Ho chesa ha thepa, e tsejoang hape e le ho lieha ha lelakabe, ho itima, ho hanyetsa lelakabe, ho hanyetsa lelakabe, ho hanyetsa mollo, ho chesa le ho chesa tse ling, ke ho hlahloba bokhoni ba thepa ea ho hanela ho tuka.

Mohlala oa thepa e tukang o hotetsoa ka lelakabe le fihlelang litlhoko, 'me lelakabe le tlosoa ka mor'a nako e behiloeng.Boemo ba ho chesa bo hlahlojoa ho latela tekanyo ea ho tuka ha sampuli.Ho na le mekhahlelo e meraro.Mokhoa oa tlhahlobo o otlolohileng oa sampole o arotsoe ka FH1, FH2, FH3 boemo ba boraro, mokhoa oa tlhahlobo o otlolohileng o arotsoe ka FV0, FV1, VF2.
E tiileng Boto ea PCB e arotsoe ka boto ea HB le boto ea V0.

Letlapa la HB le na le ho lieha ha lelakabe le tlase 'me le sebelisoa haholo bakeng sa liboto tse nang le lehlakore le le leng.VO board e na le ho lieha ho hoholo ha lelakabe.E sebelisoa haholo bakeng sa mapolanka a mahlakoreng a mabeli le a mangata a finyellang litlhoko tsa litekanyetso tsa mollo oa V-1.Mofuta ona oa boto ea PCB e fetoha boto ea FR-4.V-0, V-1, le V-2 ke limaraka tse sa cheng.

Boto ea potoloho e tlameha ho mamella lelakabe, e ke ke ea chesa mocheso o itseng, empa e ka nolofatsoa feela.Mocheso ka nako ena o bitsoa mocheso oa phetoho ea khalase (Tg ntlha), 'me boleng bona bo amana le botsitso ba dimensional ba boto ea PCB.

Boto ea potoloho e phahameng ea Tg PCB le melemo ea ho sebelisa Tg PCB e phahameng ke efe?
Ha mocheso oa boto e hatisitsoeng ea Tg e phahameng e nyolohela sebakeng se itseng, substrate e tla fetoha ho tloha "boemo ba khalase" ho ea "boemo ba rabara".Mocheso ka nako ena o bitsoa mocheso oa phetoho ea khalase (Tg) ea boto.Ka mantsoe a mang, Tg ke mocheso o phahameng ka ho fetisisa oo substrate e bolokang botsitso.

Ke mefuta efe e khethehileng ea liboto tsa PCB?
E arotsoe ka sehlopha ho tloha tlase ho ea holimo ka tsela e latelang:

94HB - 94VO - 22F - CEM-1 - CEM-3 - FR-4 e hlalositsoe ka botlalo ka tsela e latelang: 94HB: k'hateboto e tloaelehileng, eseng e sa chese mollo (thepa ea maemo a tlase, e ke ke ea sebelisoa e le boto ea motlakase) 94V0: khateboto e nang le lelakabe (mold Punching) 22F: Boto ea fiberglass e lehlakoreng le le leng (die punching) CEM-1: Boto ea fiberglass e lehlakoreng le le leng (e tlameha ho chekoa ka komporo, e se ke ea shoa ho otla) CEM-3: Boto ea fiberglass e mahlakoreng a mabeli ( ntle le ka mahlakoreng a mabeli Cardboard ke thepa e tlase-tlase bakeng sa liboto tse mahlakoreng a mabeli. Mapolanka a bonolo a mahlakoreng a mabeli a ka sebelisa thepa ena, e theko e tlaase ka 5~10 yuan/square meter ho feta FR-4.)

FR-4: Boto ea fiberglass e mahlakoreng a mabeli

Boto ea potoloho e tlameha ho mamella lelakabe, e ke ke ea chesa mocheso o itseng, empa e ka nolofatsoa feela.Mocheso ka nako ena o bitsoa mocheso oa phetoho ea khalase (Tg ntlha), 'me boleng bona bo amana le botsitso ba dimensional ba boto ea PCB.

Boto ea potoloho ea Tg PCB e phahameng ke eng le melemo ea ho sebelisa Tg PCB e phahameng

Ha mocheso o nyolohela sebakeng se itseng, substrate e tla fetoha ho tloha "khalase" ho "rubbery", 'me mocheso ka nako ena o bitsoa mocheso oa phetoho ea khalase (Tg) ea poleiti.Ka mantsoe a mang, Tg ke mocheso o phahameng ka ho fetisisa (°C) oo substrate e bolokang botsitso.

