Ngokufika kwexesha lolwazi lwedijithali, iimfuno zoqhagamshelwano oluphezulu, ukuhanjiswa kwesantya esiphezulu, kunye nokugcinwa kwemfihlo yonxibelelwano kuya kuba phezulu nangaphezulu.Njengemveliso eyimfuneko exhasayo kushishino lwetekhnoloji yolwazi lwe-elektroniki, iPCB ifuna ukuba i-substrate ihlangabezane nokusebenza kwedielectric esezantsi engaguqukiyo, ilahleko yemidiya ephantsi, ukumelana nobushushu obuphezulu, njl., kunye nokuhlangabezana nezi mfuno zokusebenza ukusebenzisa i-frequency ekhethekileyo ephezulu. ii-substrates, ezona zisetyenziswa kakhulu yiTeflon (PTFE) imathiriyeli.Nangona kunjalo, kwinkqubo yokusetyenzwa kwe-PCB, ngenxa yokungasebenzi kakuhle komphezulu wokumanzisa kwezinto zeTeflon, ukumanzisa komphezulu ngonyango lweplasma kuyadingeka ngaphambi kokuba i-metallization yomngxuma, kuqinisekiswe inkqubela phambili egudileyo yenkqubo ye-metalization yomngxuma.

Yintoni iPlasma?

I-Plasma luhlobo lwento ebandakanya ubukhulu becala ii-elektroni zasimahla kunye nee-ion ezihlawuliswayo, ezifumaneka ngokubanzi kwindalo iphela, ehlala ithathwa njengemeko yesine yento, eyaziwa ngokuba yiplasma, okanye "i-Ultra gaseous state", ekwabizwa ngokuba yi "plasma".I-Plasma ine-conductivity ephezulu kwaye idityaniswa kakhulu nemimandla ye-electromagnetic.

Inkqubo

Ukusetyenziswa kwamandla (umzekelo: amandla ombane) kwimolekyuli yerhasi kwigumbi lokufunxa kubangelwa kukungqubana kwee-elektroni ezikhawulezayo, ukutshisa iimolekyuli nee-athomu ezingaphandle, kunye nee-ion ezivelisayo, okanye iiradicals zasimahla ezisebenza kakhulu.Ke ngoko iziphumo ze-ion, iiradicals zasimahla ziyangqubana kwaye zikhawuleziswe ngamandla ombane, ukuze zingqubane nomphezulu wezinto, kwaye zitshabalalise iibhondi zemolekyuli ngaphakathi koluhlu lweemicrons ezininzi, zenza ukuncitshiswa kobunzima obuthile, zenze i-bumpy. imiphezulu, kwaye kwangaxeshanye yenza utshintsho lomzimba kunye neekhemikhali zomphezulu njengeqela lomsebenzi wokubunjwa kwegesi, iphucula amandla okudibanisa ubhedu, ukucocwa kunye nezinye iziphumo.

Ioksijini, initrogen, kunye negesi yeTeflon ziqhele ukusetyenziswa kwiplasma engentla.

Ukusetyenzwa kwePlasma kusetyenziswe kwindawo yePCB

• I-dent yodonga lomngxuma emva kokubhoboza, susa ukungcola kodonga lomngxuma;
• Susa i-carbide emva kokugaya i-laser imingxuma eyimfama;
• Xa imigca emihle yenziwe, intsalela yefilimu eyomileyo iyasuswa;
• Umphezulu wodonga lomngxunya uvulwe ngaphambi kokuba izinto zeTeflon zifakwe kubhedu;
• Ukusebenza komphezulu phambi kwe-lamination yeplate yangaphakathi;
• Ukucoca ngaphambi kokutshona kwegolide;
• Ukusebenza kobuso phambi komisa kunye nefilimu ye-welding.
• Guqula imilo yangaphakathi yendawo kunye nokumanzisa, phucula amandla okubopha i-interlayer;
• Susa i-corrosion inhibitors kunye ne-welding film residues;

