Njengoba i-COB ingenalo ifreyimu yokuhola yephakheji ye-IC, kodwa ithathelwa indawo yi-PCB, ukuklanywa kwamaphedi e-PCB kubaluleke kakhulu, futhi i-Fish ingasebenzisa kuphela igolide elifakwe i-electroplated noma i-ENIG, ngaphandle kwalokho intambo yegolide noma i-aluminium, noma izintambo zethusi zakamuva. uzoba nezinkinga ezingakwazi ukushaywa. I-PCB Design Izimfuneko ze-COB 1. Ukwelashwa okuqediwe okungaphezulu kwebhodi le-PCB kufanele kube i-electroplating yegolide noma i-ENIG, futhi kuthe ukujiya kunongqimba lwegolide lwebhodi ye-PCB evamile, ukuze kuhlinzekwe amandla adingekayo ku-Die Bonding futhi kwakhiwe igolide-aluminium. noma igolide-igolide ingqikithi. 2. Esimeni sezintambo zesekethe ye-pad ngaphandle kwe-Die Pad ye-COB, zama ukucabangela ukuthi ubude bentambo yokushisela ngayinye inobude obunqunyiwe, okusho ukuthi, ibanga le-solder joint kusukela ku-wafer kuya ku-PCB. i-pad kufanele ihambisane ngangokunokwenzeka.Ukuma kocingo ngalunye lokubopha kungalawuleka ukuze kuncishiswe inkinga yokujikeleza okufushane lapho izintambo zokubopha ziphambana.Ngakho-ke, idizayini yephedi enemigqa ediagonal ayihlangabezani nezidingo.Kuphakanyiswa ukuthi isikhala sephedi ye-PCB singafushaniswa ukuze kuqedwe ukubukeka kwamaphedi ane-diagonal.Kungenzeka futhi ukudizayina izindawo zephedi eziyisiyingi ukuze uhlakaze ngokulinganayo izindawo ezihlobene phakathi kwezintambo zebhondi. 3. Kunconywa ukuthi i-wafer ye-COB kufanele okungenani ibe nezindawo ezimbili zokuma.Kungcono kakhulu ukuthi ungasebenzisi izindawo zokumisa eziyindilinga ze-SMT yendabuko, kodwa usebenzise izindawo zokumisa ezimise okwesiphambano, ngoba umshini we-Wire Bonding (wire bonding) uyazenzakalela Uma ubeka, ukubeka ngokuyisisekelo kwenziwa ngokubamba umugqa oqondile. .Ngicabanga ukuthi lokhu kungenxa yokuthi ayikho indawo yokuma eyindilinga ohlakeni oluholayo oluvamile, kodwa kuphela uhlaka lwangaphandle oluqondile.Mhlawumbe eminye imishini ye-Wire Bonding ayifani.Kunconywa ukuthi uqale ubheke ukusebenza komshini ukwenza umklamo.
4, usayizi wephedi lokufa le-PCB kufanele libe likhulu kancane kune-wafer yangempela, engakhawulela i-offset lapho ubeka i-wafer, futhi ivimbele i-wafer ukuthi ijikeleze kakhulu ku-die pad.Kutuswa ukuthi amaphedi angama-wafer ohlangothini ngalunye abe mkhulu ngo-0.25~0.3mm kune-wafer yangempela.
5. Kungcono ukuthi ungangeni emigodini endaweni lapho i-COB idinga ukugcwaliswa ngeglue.Uma ingeke igwemeke, imboni ye-PCB iyadingeka ukuthi ixhume ngokuphelele lezi ngezimbobo.Inhloso ukuvimbela izimbobo ukuthi zingangeni ku-PCB ngesikhathi sokukhipha i-Epoxy.ngakolunye uhlangothi, kubangela izinkinga ezingadingekile. 6. Kunconywa ukuthi uphrinte ilogo ye-Silkscreen endaweni edinga ukuhanjiswa, okungase kube lula ukusebenza kokukhipha kanye nokulawulwa komumo wokukhipha.
Uma unombuzo noma umbuzo, sicela usithinte! Lapha .
Yazi okwengeziwe ngathi! lapha.
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