Ka mantsoe a mang, lisebelisoa tse tloaelehileng tsa substrate tsa PCB ha li hlahise feela ho nolofatsa, deformation, ho qhibiliha le liketsahalo tse ling ka mocheso o phahameng, empa hape li bontša ho fokotseha ho hoholo ha mekhoa ea mechine le ea motlakase (ke nahana hore ha u batle ho bona lihlopha tsa mapolanka a PCB). 'me u bone boemo bona lihlahisoa tsa hau. ).

Tg plate e akaretsang e feta likhato tse 130, Tg e phahameng ka kakaretso e feta likhato tse 170, 'me Tg e mahareng e ka ba likhato tse fetang 150.

Hangata mapolanka a hatisitsoeng a PCB a nang le Tg ≥ 170 ° C a bitsoa liboto tse hatisitsoeng tse phahameng tsa Tg.Ha Tg ea substrate e ntse e eketseha, ho hanyetsa mocheso, ho hanyetsa mongobo, ho hanyetsa lik'hemik'hale, botsitso le litšobotsi tse ling tsa boto e hatisitsoeng li tla ntlafatsoa le ho ntlafatsoa.Ha boleng ba TG bo phahame, ho molemo ho hanyetsa mocheso oa boto, haholo-holo ts'ebetsong e se nang loto, moo likopo tse phahameng tsa Tg li atileng haholo.

Tg e phahameng e bolela ho hanyetsa mocheso o phahameng.Ka tsoelo-pele e potlakileng ea indasteri ea elektronike, haholo-holo lihlahisoa tsa elektronike tse emeloang ke lik'homphieutha, nts'etsopele ea ts'ebetso e phahameng le li-multilayer tse phahameng li hloka ho hanyetsa mocheso o phahameng oa thepa ea substrate ea PCB e le tiiso ea bohlokoa.Ho hlaha le nts'etsopele ea mahlale a phahameng a matla a phahameng a emeloang ke SMT le CMT a entse hore li-PCB li se ke tsa aroloa le ho feta ho ts'ehetso ea mocheso o phahameng oa li-substrates mabapi le lesoba le lenyenyane, lithapo tse ntle, le ho fokotsa.

Ka hona, phapang pakeng tsa kakaretso ea FR-4 le Tg FR-4 e phahameng: e sebakeng se chesang, haholo-holo ka mor'a ho kenngoa ha mongobo.
Tlas'a mocheso, ho na le phapang pakeng tsa matla a mochine, botsitso ba litekanyo, ho khomarela, ho kenngoa ha metsi, ho senyeha ha mocheso, le ho atolosoa ha mocheso oa thepa.Lihlahisoa tse phahameng tsa Tg ho hlakile hore li betere ho feta lisebelisoa tse tloaelehileng tsa PCB substrate.Lilemong tsa morao tjena, palo ea bareki ba hlokang tlhahiso ea liboto tse hatisitsoeng tse phahameng tsa Tg e eketsehile selemo le selemo.

Ka tsoelo-pele le tsoelo-pele e tsoelang pele ea thekenoloji ea elektronike, litlhoko tse ncha li lula li behiloe pele bakeng sa lisebelisoa tsa substrate tsa potoloho tse hatisitsoeng, ka tsela eo li khothalletsa tsoelo-pele e tsoelang pele ea litekanyetso tsa koporo tsa laminate.Hona joale, litekanyetso tse ka sehloohong tsa thepa ea substrate ke tse latelang.

① Maemo a Naha Hajoale, maemo a naha ea heso bakeng sa ho hlophisoa ha lisebelisoa tsa PCB bakeng sa lisebelisoa tsa substrate li kenyelletsa GB/T4721-47221992 le GB4723-4725-1992.Tekanyetso ea koporo e entsoeng ka laminate ea Taiwan, Chaena ke tekanyetso ea CNS, e itšetlehileng ka maemo a Japanese JIs., E lokollotsoe ka 1983.
②Litekanyetso tse ling tsa naha li kenyelletsa: Litekanyetso tsa Japane tsa JIS, American ASTM, NEMA, MIL, IPc, ANSI, UL standards, British Bs standards, German DIN le VDE standards, French NFC le UTE Standards, le Canadian CSA Standards, AS standards Australia, FOCT maemo a mehleng ea Soviet Union, litekanyetso tsa machaba tsa IEC, joalo-joalo.

Barekisi ba thepa ea mantlha ea moralo oa PCB ba tloaelehile ebile ba sebelisoa hangata: Shengyi \ Jiantao \ International, jj.

● Litokomane tse amohelehang: protel autocad powerpcb orcad gerber kapa boto ea sebele ea kopi, joalo-joalo.

