Izici eziyi-10 ze-PCB enokwethenjelwa okuphezulu,
1. 20μm imbobo udonga zethusi ukujiya Ibhodi lesifunda eliphrintiwe ,
Izinzuzo: Ukuthembeka okuthuthukisiwe, okuhlanganisa ukumelana nokunwetshwa kwe-z-axis okuthuthukisiwe. Izingozi zokungakwenzi lokho: izimbobo zokuqhumisa noma ukukhipha umoya, izinkinga zokuxhunywa kukagesi ngesikhathi sokuhlanganisa (ukuhlukaniswa kwezingqimba zangaphakathi, ukuphuka kwezindonga zembobo), noma ukwehluleka okungenzeka ngaphansi kwezimo zomthwalo ekusetshenzisweni kwangempela.
2. Akukho ukulungiswa kwe-welding noma ukulungiswa kwesekethe evulekile Inzuzo: Isifunda esiphelele siqinisekisa ukwethembeka nokuphepha, akukho ukugcinwa, akukho bungozi. Ingozi yokungenzi lokhu: Uma kulungiswe ngokungalungile, uzodala isifunda esivulekile ebhodini.Ngisho noma kulungiswa 'ngokufanele', kunobungozi bokwehluleka ngaphansi kwezimo zokulayisha (ukudlidliza, njll.) okungase kwehluleke ekusetshenzisweni kwangempela. 3. Sebenzisa i-CCL eyaziwa ngamazwe ngamazwe, Izinzuzo: Ukwethembeka okuthuthukisiwe, ukuphila isikhathi eside nokusebenza okwaziwayo. Izingozi zokungakwenzi lokhu: Ukusebenzisa amashidi ekhwalithi ephansi kuzonciphisa kakhulu impilo yomkhiqizo, futhi ngesikhathi esifanayo, izakhiwo ezimbi zemishini yeshidi zisho ukuthi ibhodi ngeke lisebenze njengoba kulindelekile ngaphansi kwezimo ezihlanganisiwe, isibonelo: ukunwetshwa okuphezulu izakhiwo zingaholela ku-delamination, isekethe evulekile kanye nezinkinga ze-warping buckling, kanye nezakhiwo zikagesi ezibuthakathaka zingaholela ekusebenzeni kabi kwe-impedance. Izinto zokwakha zefekthri ye-ABIS PCB zonke zivela kubahlinzeki bebhodi abaziwayo basekhaya nabangaphandle, futhi sebefinyelele ubudlelwano besikhathi eside namasu okusebenzisana nabahlinzeki ukuze kuzinze ukuhlinzekwa kwempahla. 4. Sebenzisa uyinki wekhwalithi ephezulu Izinzuzo: Qinisekisa ikhwalithi yokuphrinta kwebhodi lesifunda, uthuthukise ukwethembeka kokukhiqizwa kwesithombe, futhi uvikele isekethe. Ingozi yokungakwenzi lokho: Oyinki bekhwalithi ephansi bangabangela ukunamathela, ukumelana nokuguquguquka kanye nezinkinga zokuqina.Zonke lezi zinkinga zingabangela ukuthi imaski ye-solder idonse ebhodini futhi ekugcineni iholele ekugqwaleni kwesifunda sethusi.Izakhiwo zokufakelwa ezingezinhle zingabangela amasekhethi amafushane ngenxa yokuqhubeka/ukugoqa kukagesi ngengozi.
5. Kweqile izimfuneko zokuhlanzeka zokucaciswa kwe-IPC Inzuzo: Ukuhlanzeka kwe-PCB okuthuthukisiwe kuthuthukisa ukwethembeka. Izingozi zokungakwenzi lokhu: Izinsalela ebhodini, ukwakhiwa kwe-solder kungaveza ingozi kumaski e-solder, izinsalela ze-ionic zingabangela ukugqwala kwendawo ye-solder kanye nengozi yokungcola okungaholela ezinkingeni zokuthembeka (amalunga amabi e-solder / ukwehluleka kukagesi ), futhi Ekugcineni kwandisa amathuba okuhluleka kwangempela.
