Amabhodi wesifunda seCeramic empeleni zenziwe ngezinto ze-ceramic zikagesi futhi zingenziwa zibe yizimo ezihlukahlukene.Phakathi kwabo, ibhodi lesifunda se-ceramic linezici ezivelele kakhulu zokumelana nokushisa okuphezulu kanye nokufakwa kukagesi okuphezulu.Inezinzuzo zokungaguquguquki kwe-dielectric ephansi, ukulahleka kwe-dielectric ephansi, ukuhanjiswa okuphezulu kwe-thermal, ukuzinza okuhle kwamakhemikhali, kanye nama-coefficients afanayo okwanda okushisayo kwezingxenye.Ceramic ephrintiwe wesekethe amabhodi akhiqizwa kusetshenziswa laser okusheshayo kusebenze metallization ubuchwepheshe LAM.Asetshenziswa emkhakheni we-LED, amamojula anamandla aphezulu we-semiconductor, ama-semiconductor coolers, ama-heaters kagesi, amasekhethi okulawula amandla, amasekhethi ahlanganisiwe amandla, izingxenye zamandla ahlakaniphile, izinsiza zamandla ezishintshashintshayo ezihamba phambili, ukudluliselwa kwesimo esiqinile, ugesi wezimoto, ezokuxhumana, i-aerospace kanye ne-elekthronikhi yezempi. izingxenye.

Ihlukile kwendabuko I-FR-4 (i-glass fiber) , izinto ze-ceramic zinomsebenzi omuhle we-high-frequency kanye nezakhiwo zikagesi, kanye ne-conductivity ephezulu ye-thermal, ukuzinza kwamakhemikhali nokuzinza kokushisa.Izinto zokupakisha ezifanelekile zokukhiqiza amasekethe amakhulu ahlanganisiwe namamojula we-elekthronikhi wamandla.

Izinzuzo eziyinhloko:
1. Higher conductivity ezishisayo
2. Okufanayo okwengeziwe kwe-coefficient yokwandisa okushisayo
3. Ibhodi lesekethe lensimbi eliqinile, eliphansi le-alumina ceramic
4. I-solderability yezinto eziyisisekelo kuhle, futhi izinga lokushisa lokusetshenziswa liphezulu.
5. I-insulation enhle
6. Ukulahleka kwefrikhwensi ephansi
7. Hlanganisa nge-high density
8. Ayiqukethe izithako eziphilayo, imelana nemisebe ye-cosmic, inokwethenjelwa okuphezulu endaweni ye-aerospace kanye ne-aerospace, futhi inempilo ende yesevisi.
9. Ungqimba lwethusi aluqukethe ungqimba lwe-oxide futhi lungasetshenziswa isikhathi eside emkhathini wokunciphisa.

Izinzuzo zobuchwepheshe

Isingeniso senqubo yokukhiqiza ye-ceramic ephrintiwe ibhodi lesifunda ubuchwepheshe-umgodi wokubhoboza

Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi enamandla amakhulu ekuqondeni kwe-miniaturization kanye nesivinini esikhulu, i-FR-4 yendabuko, i-aluminium substrate nezinye izinto ze-substrate azisafanele ukuthuthukiswa kwamandla aphezulu namandla aphezulu.

Ngokuthuthuka kwesayensi nobuchwepheshe, ukusetshenziswa okukhaliphile kwemboni ye-PCB.Ubuchwepheshe bendabuko be-LTCC kanye ne-DBC kancane kancane buthathelwa indawo ubuchwepheshe be-DPC kanye ne-LAM.Ubuchwepheshe be-laser obumelelwe ubuchwepheshe be-LAM buhambisana kakhulu nokuthuthukiswa koxhumano oluphezulu nokuqina kwamabhodi esekethe aphrintiwe.I-Laser drilling ingaphambili kanye nobuchwepheshe bokumba obujwayelekile embonini ye-PCB.Ubuchwepheshe busebenza kahle, bushesha, bunembile, futhi bunevelu yokusebenza ephezulu.