● Mefuta ea boto: CEM-1, CEM -3 FR4, thepa e phahameng ea TG;

● Boholo bo boholo ba boto: 600mm*700mm (24000mil*27500mil)

● Botenya ba boto ea ho sebetsa: 0.4mm-4.0mm (15.75mil-157.5mil)

● Maemo a phahameng a ho sebetsa: 16Layers

● Copper foil layer Botenya: 0.5-4.0 (oz)

● E qetile ho mamella botenya ba boto: +/-0.1mm (4mil)

● Ho theha boemo ba mamello: ho sila komporo: 0.15mm (6mil) Die punching plate: 0.10mm (4mil)

● Bophara bo fokolang ba mola/sebaka :0.1mm(4mil) Bokhoni ba ho laola bophara ba mola: <+-20%

● Bophahamo bo fokolang ba lesoba la ho cheka sehlahisoa se feliloeng: 0.25mm (10mil) Bonyane ba lesoba la ho phunya sehlahisoa se felileng: 0.9mm (35mil) Mamello ea bophara ba lesoba la sehlahisoa se felileng: PTH: +-0.075mm( 3mil) NPTH +-0.05mm(2mil)

● Botenya ba lesoba la lesoba la koporo: 18-25um (0.71-0.99mil)

● Nako e fokolang ea sebaka sa SMT: 0.15mm (6mil)

● Ho roala holim'a metsi: khauta e qoelisoang ka lik'hemik'hale, sefafatsi sa tin , Boto kaofela ke khauta e kentsoeng ka nickel (metsi / khauta e bonolo), sekhomaretsi sa silika se putsoa, ​​joalo-joalo.

● Botenya ba mask a solder holim'a boto: 10-30μm (0.4-1.2mil)

● Matla a ho ebola: 1.5N/mm (59N/mil)

● Resistance Solder filimi e thata: > 5H

● Solder resistance plug hole capacity: 0.3-0.8mm (12mil-30mil)

● Dielectric kamehla: ε = 2.1-10.0

● Ho hanyetsa mocheso: 10KΩ-20MΩ

● Tšitiso ea sebopeho: 60 ohm±10%

● Thermal shock : 288℃, 10 sec

● Warpage ea boto e felileng: <0.7%

● Sesebelisoa sa sehlahisoa: lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa, sistimi ea boemo ba lefatše, komporo, MP4, phepelo ea motlakase, lisebelisoa tsa lapeng, jj.

Ho latela lisebelisoa tsa matlafatso tsa boto ea PCB, hangata e arotsoe ka mefuta e latelang:
1. Phenolic PCB pampiri substrate
Hobane mofuta ona oa boto ea PCB e entsoe ka makhasi a pampiri, makhasi a lehong, joalo-joalo, ka linako tse ling e fetoha khateboto, boto ea V0, boto e thibelang mollo le 94HB, joalo-joalo. e entsoeng ka khatello ea phenolic resin.poleiti.Mofuta ona oa substrate oa pampiri ha o kenelle mollong, o ka thunngoa, o na le litšenyehelo tse tlase, theko e tlase, le letsoalo le tlase.Re atisa ho bona likaroloana tsa pampiri tsa phenolic tse kang XPC, FR-1, FR-2, FE-3, joalo-joalo 'Me 94V0 ke ea pampiri e thibelang mollo, e sa cheng.

2. Composite PCB substrate
Mofuta ona oa boto ea phofo o boetse o bitsoa "powder board", e nang le pampiri ea makhasi a lehong kapa pampiri ea fiber ea k'hothone e le thepa e matlafatsang, le lesela la fiber ea khalase e le lisebelisoa tse matlafatsang ka nako e le 'ngoe.Lisebelisoa tsena tse peli li entsoe ka resin ea epoxy e thibelang mollo.Ho na le lehlakore le le leng halofo ea khalase ea fiber 22F, CEM-1 le mahlakore a mabeli a halofo ea khalase ea fiberboard CEM-3, eo har'a eona CEM-1 le CEM-3 e leng li-laminates tse entsoeng ka koporo tse nang le likarolo tse ngata.

3. Khalase fiber PCB substrate
Ka linako tse ling e boetse e fetoha boto ea epoxy, khalase ea fiber board, FR4, fiber board, joalo-joalo E sebelisa resin ea epoxy e le sekhomaretsi le lesela la khalase e le lisebelisoa tse matlafatsang.Mofuta ona oa boto ea potoloho o na le mocheso o phahameng oa ho sebetsa 'me ha o amehe ke tikoloho.Mofuta ona oa boto e atisa ho sebelisoa ka habeli mahlakoreng a PCB, empa theko e theko e boima ho feta composite PCB substrate, 'me botenya tloaelehileng ke 1.6MM.Mofuta ona oa substrate o loketse liboto tse fapaneng tsa phepelo ea motlakase, liboto tsa potoloho tse maemong a holimo, 'me o sebelisoa haholo likhomphutha, lisebelisoa tsa peripheral le lisebelisoa tsa puisano.

FR-4

4. Ba bang