiswa kwemoto, ivili kufuneka libe phantsi kwindawo enqabileyo ukuze udibanise kakuhle kunye neglue).Ukuba awusebenzisi ukugaya phambi kwesekethe okanye imaski ye-solder, umphezulu webhodi oza kuncamatheliswa okanye uprintwe unomaleko we-oxide, amabala e-oyile, njl. Ukuzihlukanisa, kwaye ifilimu kule ndawo iya kuwa kwaye ixoke kwinkqubo yamva. 6. Yintoni i-viscosity?Yiyiphi impembelelo i-viscosity ye-inki ye-solder mask ibe nayo kwimveliso ye-PCB? Impendulo: I-Viscosity ngumlinganiselo wokuthintela okanye ukuchasa ukuhamba.I-viscosity ye-inki yemaski ye-solder inempembelelo enkulu kwimveliso ye PCB .Xa i-viscosity iphezulu kakhulu, kulula ukubangela ukuba akukho oli okanye unamathele kumnatha.Xa i-viscosity iphantsi kakhulu, i-fluidity ye-inki ebhodini iya kwanda, kwaye kulula ukubangela ukuba ioli ingene emngxunyeni.Kunye nencwadi ye-oyile yasekhaya.Ukuthetha ngokuthelekisayo, xa umaleko wobhedu wangaphandle ujiyile (≥1.5Z0), i-viscosity ye-inki kufuneka ilawulwe ukuba ibe sezantsi.Ukuba i-viscosity iphezulu kakhulu, i-fluidity ye-inki iya kuncipha.Ngeli xesha, i-bottom kunye neekona zesekethe aziyi kuba namafutha okanye abonakaliswe. 7. Ziintoni ezifanayo kunye nomahluko phakathi kophuhliso olulambathayo kunye nokungatyhileki kakuhle? Re: Amanqaku afanayo: a.Kukho i-oyile yemaski ye-solder kumphezulu apho ubhedu / igolide kufuneka ithengiswe emva kwemaski ye-solder.Unobangela ka b uyafana.Ixesha, ubushushu, ixesha lokuvezwa kunye namandla ephepha lokubhaka ziyafana. Umahluko: Indawo eyenziwe kukuvezwa okungalunganga inkulu, kwaye imaski ye-solder eseleyo isuka ngaphandle ukuya ngaphakathi, kwaye ububanzi kunye ne-Baidu ziyafana.Uninzi lwazo lubonakala kwiipads ezingenayo i-porous.Isizathu esona sizathu kukuba inki kule nxalenye ibonakaliswe ekukhanyeni kwe-ultraviolet.Ukukhanya kuyakhazimla.I-oyile ye-mask ye-solder eseleyo evela ekuphuhlisweni okungahambi kakuhle iyancipha kuphela ezantsi kwinqanaba.Indawo yayo ayinkulu, kodwa yenza imeko yefilimu encinci.Le nxalenye ye-inki ibangelwa ikakhulu ngenxa yezinto ezahlukeneyo zokunyanga kwaye yenziwe ukusuka kwi-inki yomgangatho ophezulu.Imilo yemigangatho, ebonakala ngokubanzi kwiphedi enemingxuma.
8. Kutheni i-solder imaski ivelisa amaqamza?Indlela yokuthintela? Re: (1) I-oyile yemaski ye-Solder ixutywa ngokubanzi kwaye yenziwe yi-arhente ephambili ye-inki + yokunyanga i-agent + diluent.Ngexesha lokuxuba kunye nokuxutywa kwe-inki, umoya othile uya kuhlala kumanzi.Xa i-inki idlula kwi-scraper, ucingo Emva kokuba iminatha ixinzelelwe enye kwenye kwaye igeleza ebhodini, xa idibana nokukhanya okunamandla okanye ubushushu obulinganayo ngexesha elifutshane, igesi kwi-inki iya kuhamba ngokukhawuleza kunye nokukhawuleza okuhlangeneyo. i-inki, kwaye iya kuguquguquka kabukhali.
(2), isithuba somgca sincinci kakhulu, imigca iphezulu kakhulu, i-inki yemaski ye-solder ayinakushicilelwa kwi-substrate ngexesha loshicilelo lwesikrini, okukhokelela kubukho bomoya okanye ukufuma phakathi kwe-inki ye-solder mask kunye ne-substrate, kunye Irhasi iyafudunyezwa ukuze yande kwaye ibangele amaqamza ngexesha lokunyanga nokuba sesichengeni.
(3) Umgca omnye ubangelwa ikakhulu ngumgca ophezulu.Xa i-squeegee idibene nomgca, i-angle ye-squeegee kunye nomgca uyanda, ukwenzela ukuba i-ink ye-mask ye-solder ayikwazi ukuprintwa ukuya ngaphantsi komgca, kwaye kukho igesi phakathi kwecala lomgca kunye ne-mask solder. i-inki , Uhlobo lwamaqamza amancinci luya kwenziwa xa kushushu.
Uthintelo:
a.I-inki eyenziweyo imile kangangexesha elithile phambi kokushicilela,
b.Ibhodi eprintiweyo kwakhona static ixesha elithile ukuze irhasi kwi-inki kumphezulu webhodi ngokuthe ngcembe volatilize kunye nokuqukuqela inki, uze uyithabathe kude ixesha elithile.Bhaka kwiqondo lokushisa.
I-Red Solder Mask HDI eprintiweyo yeBhodi yeSekethe yokuVelisa
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