Itshathi echaseneyo yeziphumo emva kokucubungula

1. Uvavanyo lokuphucula i-Hydrophilic

2. I-SEM ye-Copper-plated kwi-RF-35 imingxuma yamaphepha ngaphambi nangemva konyango lwe-plasma

3. Ukufakwa kobhedu kumphezulu webhodi ye-PTFE Base ngaphambi nangemva kokuguqulwa kweplasma

4. Imeko yemaski yeSolder yomphezulu webhodi yesiseko ye-PTFE ngaphambi nasemva kokuguqulwa kweplasma

Inkcazo yesenzo seplasma

I-1, Unyango olusebenzayo lwezinto zeTeflon

Kodwa zonke iinjineli eziye zabandakanyeka kwi-metallization ye-polytetrafluoroethylene imingxunya yezinto zinala mava: ukusetyenziswa kwesiqhelo. I-FR-4 ibhodi yesekethe eprintiweyo eninzi umngxuma metalization processing indlela, ayiphumelelanga PTFE umngxuma metalization.Phakathi kwabo, unyango lwangaphambili lwe-PTFE phambi kokufakwa kweekhemikhali zethusi bunzima obukhulu kunye nesinyathelo esibalulekileyo.Kusebenze unyango lwe-PTFE imathiriyeli phambi kokubekwa kweekhemikhali zobhedu, iindlela ezininzi zingasetyenziswa, kodwa xa zizonke, zinokuqinisekisa umgangatho weemveliso, ezilungele iinjongo zemveliso yobuninzi zezi zimbini zilandelayo:

a) Indlela yokulungisa imichiza: i-sodium yesinyithi kunye ne-radon, ukusabela kwi-solvents engeyomanzi njenge-tetrahydrofuran okanye isisombululo se-glycol dimethyl ether, ukubunjwa kwe-nio-sodium eyinkimbinkimbi, isisombululo sonyango lwesodium, sinokwenza i-athomu yeTeflon ebusweni. umngxuma zifakwe, ukufezekisa injongo yokumanzisa udonga lomngxuma.Le yindlela eqhelekileyo, umphumo omhle, umgangatho ozinzile, usetyenziswa ngokubanzi.

b) Indlela yonyango ye-Plasma: le nkqubo ilula ukusebenza, izinzile kwaye inokwethenjelwa umgangatho wokucubungula, ifanelekile kwimveliso yobuninzi, ukusetyenziswa kwenkqubo yokomisa i-plasma.Isisombululo sonyango lwe-sodium-crucible elungiselelwe yindlela yokwelapha imichiza kunzima ukudibanisa, ubuthi obuphezulu, ubomi obufutshane beshelufu, kufuneka buqulunqwe ngokwemeko yokuvelisa, iimfuno eziphezulu zokhuseleko.Ngoko ke, okwangoku, unyango olusebenzayo lwe-PTFE yomhlaba, indlela yonyango ye-plasma, kulula ukuyisebenzisa, kwaye inciphisa kakhulu unyango lwamanzi amdaka.

2, Umngxuma eludongeni cavitation / umngxuma udonga resin ukususwa

Kwi-FR-4 multi-layer eprintiweyo yebhodi yesekethe processing, CNC yayo yokomba emva umngxuma udonga resin sokomba kunye nezinye izinto ukususwa, ngokuqhelekileyo kusetyenziswa unyango concentrated sulfuric acid, unyango chromic acid, unyango alkaline potassium permanganate, kunye nonyango plasma.Noko ke, kwibhodi yesekethe eguquguqukayo eprintiweyo kunye nebhodi yesekethe engqongqo-eguquguqukayo eprintwayo ukususa unyango lokubhoboza ubumdaka, ngenxa yokungafani kweempawu ezibonakalayo, ukuba ukusetyenziswa kwezi ndlela zonyango zonyango lwekhemikhali ngasentla, umphumo awufanelekanga, kunye nokusetyenziswa kweplasma. ukugrumba ubumdaka kunye nokususwa concave, ungafumana ngcono umngxuma eludongeni uburhabaxa, eluncedo ukuba metallic Plating emngxunyeni, kodwa kwakhona uneempawu "ntathu-ntathu" uqhagamshelo concave.

