Tare da zuwan shekarun bayanan dijital, buƙatun sadarwa mai saurin gaske, saurin watsawa, da babban amincin sadarwa suna ƙaruwa kuma.Kamar yadda wani makawa goyon bayan samfurin ga lantarki bayanai fasahar masana'antu, PCB na bukatar da substrate saduwa da yi na low dielectric akai, low kafofin watsa labarai asara factor, high-zazzabi juriya, da dai sauransu, da kuma saduwa da wadannan yi bukatar yin amfani da musamman high-mita. Substrates, wanda mafi yawan amfani da su shine kayan Teflon (PTFE).Duk da haka, a cikin tsarin sarrafa PCB, saboda ƙarancin aikin jika na kayan Teflon, ana buƙatar jiyya ta hanyar jiyya ta plasma kafin haɓakar ramin, don tabbatar da ci gaba mai kyau na tsarin ƙaddamar da rami.

Menene Plasma?

Plasma wani nau'i ne na kwayoyin halitta wanda ya kunshi mafi yawan electrons kyauta da ions da aka caje, ana samun su sosai a sararin samaniya, wanda aka fi sani da shi a matsayin yanayi na hudu, wanda aka sani da plasma, ko "Ultra gaseous state", wanda aka fi sani da "plasma".Plasma yana da babban ƙarfin aiki kuma yana haɗe sosai tare da filayen lantarki.

Makanikai

Aikace-aikacen makamashi (misali makamashin lantarki) a cikin ƙwayar iskar gas a cikin ɗaki mai ɗaki yana faruwa ne ta hanyar karo na'urorin lantarki masu haɓakawa, suna ƙonewa mafi ƙarancin electrons na ƙwayoyin cuta da atoms, da samar da ions, ko radicals masu ɗaukar nauyi sosai.Don haka sakamakon ions, radicals na kyauta suna ci gaba da yin karo da sauri ta hanyar ƙarfin wutar lantarki, ta yadda zai yi karo da saman kayan, kuma yana lalata haɗin kwayoyin halitta a cikin kewayon microns da yawa, yana haifar da raguwar wani kauri, yana haifar da bumpy. saman, kuma a lokaci guda yana samar da canje-canje na jiki da sinadarai na farfajiyar kamar aikin rukuni na kayan aikin gas, inganta ƙarfin haɗin gwiwar da aka yi da jan karfe, lalata da sauran tasiri.

Oxygen, nitrogen, da Teflon gas ana amfani da su a cikin plasma na sama.

Ana amfani da sarrafa Plasma a filin PCB

• Ramin bangon rami bayan hakowa, cire datti mai hako bangon rami;
• Cire carbide bayan Laser hakowa makafi ramukan;
• Lokacin da aka yi layi mai kyau, an cire ragowar fim ɗin busassun;
• Ana kunna bangon bangon rami kafin a ajiye kayan Teflon a cikin jan karfe;
• Kunna sararin sama kafin lamination farantin ciki;
• Tsaftacewa kafin nutsewar zinari;
• Surface kunnawa kafin bushewa da waldi fim.
• Canza siffar saman ciki da jika, inganta ƙarfin ɗaurin interlayer;
• Cire masu hana lalata da ragowar fim ɗin walda;

Taswirar bambanci na tasirin bayan aiki

1. Gwajin inganta haɓakar ruwa

2. Copper-plated SEM a cikin ramukan takarda na RF-35 kafin da kuma bayan maganin plasma

3. Ƙarƙashin ƙarfe a kan farfajiyar PTFE Base board kafin da kuma bayan gyaran plasma

4. The Solder mask yanayin saman PTFE tushe jirgin kafin da kuma bayan plasma gyare-gyare

Bayanin aikin plasma

1, Kunna jiyya na Teflon abu

Amma duk injiniyoyin da suka tsunduma a cikin metallization na polytetrafluoroethylene abu ramukan suna da wannan kwarewa: yin amfani da talakawa. FR-4 Multi-Layer buga kewaye allon rami metalization aiki Hanyar, ba nasara PTFE rami metalization.Daga cikin su, riga-kafi da jiyya na PTFE kafin sinadari na jan karfe abu ne mai wahala kuma babban mataki.A cikin kunnawa jiyya na PTFE abu kafin sinadaran jan karfe jijiya, da yawa hanyoyin za a iya amfani da, amma a kan dukan, shi zai iya tabbatar da ingancin kayayyakin, dace da taro samar dalilai ne da wadannan biyu:

