IPC-6012, SMB-SMT Ebipụtara bọọdụ sekit nwere oke agha ma ọ bụ ntụgharị nke 0.75%, na bọọdụ ndị ọzọ anaghị agafe 1.5%;akwụkwọ ikike ikike (okpukpu abụọ / multi-layer) nke ụlọ mgbakọ eletrọnịkị na-abụkarị 0.70 ---0.75%, (1.6mm ọkpụrụkpụ) N'ezie, ọtụtụ bọọdụ dị ka bọọdụ SMB na BGA chọrọ warpage na-erughị 0.5%;ụfọdụ ụlọ ọrụ ọbụna ihe na-erughị 0.3%;PC-TM-650 2.4.22B

Usoro mgbako nke ibe = warpage dị elu/ogologo ihu ihu
Ụlọ ọrụ sekit bọọdụ batrị na-akuziri gị otu esi egbochi iwepụta bọọdụ sekit:

1. Engineering design: nhazi nke interlayer prepreg kwesịrị ikwekọrịta;bọọdụ isi nke multi-layer na prepreg kwesịrị iji otu ngwaahịa ndị na-eweta ngwaahịa;mpaghara eserese elu C/S dị n'elu kwesịrị ịdị nso dị ka o kwere mee, enwere ike iji grids nọọrọ onwe ya;

2. Baking osisi tupu ịcha
N'ozuzu, ogo 150 maka awa 6-10, wepụ mmiri dị n'ime osisi ahụ, mee ka resin gwọọ ya kpamkpam, ma wepụ nchekasị na osisi;ịsa osisi ahụ tupu ịchachaa, ma ọ bụ oyi akwa dị n'ime ma ọ bụ n'akụkụ abụọ achọrọ!

3. Lezienụ anya na warp na weft direction nke akwụkwọ a gwọrọ tupu ịdokọta osisi multilayer:
Ogo nke warp na weft shrinkage dị iche.Lezienụ anya na warp na weft direction tupu ibelata prepreg mpempe akwụkwọ;ṅaa ntị na warp na weft direction mgbe ị na-egbutu isi osisi;n'ozuzu ọgwụgwọ mpempe akwụkwọ mpịakọta direction bụ warp direction;ogologo ntụziaka nke ọla kọpa clad laminate bụ warp direction;10 n'ígwé 4OZ Ike oké ọla kọpa efere

4. Laminating oké iji kpochapụ nchekasị, oyi na-atụ mgbe ịpịrị osisi ahụ, ewepụtụ burrs;

5. Baking osisi tupu mkpọpu: 150 degrees maka 4 awa;

6. Ọ kachasị mma ka ị ghara ịchacha efere dị mkpa n'ụzọ igwe, a na-akwadokwa ihicha kemịkal;A na-eji ihe ndozi pụrụ iche eme ihe n'oge electroplating iji gbochie efere ahụ na-ehulata na mpịachi

7. Mgbe ịgbasa tin, jụụ ndammana ka ụlọ okpomọkụ na larịị mabul ma ọ bụ ígwè efere ma ọ bụ dị ọcha mgbe jụrụ n'elu ihe-ikuku-ese n'elu akwa;