I-3, Ukususwa kwe-carbide

Plasma unyango indlela, hayi kuphela ezahlukeneyo sheet kusombiwa isiphumo unyango ungcoliseko kuyabonakala, kodwa izinto resin composite kunye micropores sokomba unyango ungcoliseko, kodwa ukubonisa ukongama.Ukongeza, ngenxa yokunyuka kwemfuno yemveliso yeebhodi zesekethe eziprintiweyo ezinomaleko obuninzi kunye noxinaniso oluphezulu lonxibelelwano, imingxunya emininzi yokugrumba iimfama zenziwa kusetyenziswa itekhnoloji yelaser, eyimveliso ye-laser yokubhola imingxunya eyimfama-ikhabhoni, efuna zisuswe phambi kwenkqubo metallization umngxuma.Ngeli xesha, iteknoloji yonyango lwe-plasma, ngaphandle kokungabaza ukuthatha uxanduva lokususa i-carbon.

4, Ukulungiswa kwangaphambili kwangaphakathi

Ngenxa yokwanda kwemfuno yemveliso yeebhodi zesekethe eziprintiweyo ezahlukeneyo, iimfuno zetekhnoloji ezihambelanayo nazo ziphezulu kwaye ziphezulu.Ukulungiswa kwangaphakathi kwebhodi yesekethe eprintiweyo eguquguqukayo kunye nebhodi yesekethe eguquguqukayo eguquguqukayo inokunyusa uburhabaxa bomphezulu kunye nesidanga sokusebenza, yandise amandla okubopha phakathi komaleko wangaphakathi, kwaye ikwanokubaluleka okukhulu ukuphucula isivuno semveliso.

Iingenelo kunye nokungalunganga kokulungiswa kweplasma

Ukusetyenzwa kwePlasma yindlela efanelekileyo, esebenzayo kunye nekumgangatho ophezulu wokuphelisa ukungcola kunye nokubuyisela umva kwiibhodi zesekethe eziprintiweyo.Unyango lwe-Plasma lufanelekile ngokukodwa kwizixhobo zeTeflon (PTFE) ngenxa yokuba zisebenza ngaphantsi kweekhemikhali kwaye unyango lwe-plasma luvuselela umsebenzi.Ngokusebenzisa i-high-frequency generator (i-40KHZ eqhelekileyo), iteknoloji ye-plasma isekwe ngokusebenzisa amandla ombane wombane ukwahlula i-gas processing phantsi kweemeko ze-vacuum.Ezi zivuselela iigesi zokwahlukana ezingazinzanga eziguqula kwaye zibhobhoze umphezulu.Iinkqubo zonyango ezifana nokucocwa kwe-UV okulungileyo, ukusebenza, ukusetyenziswa kunye nokudibanisa, kunye ne-plasma polymerization yindima yonyango lwe-plasma.Inkqubo yokucubungula i-Plasma iphambi kokugaya ubhedu, ngokukodwa unyango lwemingxuma, inkqubo yokucubungula i-plasma jikelele yile: ukugaya - unyango lwe-plasma - ubhedu.Unyango lwePlasma lunokusombulula iingxaki zomngxuma, intsalela eshiyekileyo, ukubophelela okulambatha kombane komgangatho wobhedu wangaphakathi kunye nokungadleki ngokwaneleyo.Ngokukodwa, unyango lwe-plasma lunokususa ngokufanelekileyo iintsalela ze-resin kwinkqubo yokomba, eyaziwa ngokuba kukungcolisa.Ithintela ukudityaniswa kobhedu lomngxuma kwinqanaba lobhedu lwangaphakathi ngexesha le-metalization.Ukuze kuphuculwe amandla okubopha phakathi kwe-plating kunye ne-resin, i-fiberglass kunye nobhedu, ezi slags kufuneka zisuswe zicocekile.Ngoko ke, i-plasma degluing kunye ne-corrosion treatment iqinisekisa uxhulumaniso lombane emva kokufakwa kobhedu.

