Thepa e ka sehloohong ea PCB ea ho tjhaja waelese ea koloi ke koporo clad laminate, le koporo clad laminate (copper clad laminate) e entsoe ka substrate, koporo foil le sekhomaretsi.The substrate ke insulating laminate entsoe ka polymer synthetic resin le thepa e matlafatsang;bokaholimo ba substrate bo koahetsoe ka lera la foil e hloekileng ea koporo e nang le conductivity e phahameng le weldability e ntle, 'me botenya bo tloaelehileng ke 18μm ~ 35μm ~ 50μm;foil koporo e koahetsoeng ka substrate The koporo clad laminate ka lehlakoreng le leng o bitsoa single-lehlakoreng koporo clad laminate, le koporo clad laminate le mahlakoreng a mabeli a substrate koahetsoeng ka koporo foil bitsoa habeli mahlakoreng koporo clad laminate.Ebang foil ea koporo e ka koaheloa ka thata holim'a substrate e phethoa ke sekhomaretsi.Li-laminate tsa koporo tse sebelisoang ka tloaelo li na le litekanyo tse tharo: 1.0mm, 1.5mm le 2.0mm.
Ke mefuta efe ea li-laminate tsa koporo 1. Ho ea ka ho tsieleha ha mochine oa laminate ea koporo ea koporo, e ka aroloa ka: laminate e thata ea koporo (Rigid Copper Clad Laminate) le laminate e bonolo ea koporo (Flexible Copper Clad Laminate). 2. Ho ea ka lisebelisoa tse fapaneng tsa insulating le mehaho, e ka aroloa ka: organic resin CCL, CCL e thehiloeng ka tšepe, le CCL e thehiloeng ka ceramic. 3. Ho ea ka botenya ba koporo e apereng laminate, e ka aroloa ka: poleiti e teteaneng [botenya ba 0.8 ~ 3.2mm (ho akarelletsa le Cu)], poleiti e tšesaane [botenya bo ka tlaase ho 0.78mm (ntle le Cu)]. 4. Ho ea ka thepa e matlafatsang ea koporo e apereng laminate, e arotsoe ka: lesela la khalase ea lesela la koporo e entsoeng ka koporo, pampiri ea botlaaseng ba koporo e entsoeng ka koporo, e entsoeng ka koporo e entsoeng ka koporo (CME-1, CME-2). 5. Ho ea ka lelakabe la lelakabe la retardant, le arotsoe ka: boto e thibelang mollo le boto e sa chesehang. 6. Ho ea ka litekanyetso tsa UL (UL94, UL746E, joalo-joalo), limaraka tse thibelang lelakabe tsa CCL li arotsoe, 'me CCL e thata e ka aroloa ka lihlopha tse' nè tse fapaneng tse thibelang lelakabe: UL-94V0, UL-94V1, UL-94V2 Sehlopha le Sehlopha sa UL-94HB.
Mefuta e tloaelehileng le litšoaneleho tsa li-laminate tsa koporo 1. Copper-clad phenolic paper laminate ke sehlahisoa sa laminated se entsoeng ka insulating impregnated paper (TFz-62) kapa cotton fiber impregnated paper (1TZ-63) e kenngoeng ka phenolic resin le ho hatelloa ka ho chesa.Letlapa le le leng la lesela le se nang alkali le kenngoeng ka khalase, lehlakoreng le leng le koahetsoeng ka foil ea koporo.Haholo-holo e sebelisoa e le liboto tsa potoloho lisebelisoa tsa seea-le-moea. 2. Copper-clad phenolic glass cloth laminate ke sehlahisoa sa laminated se entsoeng ka lesela la khalase le se nang alkali le kenngoa ka epoxy phenolic resin le ho hatelloa ka ho chesa.E 'ngoe kapa mahlakoreng a mabeli a koahetsoe ka foil ea koporo, e nang le boima bo bobebe, thepa ea motlakase le ea mechine.E ntle, e bonolo ho sebetsa le melemo e meng.Bokaholimo ba boto bo mosehla o bobebe.Haeba melamine e sebelisoa e le moemeli oa phekolo, bokaholimo ba boto bo tla ba botala bo khanyang le pepenene e ntle.E sebelisoa haholo-holo e le boto ea potoloho lisebelisoa tsa seea-le-moea tse nang le mocheso o phahameng oa ho sebetsa le maqhubu a sebetsang. 3. Copper-clad PTFE laminate ke laminate ea koporo e entsoeng ka PTFE e le substrate, e koahetsoeng ka koporo ea koporo le ho hatelloa ka ho chesa.E sebelisoa haholo-holo bakeng sa PCB ka mela e phahameng-frequency le ultra-high-frequency lines. 4. Copper-clad epoxy glass cloth laminate ke ntho e tloaelehileng e sebelisoang bakeng sa liboto tsa potoloho tse entsoeng ka tšepe. 5. Filimi e bonolo ea polyester e entsoeng ka koporo ke ntho e entsoeng ka hlobo e entsoeng ka filimi ea polyester le koporo e chesang e chesang.E phuthoa ka sebopeho sa spiral mme e behiloe ka har'a sesebelisoa nakong ea kopo.E le ho matlafatsa kapa ho thibela mongobo, hangata e tšeloa ka botlalo ka epoxy resin.E sebelisoa haholo-holo bakeng sa liboto tsa potoloho tse tenyetsehang le likhoele tse hatisitsoeng, 'me e ka sebelisoa e le mohala oa phetoho bakeng sa lihokelo. Hajoale, li-laminate tsa koporo tse fanoang 'marakeng li ka aroloa ka mekhahlelo e latelang ho latela pono ea thepa ea motheo: substrate ea pampiri, lesela la lesela la khalase, substrate ea masela a maiketsetso, substrate ea masela a sa lohiloeng, le substrate e kopaneng.
Lisebelisoa tse sebelisoang ka tloaelo bakeng sa li-laminate tsa koporo FR-1——phenolic cotton paper, this base material is usually called bakelite (more economical than FR-2) FR-2——phenolic cotton paper FR-3——cotton paper (Cotton paper), epoxy resin FR-4— - Lesela la khalase (Khalase e lohiloeng), epoxy resin FR-5——lesela la khalase, epoxy resin FR-6——khalase e halikiloeng, polyester G-10——lesela la khalase, epoxy resin CEM-1— ——pampiri ea lisele, epoxy resin (lelakabe la malakabe) CEM-2——pampiri ea lithane, resin ea epoxy (e sa cheseng mollo) CEM-3—lesela la khalase, lesela la epoxy CEM-4——lesela la khalase, lesela la epoxy CEM -5——lesela la khalase, polyester AIN ——aluminium hydride SIC——silicon carbide 
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