Ukusha kwento ethile, eyaziwa nangokuthi i-flame retardancy, ukuzicisha, ukumelana nelangabi, ukumelana nelangabi, ukumelana nomlilo, ukuvutha nokunye ukuvutha, ukuhlola ikhono lempahla ukumelana nokusha.

Isampula lento evuthayo ibaswa ngelangabi elihlangabezana nezimfuneko, futhi ilangabi liyasuswa ngemva kwesikhathi esishiwo.Izinga lokuvutha liyahlolwa ngokuya ngezinga lokusha lesampula.Kunamazinga amathathu.Indlela yokuhlola evundlile yesampula ihlukaniswe yaba yi-FH1, FH2, FH3 ileveli yesithathu, indlela yokuhlola eqondile ihlukaniswe yaba yi-FV0, FV1, VF2.
Okuqinile Ibhodi le-PCB ihlukaniswe yaba HB board kanye V0 ibhodi.

Ishidi le-HB linokuncipha komlilo okuphansi futhi lisetshenziselwa kakhulu amabhodi anohlangothi olulodwa.Ibhodi ye-VO inokubambezeleka komlilo okuphezulu.Isetshenziswa kakhulu kumabhodi anezinhlangothi ezimbili nazendlalelo eziningi ahlangabezana nezidingo zokulinganisa umlilo we-V-1.Lolu hlobo lwebhodi le-PCB luba ibhodi le-FR-4.I-V-0, V-1, kanye ne-V-2 amamaki angangeni emlilweni.

Ibhodi lesifunda kufanele likwazi ukumelana nelangabi, alikwazi ukushisa ezingeni elithile lokushisa, kodwa lingathanjiswa kuphela.Izinga lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa lokushintsha kwengilazi (iphoyinti le-Tg), futhi leli nani lihlobene nokuzinza kwe-dimensional yebhodi le-PCB.

Liyini ibhodi lesekhethi ye-Tg PCB ephezulu kanye nezinzuzo zokusebenzisa i-Tg PCB ephezulu?
Lapho izinga lokushisa lebhodi eliphrintiwe le-Tg eliphakeme likhuphukela endaweni ethile, i-substrate izoshintsha isuka "kwisimo sengilazi" ibe "isimo senjoloba".Izinga lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa le-glass transition (Tg) lebhodi.Ngamanye amazwi, i-Tg izinga lokushisa eliphakeme kakhulu lapho i-substrate igcina ukuqina.

Yiziphi izinhlobo ezithile zamabhodi e-PCB?
Ihlukaniswe ngezinga lebanga ukusuka phansi kuye phezulu kanje:

I-94HB - 94VO - 22F - CEM-1 - CEM-3 - FR-4 ichazwe ngokuningiliziwe kanje: 94HB: amakhadibhodi ajwayelekile, angashisi umlilo (into yebanga eliphansi kakhulu, i-die punching, ayikwazi ukusetshenziswa njengebhodi lamandla) 94V0: Ikhadibhodi elibushelelezi ilangabi (Ukubhoboza isikhunta) 22F: Ibhodi ye-fiberglass enohlangothi olulodwa (i-die punching) CEM-1: Ibhodi le-fiberglass elinohlangothi olulodwa (kumele libhojwe ngekhompyutha, lingafi ngokushaya) CEM-3: Ibhodi le-fiberglass elinezinhlangothi ezimbili ( ngaphandle kwe-Cardboard enezinhlangothi ezimbili iyinto ephansi kakhulu yamabhodi anezinhlangothi ezimbili. Amabhodi alula anezinhlangothi ezimbili angasebenzisa le nto, eshibhe ngo-5~10 yuan/skwele imitha kuno-FR-4.)

I-FR-4: Ibhodi ye-fiberglass enezinhlangothi ezimbili

Ibhodi lesifunda kufanele likwazi ukumelana nelangabi, alikwazi ukushisa ezingeni elithile lokushisa, kodwa lingathanjiswa kuphela.Izinga lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa lokushintsha kwengilazi (iphoyinti le-Tg), futhi leli nani lihlobene nokuzinza kwe-dimensional yebhodi le-PCB.

Liyini ibhodi lesekhethi ye-Tg PCB ephezulu kanye nezinzuzo zokusebenzisa i-Tg PCB ephezulu

Lapho izinga lokushisa likhuphuka endaweni ethile, i-substrate izoshintsha isuka "ingilazi" ibe "i-rubbery", futhi izinga lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa lokushintsha kwengilazi (Tg) yepuleti.Ngamanye amazwi, i-Tg izinga lokushisa eliphakeme kakhulu (°C) lapho i-substrate igcina ukuqina.

Okusho ukuthi, izinto ezijwayelekile ze-PCB substrate azikhiqizi kuphela ukuthambisa, ukuguqulwa, ukuncibilika nezinye izinto emazingeni okushisa aphezulu, kodwa futhi zibonisa ukwehla okukhulu kwezici zemishini nezikagesi (ngicabanga ukuthi awufuni ukubona ukuhlukaniswa kwamabhodi we-PCB futhi ubone lesi simo emikhiqizweni yakho. ).