Ibhodi lesifunda iRayMingceramic yenziwa nge-laser quick activation metallization technology.Amandla okubopha phakathi kwesendlalelo sensimbi ne-ceramic aphakeme, izakhiwo zikagesi zinhle, futhi ukushisela kungaphinda kuphindwe.Ugqinsi lwesendlalelo sensimbi lungalungiswa ebangeni le-1μm-1mm, elingafinyelela ukulungiswa kwe-L/S.20μm, ingaxhunywa ngokuqondile ukuze inikeze izixazululo ezenziwe ngokwezifiso zamakhasimende

Injabulo yangemuva yelaser ye-CO2 yasemkhathini ithuthukiswa inkampani yaseCanada.Uma kuqhathaniswa namalaser endabuko, amandla okukhiphayo aphakeme njengezikhathi eziyikhulu kuya kwenkulungwane, futhi kulula ukuwenza.

Ku-spectrum ye-electromagnetic, ifrikhwensi yomsakazo isebangeni lefrikhwensi engu-105-109 Hz.Ngokuthuthukiswa kobuchwepheshe bezempi kanye ne-aerospace, imvamisa yesibili ikhishwa.Amalaser e-RF CO2 anamandla aphansi naphakathi anokusebenza okuhle kakhulu kokushintshashintsha, amandla azinzile nokuthembeka okuphezulu kokusebenza.Izici ezifana nempilo ende.I-UV solid YAG isetshenziswa kabanzi kumapulasitiki nezinsimbi embonini ye-microelectronics.Nakuba inqubo yokumba i-CO2 laser iyinkimbinkimbi kakhulu, umphumela wokukhiqiza we-micro-aperture ungcono kunalowo we-UV eqinile ye-YAG, kodwa i-CO2 laser inezinzuzo zokusebenza kahle okuphezulu nokushaya ngesivinini esiphezulu.Ingxenye yemakethe ye-PCB laser micro-hole processing ingaba yasekhaya ukukhiqizwa kwe-laser micro-hole kusathuthuka Kulesi sigaba, azikho izinkampani eziningi ezingafakwa ekukhiqizeni.

Ukukhiqizwa kwe-laser microvia yasekhaya kusesesigabeni sokuthuthuka.Ukushaya kwenhliziyo okufushane kanye nama-laser amandla aphezulu aphezulu asetshenziselwa ukumba izimbobo kuma-substrates e-PCB ukuze kuzuzwe amandla asondelene kakhulu, ukususwa kwezinto kanye nokwakheka kwemigodi emincane.I-Ablation ihlukaniswe ngokukhipha i-photothermal kanye ne-photochemical ablation.I-Photothermal ablation ibhekisela ekuqedeni inqubo yokwakheka kwembobo ngokumuncwa okusheshayo kokukhanya kwelaser okunamandla nge-substrate material.I-Photochemical ablation isho inhlanganisela yamandla e-photon aphezulu endaweni ye-ultraviolet engaphezu kwama-electron volts angu-2 kanye ne-laser wavelength engaphezu kuka-400 nm.Inqubo yokukhiqiza ingabhubhisa ngokuphumelelayo amaketanga amade wamangqamuzana ezinto eziphilayo ukuze enze izinhlayiya ezincane, futhi izinhlayiya zingakha ngokushesha ama-micropores ngaphansi kwesenzo samandla angaphandle.

Namuhla, ubuchwepheshe be-laser drilling baseChina bunolwazi oluthile kanye nenqubekelaphambili yezobuchwepheshe.Uma kuqhathaniswa nobuchwepheshe bokugxiviza bendabuko, ubuchwepheshe be-laser drilling bunokunemba okuphezulu, isivinini esikhulu, ukusebenza kahle okuphezulu, ukubhoboza kwe-batch ngezinga elikhulu, okulungele izinto eziningi ezithambile neziqinile, ngaphandle kokulahlekelwa amathuluzi, kanye nokukhiqizwa kwemfucuza.Izinzuzo zezinto ezincane, ukuvikelwa kwemvelo futhi akukho ukungcola.

