Nrog rau lub hnub nyoog ntawm cov ntaub ntawv digital, cov kev xav tau ntawm kev sib txuas lus ntau zaus, kev sib kis ceev ceev, thiab kev ceev ntiag tug ntawm kev sib txuas lus tau nce siab dua.Raws li cov khoom txhawb nqa tsis tseem ceeb rau kev lag luam hluav taws xob cov ntaub ntawv thev naus laus zis, PCB yuav tsum muaj lub substrate kom tau raws li qhov ua tau zoo ntawm qhov tsis tshua muaj hluav taws xob tsis tu ncua, tsis tshua muaj kev tshaj tawm tsis zoo, qhov kub thiab txias tsis kam, thiab lwm yam. substrates, uas feem ntau siv yog Teflon (PTFE) cov ntaub ntawv.Txawm li cas los xij, nyob rau hauv cov txheej txheem PCB, vim qhov tsis zoo ntawm cov ntaub ntub dej ntawm cov khoom siv Teflon, cov ntaub ntub dej los ntawm kev kho ntshav yog xav tau ua ntej lub qhov metallization, kom ntseeg tau tias qhov kev vam meej ntawm lub qhov hlau txheej txheem.

Plasma yog dab tsi?

Plasma yog ib hom teeb meem uas muaj feem ntau ntawm cov hluav taws xob dawb thiab them ions, dav pom nyob rau hauv lub ntiaj teb, feem ntau suav hais tias yog plaub lub xeev ntawm teeb meem, hu ua plasma, los yog "Ultra gaseous state", los yog "plasma".Plasma muaj cov conductivity siab thiab muaj kev sib txuas nrog electromagnetic teb.

Mechanism

Kev siv lub zog (xws li hluav taws xob hluav taws xob) hauv cov roj molecule hauv lub tshuab nqus tsev yog tshwm sim los ntawm kev sib tsoo ntawm cov hluav taws xob nrawm, ua rau cov hluav taws xob sab nraud ntawm cov molecules thiab atoms, thiab tsim cov ions, los yog cov tshuaj dawb radicals heev.Yog li cov ions tshwm sim, cov dawb radicals tsis tu ncua sib tsoo thiab nrawm los ntawm lub zog hluav taws xob, kom nws sib tsoo nrog cov khoom siv, thiab rhuav tshem cov molecular bonds nyob rau hauv ntau ntawm ntau microns, induces txo qis ntawm tej thickness, generates bumpy. nto, thiab tib lub sij hawm tsim cov kev hloov pauv ntawm lub cev thiab tshuaj lom neeg ntawm qhov chaw xws li kev ua haujlwm ntawm cov pa roj, txhim kho tooj liab-plated bonding quab yuam, decontamination thiab lwm yam teebmeem.

Oxygen, nitrogen, thiab Teflon gas feem ntau yog siv rau hauv cov ntshav saum toj no.

Plasma processing siv hauv PCB teb

• Qhov phab ntsa dent tom qab drilling, tshem tawm lub qhov phab ntsa drilling av;
• Tshem tawm cov carbide tom qab laser drilling qhov muag tsis pom qhov;
• Thaum ua cov kab zoo, cov seem ntawm cov zaj duab xis qhuav raug tshem tawm;
• Qhov saum npoo ntawm lub qhov phab ntsa yog qhib ua ntej cov khoom siv Teflon tso rau hauv tooj liab;
• Nto qhib ua ntej lub puab phaj lamination;
• Kev ntxuav ua ntej dab dej kub;
• Surface activation ua ntej ziab thiab vuam zaj duab xis.
• Hloov cov duab puab sab hauv thiab ntub dej, txhim kho interlayer binding quab yuam;
• Tshem tawm corrosion inhibitors thiab vuam zaj duab xis residues;

Daim duab sib piv ntawm cov teebmeem tom qab ua tiav

1. Hydrophilic txhim kho kev sim

2. Copper-plated SEM hauv RF-35 daim ntawv qhov ua ntej thiab tom qab kev kho ntshav plasma

3. Copper deposition rau saum npoo ntawm PTFE Base board ua ntej thiab tom qab hloov ntshav plasma

4. Lub ntsej muag lub ntsej muag ntawm lub ntsej muag ntawm PTFE lub hauv paus board ua ntej thiab tom qab hloov ntshav plasma

Kev piav qhia ntawm plasma action

1, Ua kom muaj kev kho mob ntawm cov khoom siv Teflon

Tab sis txhua tus engineers uas tau koom nrog hauv metallization ntawm polytetrafluoroethylene cov ntaub ntawv qhov muaj qhov kev paub no: kev siv cov khoom zoo tib yam. FR-4 multi-layer luam tawm Circuit Board qhov metalization txheej txheem, tsis ua tiav PTFE qhov metalization.Ntawm lawv, kev kho mob ua ntej ntawm PTFE ua ntej cov tshuaj tooj liab deposition yog ib qho nyuaj heev thiab cov kauj ruam tseem ceeb.Nyob rau hauv kev kho mob ntawm PTFE khoom ua ntej tshuaj tooj liab deposition, muaj ntau txoj kev yuav siv tau, tab sis nyob rau hauv tag nrho, nws muaj peev xwm lav qhov zoo ntawm cov khoom, haum rau loj ntau lawm lub hom phiaj yog cov nram qab no ob:

a) Cov txheej txheem ua tshuaj: hlau sodium thiab radon, cov tshuaj tiv thaiv hauv cov kuab tshuaj uas tsis yog dej xws li tetrahydrofuran lossis glycol dimethyl ether tov, tsim cov nio-sodium complex, sodium kho tshuaj, tuaj yeem ua rau saum npoo atoms ntawm Teflon nyob rau hauv qhov yog impregnated, kom ua tiav lub hom phiaj ntawm wetting lub qhov phab ntsa.Qhov no yog ib txoj kev raug, cov nyhuv zoo, ruaj khov zoo, yog dav siv.

b) Txoj kev kho plasma: cov txheej txheem no yooj yim rau kev khiav lag luam, ruaj khov thiab txhim khu kev ua haujlwm zoo, tsim nyog rau ntau lawm, siv cov txheej txheem plasma ziab qhuav.Cov tshuaj sodium-crucible kev kho mob npaj los ntawm cov tshuaj kho cov txheej txheem yog ib qho nyuaj rau synthesize, siab toxicity, luv txee lub neej, yuav tsum tau tsim raws li qhov teeb meem ntau lawm, kev ruaj ntseg siab.Yog li ntawd, tam sim no, kev ua kom muaj kev kho mob ntawm PTFE nto, ntau txoj kev kho ntshav plasma, yooj yim rau kev khiav lag luam, thiab txo cov kev kho dej khib nyiab zoo heev.

2, Qhov phab ntsa cavitation / qhov phab ntsa resin drilling tshem tawm

Rau FR-4 multi-layer printed circuit board ua, nws CNC drilling tom qab lub qhov phab ntsa resin drilling thiab lwm yam tshuaj tshem tawm, feem ntau yog siv concentrated sulfuric acid kev kho mob, chromic acid kev kho mob, alkaline poov tshuaj permanganate kev kho mob, thiab plasma kev kho mob.Txawm li cas los xij, nyob rau hauv cov ntawv luam tawm yooj yim thiab cov ntawv luam tawm tsis yooj yim kom tshem tawm cov kev kho av drilling, vim qhov sib txawv ntawm cov khoom siv, yog tias siv cov txheej txheem kev kho tshuaj saum toj no, cov nyhuv tsis zoo, thiab kev siv cov plasma. mus laum av thiab concave tshem tawm, koj tuaj yeem tau txais lub qhov zoo ntawm phab ntsa roughness, conducive rau hlau plating ntawm lub qhov, tab sis kuj muaj "peb-seem" concave kev twb kev txuas yam ntxwv.

3, Kev tshem tawm cov carbide

Plasma txoj kev kho mob, tsis tsuas yog rau ntau yam ntawm daim ntawv drilling cov pa phem kev kho mob cov nyhuv yog pom tseeb, tab sis kuj rau cov khoom sib xyaw resin thiab micropores drilling cov pa phem kev kho mob, tab sis kuj qhia nws superiority.Tsis tas li ntawd, vim qhov kev xav tau ntau ntxiv rau cov txheej txheej ntau txheej luam tawm Circuit Court boards nrog kev sib txuas siab ceev, ntau qhov drilling qhov muag tsis pom qhov yog tsim los ntawm laser technology, uas yog cov khoom ntawm laser drilling qhov muag tsis pom qhov siv - carbon, uas yuav tsum tau. raug tshem tawm ua ntej qhov txheej txheem metallization.Lub sijhawm no, plasma kho tshuab, tsis muaj hesitation los ua lub luag haujlwm ntawm kev tshem cov pa roj carbon.

4, Internal pre-processing

Vim tias qhov kev xav tau ntau ntxiv ntawm ntau cov ntawv luam tawm hauv Circuit Court, cov txheej txheem kev siv thev naus laus zis kuj tseem siab dua thiab siab dua.Lub sab hauv pretreatment ntawm saj zawg zog luam ntawv Circuit Court board thiab rigid saj zawg zog luam Circuit Court board yuav ua rau kom nto roughness thiab ua kom tiav degree, nce lub binding quab yuam ntawm puab txheej, thiab kuj tseem muaj qhov tseem ceeb heev los txhim kho cov yield ntawm ntau lawm.