a) Hanyar sarrafa sinadarai: sodium na ƙarfe da radon, amsawa a cikin abubuwan da ba ruwa ba kamar tetrahydrofuran ko glycol dimethyl ether bayani, samuwar hadaddun nio-sodium, maganin maganin sodium, na iya haifar da atom na Teflon a cikin rami suna ciki, don cimma manufar wetting ramin bango.Wannan hanya ce ta al'ada, sakamako mai kyau, ingantaccen inganci, ana amfani dashi ko'ina.

b) Hanyar magani na Plasma: wannan tsari yana da sauƙi don aiki, kwanciyar hankali da ingantaccen aiki mai inganci, wanda ya dace da samar da taro, yin amfani da samar da tsarin bushewa na plasma.Maganin maganin sodium-crucible wanda aka shirya ta hanyar hanyar maganin sinadarai yana da wuya a haɗa shi, babban haɗari, ɗan gajeren rayuwa, yana buƙatar tsarawa bisa ga yanayin samarwa, babban bukatun aminci.Sabili da haka, a halin yanzu, aikin kunnawa na PTFE surface, ƙarin hanyar magani na plasma, mai sauƙin aiki, da rage yawan maganin ruwa.

2, Ramin bango cavitation / rami bango guduro hakowa kau

Don FR-4 Multi-Layer Print Board Working, CNC hakowa bayan ramin bangon resin hakowa da sauran abubuwan cirewa, yawanci ta amfani da maganin sulfuric acid mai mahimmanci, maganin chromic acid, maganin alkaline potassium permanganate, da magani na plasma.Duk da haka, a cikin m buga kewaye hukumar da m-m-m buga kewaye hukumar cire hakowa datti jiyya, saboda bambance-bambance a cikin kayan halaye, idan amfani da sama sinadaran magani hanyoyin, da sakamako ba manufa, da kuma yin amfani da plasma. don rawar soja da ƙazanta da cirewa, za ku iya samun ramin bangon rami mafi kyau, wanda zai dace da platin ƙarfe na rami, amma kuma yana da halayen haɗin haɗin "girma uku".

3, Cire carbide

Plasma magani Hanyar, ba kawai ga wani iri-iri na takardar hakowa gurbatawa magani sakamako a bayyane yake, amma kuma ga hadadden guduro kayan da micropores hakowa gurbatawa magani, amma kuma nuna ta m.Bugu da kari, saboda karuwar bukatar samar da allunan da'irar da aka buga tare da babban haɗin haɗin gwiwa, yawancin ramukan makafi ana kera su ta amfani da fasahar Laser, wanda ke haifar da aikace-aikacen ramin rami na Laser - carbon, wanda ke buƙatar yin hakan. a cire a gaban rami metallization tsari.A wannan lokacin, fasahar jiyya ta plasma, ba tare da jinkiri ba don ɗaukar nauyin cire carbon.

4, Pre-processing na ciki

Saboda karuwar buƙatun allunan da'irar bugu daban-daban, daidaitattun buƙatun fasaha na sarrafa su ma sun fi girma kuma sun fi girma.A ciki pretreatment na m buga kewaye hukumar da m m buga kewaye hukumar iya kara surface roughness da kunnawa digiri, ƙara dauri da karfi tsakanin ciki Layer, kuma suna da babban muhimmanci don inganta yawan amfanin ƙasa na samarwa.