Oomatshini bePlasma ngokubanzi baquka amagumbi okulungisa agcinwe kwindawo engenanto kwaye abekwe phakathi kweepleyiti ezimbini ze-electrode, eziqhagamshelwe kwijenereyitha yeRF ukwenza inani elikhulu leplasma kwigumbi lokulungisa.Kwigumbi lokulungisa phakathi kweepleyiti ezimbini ze-electrode, ukusetwa kwe-equidistant kunezibini ezininzi zeendawo zokubeka ikhadi ezichaseneyo ukwenza indawo yokukhusela ye-multi-gram inokufaka iibhodi zesekethe ze-plasma.Kwinkqubo ekhoyo yokulungiswa kweplasma yebhodi ye-PCB, xa i-substrate ye-PCB ibekwe kumatshini we-plasma wokulungiswa kwe-plasma, i-substrate ye-PCB ibekwe ngokubanzi ngokuhambelanayo phakathi kwendawo yekhadi lesalathiso segumbi lokulungisa i-plasma (oko kukuthi, igumbi eliqulethe ukusetyenzwa kweplasma ibhodi yesekethe), i-plasma isetyenziselwa i-plasma ukuya kunyango lwe-plasma yomngxuma kwi-substrate ye-PCB ukuphucula ukufuma komhlaba womngxuma.

Indawo yokucoca umatshini wePlasma incinci, ngoko ke, ngokubanzi phakathi kwegumbi lokulungisa ipleyiti ye-electrode limiselwe kunye nezibini ezine zemijelo yepleyiti echaseneyo, oko kukuthi, ukubunjwa kweebhloko ezine kunokwamkela indawo yokuhlala yebhodi yesekethe yeplasma.Ngokubanzi, ubukhulu begridi nganye yendawo yokuhlala yi-900mm (ubude) x 600mm (ubude) x 10mm (ububanzi, oko kukuthi ubukhulu bebhodi), ngokwenkqubo ekhoyo yebhodi ye-PCB yokucubungula i-plasma, ixesha ngalinye Ibhodi yokucubungula i-plasma inomthamo omalunga ne-2 flat (900mm x 600mm x 4), ngelixa ixesha ngalinye le-plasma processing cycle yiyure eziyi-1.5, ngaloo ndlela inika umthamo wosuku olunye malunga ne-35 square metres.Ingabonwa ukuba amandla okusebenza kweplasma yebhodi yePCB ayiphezulu ngokusebenzisa inkqubo yokusetyenzwa kweplasma yebhodi ekhoyo yePCB.

Isishwankathelo

Unyango lwePlasma lusetyenziswa kakhulu kwipleyiti ejikelezayo, HDI , inhlanganisela enzima kunye nethambileyo, ngokukodwa ifanelekileyo kwiTeflon (PTFE) izinto.Umthamo wemveliso ephantsi, ixabiso eliphezulu likwayinto yalo, kodwa iinzuzo zonyango lweplasma nazo zicacile, xa kuthelekiswa nezinye iindlela zonyango zomphezulu, kunyango lwe-Teflon kusebenze, ukuphucula i-hydrophilicity yayo, ukuqinisekisa ukuba i-metalization yemingxuma, unyango lwe-laser hole, ukususwa komgca ochanekileyo oshiyekileyo wefilimu eyomileyo, ukurhangqa, ukomelezwa kwangaphambili, ukuwelda kunye ne-silkscreen character pretreatment, iingenelo zayo azinakuphinda zithathelwe indawo, kwaye zineempawu ezicocekileyo, ezihambelana nokusingqongileyo.