Ibhodi lesifunda se-ceramic lisebenzisa inqubo yokumba nge-laser, amandla okubopha phakathi kwe-ceramic nensimbi aphakeme, awawi, akhihlize amagwebu, njll., kanye nomphumela wokukhula ndawonye, ​​ukuphakama okuphezulu kwendawo, ukuhwala kwesilinganiso esingu-0.1 micron kuya I-micron engu-0.3, ububanzi bembobo yesiteleka nge-laser Ukusuka ku-0.15 mm ukuya ku-0.5 mm, noma ngisho no-0.06 mm.


I-Ceramic circuit board yokukhiqiza-etching

I-foil yethusi esele oqweqweni olungaphandle lwebhodi lesifunda, okungukuthi, iphethini yesifunda, igqitshwe ngaphambili ngongqimba lwe-lead-tin resist, bese ingxenye yethusi engavikelekile engeyona i-conductor iqoshwe ngamakhemikhali ukuze yakhe isifunda.

Ngokusho kwezinqubo ezihlukene zenqubo, i-etching ihlukaniswe ibe i-etching yangaphakathi ye-layer kanye ne-etching yangaphandle.I-layer etching yangaphakathi i-acid etching, ifilimu emanzi noma ifilimu eyomile m isetshenziswa njengendlela yokumelana;i-layer etching yangaphandle i-alkaline etching, futhi i-tin-lead isetshenziswa njengendlela yokumelana.Umenzeli.

Isimiso esiyisisekelo sokusabela kwe-etching

1. I-alkalization ye-asidi yethusi chloride


1, i-Acidic copper chloride alkalization

Ukuchayeka: Ingxenye yefilimu eyomile engazange ikhishwe imisebe ye-ultraviolet ichithwa yi-alkaline ebuthakathaka ye-alkaline carbonate, futhi ingxenye ye-radiated isala.

I-Etching: Ngokwengxenye ethile yesixazululo, indawo yethusi evezwe ngokuncibilikisa ifilimu eyomile noma ifilimu emanzi iyancibilika futhi igcizelelwe isixazululo se-acid copper chloride etching.

Ifilimu yokufafaza: Ifilimu evikelayo emugqeni wokukhiqiza incibilika ngenani elithile lokushisa nesivinini esithile.

I-Acidic copper chloride catalyst inezici zokulawula kalula isivinini sokuqopha, ukusebenza kahle kwe-copper etching, ikhwalithi enhle, kanye nokululama kalula kwesisombululo sokunamathisela.

2. Ukufakwa kwe-alkaline



Ukufakwa kwe-alkaline

Ifilimu yokufafaza: Sebenzisa uketshezi lwe-meringue ukuze ususe ifilimu endaweni yefilimu, uveze indawo yethusi engacutshungulwanga.

I-Etching: Isendlalelo esingezansi esingadingekile siqoshwa nge-etchant ukuze kukhishwe ithusi, kushiye imigqa ewugqinsi.Phakathi kwazo kuzosetshenziswa izinto ezisizayo.I-accelerator isetshenziselwa ukukhuthaza ukusabela kwe-oxidation nokuvimbela ukuduma kwama-ion cuprous;umuthi oxosha izinambuzane usetshenziselwa ukunciphisa ukuguguleka okuseceleni;i-inhibitor isetshenziselwa ukuvimbela ukuhlakazeka kwe-ammonia, imvula yethusi, futhi isheshise i-oxidation yethusi.

I-emulsion entsha: Sebenzisa amanzi e-monohydrate ammonia ngaphandle kwama-ion ethusi ukuze ususe okusele epuletini ngesisombululo se-ammonium chloride.