Imaski yesoda emhlophe Aluminium Circuit Board
6. Lawula ngokuqinile impilo yesevisi yokwelashwa kwendawo ngayinye Izinzuzo: Ukuthengiswa, ukwethembeka, kanye nengozi encishisiwe yokungena komswakama. Izingozi zokungakwenzi lokhu: Izinkinga zokuthengiselana zingase zenzeke ngenxa yoshintsho lwe-metallographic ekuqedeni okungaphezulu kwamabhodi amadala, futhi ukungena komswakama kungase kubangele i-delamination, izendlalelo zangaphakathi nezindonga zembobo ngesikhathi sokuhlanganisa kanye/noma ukusetshenziswa kwangempela Ukuhlukaniswa (isifunda esivulekile), njll. inqubo yokufafaza ithini njengesibonelo, ukujiya kokufafaza kwethini ≧1.5μm, futhi impilo yesevisi yinde. 7. Imbobo yepulaki yekhwalithi ephezulu Inzuzo: Izimbobo zamapulaki ezisezingeni eliphezulu efekthri ye-PCB zizonciphisa ingozi yokwehluleka ngesikhathi sokuhlanganisa. Ingozi yokungakwenzi lokhu: Izinsalela zamakhemikhali eziphuma ekucwilisweni kwegolide zingahlala emigodini engaxhunywanga ngokugcwele, okubangela izinkinga ezinjengokusoda.Ngaphezu kwalokho, kungase kube nobuhlalu bethini obufihlwe emigodini.Ngesikhathi sokuhlanganisa noma ukusetshenziswa kwangempela, ubuhlalu bethayela bungaphuma bubangele ukujikeleza okufushane. 8. Ukubekezelelwa kwe-CCL kuhlangabezana nezimfuneko ze-IPC 4101 ClassB/L Inzuzo: Ukulawula okuqinile kongqimba lwe-dielectric kunciphisa ukuchezuka ekusebenzeni kukagesi okulindelekile. Ingozi yokungakwenzi lokho: Ukusebenza kukagesi kungase kungahlangabezani nezimfuneko ezishiwo, futhi izingxenye ezivela kuqeqebana elifanayo zingahluka kakhulu ekuphumeni/ukusebenza. 9. Lawula ngokuqinile ukubekezelelana kobumo, izimbobo nezinye izici zemishini Inzuzo: Ukubekezelelana okulawulwa ngokuqinile kuthuthukisa ikhwalithi yobukhulu bomkhiqizo - ukulingana okuthuthukisiwe, isimo kanye nokusebenza. Izingozi zokungakwenzi lokhu: Izinkinga ngesikhathi sokuhlanganisa, njengokuqondanisa/ukukhwelana (izinkinga ngezikhonkwane zokufaka i-press-fit zitholwa kuphela lapho ukuhlanganisa sekuqediwe).Ngaphezu kwalokho, ukukhweza esisekelweni nakho kungaba yinkinga ngenxa yokuchezuka okukhuphukile kwe-dimensional.Ngokusho kwamazinga aphezulu okuthembeka, ukubekezelelana kwesimo sembobo kungaphansi noma kulingana no-0.075mm, ukubekezelelana kobubanzi bembobo yi-PTH ± 0.075mm, nokubekezelelana komumo ngu-± 0.13mm. 10. Ubukhulu bemaski ye-solder bukhulu ngokwanele Izinzuzo: Izakhiwo ezithuthukisiwe zokuvala ugesi, ukunciphisa ingozi yokuxebuka noma ukulahlekelwa ukunamathela, ukwanda kokumelana nokushaqeka kwemishini - noma kuphi lapho kwenzeka khona! Ingozi yokungakwenzi lokho: Imaski ye-solder ezacile ingabangela ukunamathela, ukumelana nokuguquguquka kanye nezinkinga zokuqina.Zonke lezi zinkinga zingabangela ukuthi imaski ye-solder idonse ebhodini futhi ekugcineni iholele ekugqwaleni kwesifunda sethusi.Izakhiwo zokuvikela ezingezinhle ngenxa yemaski ezacile ze-solder, zingabangela izifunda ezimfushane ngenxa yokuqhutshwa ngengozi/i-arcing.
Abanye, sicela u-rfq, lapha!
English en 
