IPC-6012, SMB-SMT Ishicilelwe iibhodi zesekethe babe ne-warpage ephezulu okanye i-twist ye-0.75%, kunye nezinye iibhodi ngokubanzi azidluli kwi-1.5%;i-warpage evumelekileyo (i-double-side / multi-layer) yeplanti ye-electronic assembly idla ngokuba yi-0.70 ---0.75%, (1.6mm ubukhulu) Enyanisweni, iibhodi ezininzi ezifana neebhodi ze-SMB kunye ne-BGA zifuna i-warpage engaphantsi kwe-0.5%;ezinye iifektri nangaphantsi kwe-0.3%;I-PC-TM-650 2.4.22B

Indlela yokubala ye-Warpage = ubude bephepha le-warpage / ubude bomphetho ogobileyo
Umzi-mveliso webhodi yesekethe yebhetri ukufundisa indlela yokuthintela impi yebhodi yesekethe:

1. Uyilo lobunjineli: ulungiselelo lwe-interlayer prepreg kufuneka luhambelane;ibhodi engundoqo enamaleko amaninzi kunye ne-prepreg kufuneka isebenzise imveliso yomboneleli ofanayo;indawo yegraphics yangaphandle yeC/S kufuneka isondele kangangoko, kwaye iigridi ezizimeleyo zingasetyenziswa;

2. Ibhodi yokubhaka ngaphambi kokusika
Ngokuqhelekileyo ii-degrees ze-150 kwiiyure ze-6-10, susa umswakama ebhodini, uqhubeke wenze i-resin iphilise ngokupheleleyo, kwaye uphelise uxinzelelo ebhodini;ukubhaka ibhodi ngaphambi kokusika, nokuba i-layer yangaphakathi okanye macala omabini ayadingeka!

3. Nika ingqalelo kwi-warp kunye ne-weft direction yephepha elinyangisiweyo ngaphambi kokupakisha ibhodi ye-multilayer:
I-warp kunye ne-weft shrinkage ratio yahlukile.Nika ingqalelo kwi-warp kunye ne-weft direction ngaphambi kokusika iphepha le-prepreg;nikela ingqalelo kwi-warp kunye ne-weft direction xa usika ibhodi engundoqo;ngokubanzi i-curring sheet roll direction yi-warp direction;ulwalathiso olude lwe-laminate ye-copper clad yi-warp direction;Iileya ezili-10 4OZ Amandla ipleyiti yobhedu engqindilili

4. I-Laminating thick ukuphelisa uxinzelelo, ucinezelo olubandayo emva kokucofa ibhodi, nciphisa ama-burrs;

5. Ibhodi yokubhaka ngaphambi kokugaya: i-150 degrees kwiiyure ze-4;

6. Kungcono ukuba ungayifaki ngomatshini i-plate encinci, kunye nokucoca iikhemikhali kuyacetyiswa;izixhobo ezizodwa zisetyenziswa ngexesha electroplating ukuthintela ipleyiti ukugoba kunye nokusonga

7. Emva kokutshiza inkonkxa, zipholisa ngokwendalo kwiqondo lobushushu begumbi kwibhastile elisicaba okanye ipleyiti yentsimbi okanye ucoceke emva kokupholisa kwibhedi edadayo emoyeni;