Imbobo egcwele: Le nqubo ifaneleka kuphela inqubo yokucwiliswa kwegolide.Ikakhulukazi susa ama-ion e-palladium eqile kokungaputshuziwe ngezimbobo ukuze uvimbele ama-ion egolide ukuthi angacwili enqubweni yemvula yegolide.

Ukucwecwa ithini: Isendlalelo se-tin-lead sisuswa kusetshenziswa isisombululo se-nitric acid.

Imiphumela emine ye-etching

1. Umphumela wephuli
Phakathi nenqubo yokukhiqiza etching, uketshezi luzokwenza ifilimu yamanzi ebhodini ngenxa yamandla adonsela phansi, ngaleyo ndlela kuvimbele uketshezi olusha ukuthi luthinte indawo yethusi.




2. Umphumela we-Groove
Ukunamathela kwesisombululo samakhemikhali kubangela ukuthi isisombululo samakhemikhali sinamathele egebeni eliphakathi kwepayipi kanye nepayipi, okuzoholela ekutheni kube nenani elihlukile lokuhlanganisa endaweni eminyene, kanye nendawo evulekile.




3. Umphumela wokudlula
Umuthi owuketshezi ugeleza uye phansi ngembobo, okwandisa ijubane lokuvuselela lomuthi owuketshezi eduze kwembobo yepuleti phakathi nenqubo yokunamathisela, futhi inani lokunamathisela liyakhuphuka.




4. Nozzle swing effect
Umugqa ohambisana nokuqondisa okujikijelwayo komlomo, ngoba umuthi omusha owuketshezi ungahlakaza kalula umuthi owuketshezi phakathi kwemigqa, umuthi owuketshezi ubuyekezwa ngokushesha, futhi inani lokushuba likhulu;

I-line perpendicular to the swing direction of the nozzle, ngoba uketshezi olusha lwamakhemikhali akulula ukuhlakaza umuthi owuketshezi phakathi kwemigqa, umuthi owuketshezi uvuselelwa ngesivinini esincane, futhi inani lokufaka lincane.




Izinkinga ezijwayelekile ku-etching ukukhiqiza nezindlela zokuthuthukisa

1. Ifilimu ayipheli
Ngoba ukugxila kwesiraphu kuphansi kakhulu;isivinini somugqa sishesha kakhulu;ukuvala umlomo wombhobho nezinye izinkinga kuzodala ukuthi ifilimu ingapheli.Ngakho-ke, kuyadingeka ukuhlola ukugxila kwesiraphu futhi ulungise ukugxila kwesiraphu ebangeni elifanele;lungisa isivinini kanye nemingcele ngesikhathi;bese uhlanza umlomo wombhobho.

2. Ubuso bebhodi bufakwe oxidized
Ngenxa yokuthi ukugxilwa kwesiraphu kuphezulu kakhulu futhi izinga lokushisa liphezulu kakhulu, lizokwenza ukuthi ingaphezulu lebhodi lifake i-oxidize.Ngakho-ke, kuyadingeka ukulungisa ukugxila kanye nokushisa kwesiraphu ngesikhathi.

3. I-Thetecopper ayiqediwe
Ngoba ijubane lokukhipha lishesha kakhulu;ukwakheka kwesiraphu kuchemile;indawo yethusi ingcolile;i-nozzle ivaliwe;izinga lokushisa liphansi futhi ithusi aliqediwe.Ngakho-ke, kuyadingeka ukulungisa isivinini sokudlulisa etching;hlola kabusha ukwakheka kwesiraphu;qaphela ukungcola kwethusi;hlanza i-nozzle ukuvimbela ukuvala;lungisa izinga lokushisa.

4. Ikhopha ecwebezelayo iphakeme kakhulu
Ngenxa yokuthi umshini usebenza kancane kakhulu, izinga lokushisa liphezulu kakhulu, njll., lingabangela ukugqwala kwethusi okweqile.Ngakho-ke, izinyathelo ezinjengokulungisa isivinini somshini kanye nokulungisa izinga lokushisa kufanele zithathwe.