Amfani da rashin amfani na sarrafa plasma

Sarrafa Plasma hanya ce mai dacewa, inganci kuma mai inganci don ƙazantar da ƙazantattun allunan da'irar da aka buga.Maganin Plasma ya dace musamman don kayan Teflon (PTFE) saboda ba su da ƙarancin aiki da sinadarai kuma maganin plasma yana kunna aiki.Ta hanyar janareta mai ƙarfi (na al'ada 40KHZ), an kafa fasahar plasma ta hanyar amfani da makamashin wutar lantarki don raba iskar gas ɗin aiki a ƙarƙashin yanayi mara kyau.Waɗannan suna motsa iskar gas ɗin da ba ta da ƙarfi waɗanda ke canzawa da jefa bam a saman.Hanyoyin jiyya kamar tsaftacewar UV mai kyau, kunnawa, amfani da ƙetare, da polymerization na plasma sune rawar da ake yi na jiyya na plasma.Tsarin sarrafa Plasma shine kafin hako tagulla, galibi maganin ramuka, tsarin sarrafa plasma gabaɗaya shine: hakowa - maganin plasma - jan ƙarfe.Maganin Plasma na iya magance matsalolin ramin rami, ragowar rago, rashin ɗaurin wutar lantarki na Layer jan ƙarfe na ciki da kuma rashin isassun lalata.Musamman, magani na plasma zai iya cire ragowar guduro daga aikin hakowa yadda ya kamata, wanda kuma aka sani da cutar hakowa.Yana hana haɗin ramin jan ƙarfe zuwa Layer jan ƙarfe na ciki yayin ƙaddamar da ƙarfe.Domin inganta ƙarfin dauri tsakanin plating da resin, fiberglass da jan karfe, dole ne a cire waɗannan slags mai tsabta.Sabili da haka, lalatawar plasma da maganin lalata suna tabbatar da haɗin wutar lantarki bayan ƙaddamar da jan karfe.

Na'urorin Plasma gabaɗaya sun ƙunshi ɗakunan sarrafawa waɗanda ke riƙe a cikin sarari kuma suna tsakanin faranti biyu na lantarki, waɗanda aka haɗa da janareta na RF don samar da adadi mai yawa na plasma a ɗakin sarrafawa.A cikin ɗakin sarrafawa tsakanin faranti guda biyu na lantarki, daidaitaccen saitin yana da nau'i-nau'i daban-daban na ramukan kati da yawa don samar da wurin matsuguni na gram mai yawa na iya ɗaukar allunan sarrafa plasma.A cikin tsarin sarrafa plasma na allon PCB, lokacin da aka sanya substrate na PCB a cikin injin plasma don sarrafa plasma, ana sanya PCB substrate gabaɗaya daidai tsakanin ramin katin dangi na ɗakin sarrafa plasma (watau ɗaki mai ɗauke da aikin plasma). allon kewayawa), ana amfani da plasma zuwa plasma zuwa plasma magani na rami akan PCB substrate don inganta danshin saman rami.

Wurin sarrafa injin Plasma kaɗan ne, don haka, gabaɗaya tsakanin ɗakunan sarrafa farantin lantarki guda biyu an saita su tare da nau'i-nau'i guda huɗu na kishiyar farantin kati, wato, samuwar tubalan guda huɗu na iya ɗaukar sararin matsuguni na sarrafa plasma.Gabaɗaya, girman kowane grid na sararin tsari shine 900mm (tsawo) x 600mm (tsawo) x 10mm (fadi, watau kauri na allo), bisa ga tsarin sarrafa plasma na hukumar PCB, kowane lokaci Kwamitin sarrafa plasma. yana da damar kusan 2 lebur (900mm x 600mm x 4), yayin da kowane lokacin zagayowar aikin plasma shine sa'o'i 1.5, don haka yana ba da damar kwana ɗaya na kusan murabba'in murabba'in 35.Ana iya ganin cewa ƙarfin sarrafa plasma na hukumar PCB bai yi girma ba ta hanyar amfani da tsarin sarrafa plasma na kwamitin PCB ɗin da ke akwai.

Takaitawa

Ana amfani da maganin Plasma a cikin faranti mai yawa, HDI , Haɗin wuya da taushi, musamman dacewa da kayan Teflon (PTFE).Low samar iya aiki, high kudin ne kuma da hasara, amma plasma jiyya abũbuwan amfãni kuma a bayyane yake, idan aka kwatanta da sauran surface jiyya hanyoyin, shi a cikin lura da Teflon kunnawa, inganta ta hydrophilicity, don tabbatar da cewa metallization na ramukan, Laser rami magani. kau da daidaici line saura bushe fim, roughing, pre-ƙarfafa, waldi da silkscreen hali pretreatment, da abũbuwan amfãni ne irreplaceable, kuma suna da tsabta, muhalli m halaye.