Amakhono Ajwayelekile
- Uhlangothi Olulodwa
- Izinhlangothi Ezimbili
- I-Multi Layer
- Wangcwatshwa Nge
- Impumputhe Via
- I-Impedans Controled
- I-Micro Via
- I-Laser Drilling
- Ukuhambisana ne-RoHS
- I-epoxy igcwaliswe nges
I-PCB eqinile
Into
| Ukucaciswa
|
Izendlalelo
| 1~20
|
Ukujiya Kwebhodi
| 0.1mm-8.0mm
|
Okubalulekile
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njll.
|
Max Panel Usayizi
| 600mm×1200mm
|
Usayizi we-Min Hole
| 0.1mm
|
Ububanzi/Isikhala Somugqa Omncane
| 3mil(0.075mm)
|
Ukubekezelela Kohlaka Lwebhodi
| Ububanzi 0.10 mm
|
I-Insulation Layer Thickness
| 0.075mm-5.00mm
|
Out Layer Copper Ukuqina
| 18um--350um
|
Imbobo Yokubhoboza (Mechanical)
| 17um--175um
|
Imbobo Yokuqeda (Imishini)
| 17um--175um
|
Ukubekezelela i-Diameter (Mechanical)
| 0.05mm
|
Ukubhalisa (Okomshini)
| 0.075mm
|
I-Aspect ratio
| 16:01
|
Uhlobo Lwemaski Solder
| I-LPI
|
I-SMT Min.I-Solder Mask Width
| 0.075mm
|
Okuncane.I-Solder Mask Clearance
| 0.05mm
|
I-Plug Hole Diameter
| 0.25mm--0.60mm
|
Ukubekezelelana Kokulawulwa Kwe-Impedans
| 士10%
|
Ukuqedwa kobuso
| ENIG, OSP, HASL, Chem.Ithini/Sn, Igolide Elikhanyayo, njll
|
I-Soldermask
| Okuluhlaza/Okuphuzi/Mnyama/Mhlophe/Okubomvu/Kuluhlaza
|
Isikrini sikasilika
| Okubomvu/Okuphuzi/Mnyama/Mhlophe
|
Isitifiketi
| UL, ISO 9001, ISO14001, IATF16949
|
Isicelo esikhethekile
| Imbobo eyimpumputhe, umunwe wegolide, i-BGA, uyinki wekhabhoni, imaski ebonakalayo, inqubo ye-VIP, i-Edge plating, izimbobo ezihhafu , njll
|
Izinto zokwakha
| I-Shengyi, i-ITEQ, i-Taiyo, njll.
|
Iphakheji Elijwayelekile
| Vacuum+Ikhathoni
|
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