Ipuleti le-Tg elivamile lingaphezu kwama-degree angu-130, i-Tg ephakeme ngokuvamile ingaphezu kwama-degree angu-170, kanti i-Tg emaphakathi icishe ibe ngaphezu kwama-degree angu-150.

Ngokuvamile amabhodi aphrintiwe e-PCB ane-Tg ≥ 170°C abizwa ngokuthi amabhodi aphrintiwe we-Tg aphezulu.Njengoba i-Tg ye-substrate ikhula, ukumelana nokushisa, ukumelana nomswakama, ukumelana namakhemikhali, ukuzinza nezinye izici zebhodi eliphrintiwe kuzothuthukiswa futhi kuthuthukiswe.Ukuphakama kwevelu ye-TG, kuba ngcono ukumelana nezinga lokushisa kwebhodi, ikakhulukazi kunqubo engenamthofu, lapho izicelo eziphezulu ze-Tg zivame kakhulu.

I-High Tg isho ukumelana nokushisa okuphezulu.Ngokuthuthuka okusheshayo kwemboni ye-elekthronikhi, ikakhulukazi imikhiqizo ye-elekthronikhi emelwe amakhompyutha, ukuthuthukiswa kokusebenza okuphezulu kanye nama-multilayer aphezulu kudinga ukumelana nokushisa okuphezulu kwezinto ze-PCB substrate njengesiqinisekiso esibalulekile.Ukuvela nokuthuthukiswa kobuchwepheshe bokukhweza obunokuminyana okuphezulu okumelelwe i-SMT ne-CMT kwenze ama-PCB ahluka kakhulu kusukela ekusekelweni kokumelana nokushisa okuphezulu kwama-substrates ngokuya ngembobo encane, izintambo ezinhle, kanye nokuncipha.

Ngakho-ke, umehluko phakathi kwe-FR-4 evamile kanye ne-Tg FR-4 ephezulu: isesimweni esishisayo, ikakhulukazi ngemva kokumuncwa komswakama.
Ngaphansi kokushisa, kunomehluko emandleni emishini, ukuzinza kwe-dimensional, ukunamathela, ukumuncwa kwamanzi, ukubola okushisayo, nokwanda kokushisa kwezinto.Imikhiqizo ye-High Tg ngokusobala ingcono kunezinto ezijwayelekile ze-PCB substrate.Eminyakeni yamuva, inani lamakhasimende adinga ukukhiqizwa kwamabhodi aphrintiwe we-Tg aphezulu liye landa unyaka nonyaka.

Ngokuthuthuka kanye nenqubekelaphambili eqhubekayo yobuchwepheshe be-elekthronikhi, izidingo ezintsha zihlale zibekwe phambili ezintweni eziphrintiwe zebhodi lesifunda, ngaleyo ndlela kuthuthukiswe ukuthuthukiswa okuqhubekayo kwamazinga e-copper clad laminate.Njengamanje, izindinganiso eziyinhloko zezinto ze-substrate zimi kanje.

① Amazinga Kazwelonke Njengamanje, izindinganiso kazwelonke zezwe lami zokuhlukaniswa kwezinto ze-PCB zezinto ezingaphansi kwe-substrate zihlanganisa i-GB/T4721-47221992 kanye ne-GB4723-4725-1992.Izinga le-copper clad laminate e-Taiwan, i-China liyindinganiso ye-CNS, esekelwe ku-Japanese JIs ejwayelekile., Yakhululwa ngo-1983.
②Ezinye izindinganiso zikazwelonke zihlanganisa: amazinga e-JIS yaseJapane, i-American ASTM, i-NEMA, i-MIL, i-IPc, i-ANSI, izindinganiso ze-UL, amazinga e-British Bs, amazinga e-German DIN kanye ne-VDE, amazinga e-French NFC kanye ne-UTE, kanye namazinga e-Canadian CSA Standards, amazinga e-AS e-Australia, i-FOCT amazinga e-Soviet Union yangaphambili, amazinga e-IEC yamazwe ngamazwe, njll.

Abahlinzeki bezinto zokuqala zokuklama ze-PCB bavamile futhi bavame ukusetshenziswa: I-Shengyi \ Jiantao \ International, njll.

● Amadokhumenti amukelwayo: i-protel autocad powerpcb orcad gerber noma ibhodi lamakhophi ebhodi langempela, njll.