Qhov zoo thiab qhov tsis zoo ntawm kev ua plasma

Plasma processing yog ib txoj hauv kev yooj yim, ua tau zoo thiab muaj txiaj ntsig zoo rau kev tshem tawm thiab rov qab etching ntawm cov ntawv luam tawm Circuit Board.Kev kho ntshav ntshav tshwj xeeb yog tsim rau cov ntaub ntawv Teflon (PTFE) vim tias lawv tsis tshua muaj tshuaj lom neeg thiab kev kho ntshav plasma ua haujlwm.Los ntawm lub tshuab hluav taws xob high-frequency (xws li 40KHZ), plasma technology yog tsim los ntawm kev siv lub zog ntawm hluav taws xob los cais cov roj ua haujlwm hauv lub tshuab nqus tsev.Cov no txhawb nqa cov roj sib cais tsis ruaj khov uas hloov kho thiab foob pob rau saum npoo.Kev kho cov txheej txheem xws li kev ntxuav UV zoo, ua kom muaj zog, noj thiab sib txuas, thiab plasma polymerization yog lub luag haujlwm ntawm plasma nto kho.Plasma processing txheej txheem yog ua ntej drilling tooj liab, feem ntau yog kev kho cov qhov, cov txheej txheem plasma dav dav yog: drilling - plasma kho - tooj liab.Kev kho ntshav ntshav tuaj yeem daws cov teeb meem ntawm lub qhov qhov, qhov seem seem, cov hluav taws xob tsis zoo ntawm cov txheej tooj liab sab hauv thiab tsis txaus corrosion.Tshwj xeeb, kev kho plasma tuaj yeem tshem tawm cov residues ntawm cov txheej txheem drilling, tseem hu ua drilling paug.Nws cuam tshuam qhov kev sib txuas ntawm lub qhov tooj liab mus rau sab hauv tooj liab txheej thaum lub sij hawm metalization.Txhawm rau txhim kho lub zog sib khi ntawm plating thiab cob, fiberglass thiab tooj liab, cov slags yuav tsum tau muab tshem tawm kom huv.Yog li, plasma degluing thiab kev kho corrosion xyuas kom muaj kev sib txuas hluav taws xob tom qab tooj liab deposition.

Plasma machines feem ntau muaj cov chav ua haujlwm uas muaj nyob rau hauv lub tshuab nqus tsev thiab nyob nruab nrab ntawm ob daim hlau electrode, uas txuas nrog lub tshuab hluav taws xob RF los tsim cov plasmas ntau hauv chav ua haujlwm.Hauv chav ua haujlwm nruab nrab ntawm ob daim hlau electrode, qhov chaw sib npaug muaj ob peb khub ntawm daim npav sib txawv los tsim ib qho chaw nyob rau ntau lub gram tuaj yeem ua kom haum rau cov plasma ua cov khoom siv hluav taws xob.Nyob rau hauv cov txheej txheem plasma uas twb muaj lawm ntawm PCB pawg thawj coj saib, thaum PCB substrate muab tso rau hauv lub tshuab plasma rau plasma processing, PCB substrate feem ntau muab tso rau ntawm tus txheeb ze daim npav qhov ntawm lub plasma processing chamber (piv txwv li, lub compartment uas muaj cov plasma processing. Circuit Board), cov plasma yog siv los ua cov ntshav rau cov ntshav plasma kho ntawm lub qhov ntawm PCB substrate los txhim kho cov dej noo ntawm lub qhov.

Plasma tshuab ua cov kab noj hniav yog qhov me me, yog li ntawd, feem ntau ntawm ob lub phaj electrode ua chamber yog teeb tsa nrog plaub khub ntawm daim npav phaj phaj, uas yog, tsim ntawm plaub lub blocks tuaj yeem ua kom haum rau plasma ua lub rooj tsav xwm vaj huam sib luag chaw nyob.Feem ntau, qhov loj ntawm txhua daim phiaj ntawm qhov chaw nyob yog 900mm (ntev) x 600mm (qhov siab) x 10mm (dav, piv txwv li lub thickness ntawm lub rooj tsavxwm), raws li cov txheej txheem PCB plasma uas twb muaj lawm, txhua lub sij hawm plasma processing board. muaj lub peev xwm ntawm kwv yees li 2 lub tiaj tus (900mm x 600mm x 4), thaum txhua lub sijhawm ua haujlwm plasma yog 1.5 teev, yog li muab ib hnub muaj peev xwm ntawm 35 square meters.Nws tuaj yeem pom tau tias lub peev xwm ua haujlwm ntawm cov plasma ntawm PCB pawg thawj coj tsis yog siab los ntawm kev siv cov txheej txheem plasma ntawm lub rooj tsav xwm PCB uas twb muaj lawm.

Cov ntsiab lus

Plasma kev kho mob yog siv nyob rau hauv high-frequency phaj, HDI , tawv thiab mos ua ke, tshwj xeeb tshaj yog tsim rau Teflon (PTFE) cov ntaub ntawv.Tsis tshua muaj peev xwm ntau lawm, tus nqi siab kuj yog nws qhov tsis zoo, tab sis cov txiaj ntsig kho ntshav plasma kuj tseem pom tseeb, piv rau lwm txoj kev kho saum npoo, nws nyob rau hauv kev kho mob ntawm Teflon activation, txhim kho nws cov hydrophilicity, kom ntseeg tau tias metallization ntawm qhov, laser qhov kho, Kev tshem tawm ntawm precision kab residual qhuav zaj duab xis, roughing, pre-reinforcement, vuam thiab silkscreen cim pretreatment, nws zoo yog irreplaceable, thiab kuj muaj huv si, ib puag ncig tus phooj ywg yam ntxwv.