● Izinhlobo zebhodi: CEM-1, CEM -3 FR4, impahla ye-TG ephezulu;

● Ubukhulu bosayizi webhodi: 600mm*700mm (24000mil*27500mil)

● Ugqinsi lwebhodi lokucubungula: 0.4mm-4.0mm (15.75mil-157.5mil)

● Izendlalelo eziphezulu zokucubungula: 16Layers

● Isendlalelo se-foil yethusi Ubukhulu: 0.5-4.0 (oz)

● Iqedile ukubekezelela ukujiya kwebhodi: +/-0.1mm (4mil)

● Ukwenza ukubekezelelana kobukhulu: ukugaya ikhompuyutha: 0.15mm (6mil) Ipuleti le-Die punching: 0.10mm (4mil)

● Ububanzi obuncane bomugqa/isikhala :0.1mm(4mil) Ikhono lokulawula ububanzi bomugqa: <+-20%

● I-diameter yembobo yokumba encane yomkhiqizo oqediwe: 0.25mm (10mil) Ubuncane bembobo yokubhoboza ububanzi bomkhiqizo oqediwe: 0.9mm (35mil) Ukubekezelelwa kobubanzi bembobo yomkhiqizo oqediwe: PTH: +-0.075mm( 3mil) NPTH : +-0.05mm(2mil)

● Ugqinsi lwethusi lwembobo eqediwe: 18-25um (0.71-0.99mil)

● Isikhala sesichibi se-SMT esincane: 0.15mm (6mil)

● I-surface coating: igolide lokucwiliswa ngamakhemikhali, isifutho sikathayela , Ibhodi lonke liyigolide elicwecwe nge-nickel (amanzi/igolide elithambile), isikrini sikasilika iglue eluhlaza okwesibhakabhaka, njll.

● Ukujiya kwemaski yesoda ebhodini: 10-30μm (0.4-1.2mil)

● Amandla okuxebula: 1.5N/mm (59N/mil)

● Ubulukhuni befilimu ye-Resistance Solder: >5H

● Umthamo wembobo yepulaki yokumelana ne-solder: 0.3-0.8mm (12mil-30mil)

● I-Dielectric constant: ε= 2.1-10.0

● Ukumelana ne-insulation: 10KΩ-20MΩ

● Ukungasebenzi kahle kwesici: 60 ohm±10%

● Ukushaqeka okushisayo : 288℃, 10 sec

● I-Warpage yebhodi eliqediwe: <0.7%

● Uhlelo lokusebenza lomkhiqizo: okokusebenza kokuxhumana, ugesi wezimoto, i-instrumentation, isistimu yokuma komhlaba jikelele, ikhompuyutha, i-MP4, ukunikezwa kwamandla kagesi, izinto zikagesi zasekhaya, njll.

Ngokusho kwezinto zokuqinisa ibhodi le-PCB, ngokuvamile ihlukaniswe ngezinhlobo ezilandelayo:
1. Phenolic PCB paper substrate
Ngenxa yokuthi lolu hlobo lwebhodi le-PCB lakhiwe nge-pulp yephepha, i-wood pulp, njll., ngezinye izikhathi liba amakhadibhodi, ibhodi le-V0, ibhodi elivimbela ilangabi kanye ne-94HB, njll. Impahla yayo eyinhloko yiphepha le-wood pulp fiber, okuwuhlobo lwe-PCB. ihlanganiswe nengcindezi ye-phenolic resin.ipuleti.Lolu hlobo lwe-substrate yephepha alukwazi ukusha, lungashaywa, lunezindleko eziphansi, intengo ephansi, kanye nokuminyana okuphansi kwesihlobo.Sivame ukubona ama-phenolic paper substrates afana ne-XPC, FR-1, FR-2, FE-3, njll. Futhi i-94V0 ingeyebhodi lephepha elingashisi ilangabi, elingashi.

2. Inhlanganisela ye-PCB substrate
Lolu hlobo lwebhodi lempushana lubizwa nangokuthi i-powder board, enephepha le-wood pulp fiber noma iphepha le-cotton pulp fiber njengento yokuqinisa, kanye nendwangu ye-glass fiber njengento yokuqinisa phezulu ngesikhathi esifanayo.Lezi zinto ezimbili zenziwe nge-epoxy resin evimbela ilangabi.Kukhona i-fiberboard ye-glass-glass ehlangothini eyodwa engu-22F, i-CEM-1 kanye nebhodi le-fiber yengilazi enezinhlangothi ezimbili ze-CEM-3, phakathi kwayo i-CEM-1 ne-CEM-3 okuyizinto ezivame kakhulu eziyinhlanganisela ze-copper clad laminates.

3. I-Glass fiber PCB substrate
Kwesinye isikhathi ibuye ibe yibhodi le-epoxy, i-glass fibre board, i-FR4, i-fiber board, njll. Isebenzisa i-epoxy resin njenge-adhesive kanye nendwangu ye-fiber yengilazi njengento eqinisayo.Lolu hlobo lwebhodi lesifunda lunokushisa okuphezulu okusebenzayo futhi aluthintwa imvelo.Lolu hlobo lwebhodi luvame ukusetshenziswa ku-PCB enamacala amabili, kodwa intengo ibiza kakhulu kune-substrate ye-PCB eyinhlanganisela, futhi ukujiya okuvamile kungu-1.6MM.Lolu hlobo lwe-substrate lufanele amabhodi okuphakela amandla ahlukahlukene, amabhodi esekethe asezingeni eliphezulu, futhi asetshenziswa kabanzi kumakhompyutha, imishini yokuxhumana, kanye nemishini yokuxhumana.

FR-4

4. Abanye