Ibhodi le-HDI , ukuminyana okuphezulu ukuxhumana ibhodi lesifunda eliphrintiwe
Amabhodi e-HDI angobunye bobuchwepheshe obukhula ngokushesha kakhulu kuma-PCB futhi manje butholakala kwa-ABIS Circuits Ltd.
Amabhodi e-HDI aqukethe ama-vias angaboni kanye/noma agqitshwe, futhi ngokuvamile aqukethe ama-microvias angu-0.006 noma amancane.Banobuningi besifunda obuphakeme kunamabhodi wesifunda wendabuko.
Kukhona 6 izinhlobo ezahlukene HDI PCB amabhodi , ukusuka phezulu kuya phezulu ngokusebenzisa izimbobo, ezinezimbobo ezigqitshiwe kanye nezimbobo, izingqimba ezimbili noma ngaphezulu ze-HDI ezinezimbobo, ama-substrates angenawo ugesi ngaphandle kokuxhumeka kukagesi, kusetshenziswa amapheya ongqimba Isakhiwo esishintshanayo sesakhiwo esingena-coreless kanye nesakhiwo esingenasici sisebenzisa amapheya ongqimba.
Ibhodi lesifunda eliphrintiwe elinobuchwepheshe be-HDI Ubuchwepheshe obuqhutshwa ngabathengi I-in-pad ngenqubo isekela ubuchwepheshe obuningi ezendlalelo ezimbalwa, okufakazela ukuthi enkulu ayihlali ingcono ngaso sonke isikhathi.Kusukela ngasekupheleni kwawo-1980s, sibone amakhamera ekhamera esebenzisa amakhatriji kayinki anosayizi wenoveli, ashwabene ukuze alingane intende yesandla sakho.Ikhompyutha yeselula nokusebenza ekhaya kunobunye ubuchwepheshe obuthuthukisiwe, okwenza amakhompyutha asheshe futhi abe lula, okuvumela abathengi ukuthi basebenze bekude noma yikuphi. Ubuchwepheshe be-HDI buyisizathu esikhulu salezi zinguquko.Umkhiqizo unemisebenzi eminingi, isisindo esilula kanye nevolumu encane.Imishini ekhethekile, izakhi ezincane kanye nezinto ezincane zenza imikhiqizo ye-elekthronikhi inciphe ngosayizi ngenkathi yandisa ubuchwepheshe, ikhwalithi kanye nesivinini. Ngenqubo yephedi Ugqozi oluvela kubuchwepheshe bokukhweza phezulu ngasekupheleni kwawo-1980 kweqe imikhawulo ye-BGA, COB, ne-CSP yaba iyintshi yesikwele encane.I-in-pad ngenqubo ivumela i-vias ukuthi ibekwe ngaphezulu kwephedi eyisicaba.Izimbobo ezidlulayo ziyaputshwa futhi zigcwaliswe nge-epoxy eqhubayo noma engaqhubeki, bese imbozwa futhi icwecwe ukuze icishe ingabonakali. Kuzwakala kulula, kodwa kuthatha isilinganiso sezinyathelo eziyisishiyagalombili ezengeziwe ukuqedela le nqubo eyingqayizivele.Imishini yobungcweti kanye nochwepheshe abaqeqeshwe kahle bayinaka kakhulu inqubo ukuze kufihlwe ngokuphelele ngezimbobo. Ngohlobo lokugcwalisa Kunezinhlobo eziningi ezahlukene zezinto zokugcwalisa imbobo: i-epoxy engeyona i-conductive, i-epoxy conductive, i-copper egcwele, egcwele isiliva, ne-electrochemical plating.Lokhu kuzokwenza ukuthi izimbobo ezigqitshwe endaweni eyisicaba zithengiswe ngokuphelele endaweni evamile.Ukubhoboza, ukungaboni noma ukugqitshwa nge-vias, ukugcwalisa, ukucwenga nokucasha ngaphansi kwamaphedi e-SMT.Ukucubungula lolu hlobo lwembobo kudinga imishini ekhethekile futhi kudla isikhathi.Imijikelezo eminingi yokumba nokujula okulawulwayo kwandisa isikhathi sokucubungula. I-HDI eyongayo Nakuba usayizi weminye imikhiqizo yabathengi unciphile, ikhwalithi iseyisici esibaluleke kakhulu sabathengi ngemva kwentengo.Ngokusebenzisa ubuchwepheshe be-HDI ekwakhiweni, i-PCB enezingqimba eziyisi-8 ingancishiswa ibe iphakethe lobuchwepheshe le-HDI le-HDI lembobo encane engu-4-layer PCB.Amandla okufaka izintambo e-HDI 4-layer PCB angakwazi ukufeza imisebenzi efanayo noma engcono njenge-PCB enezingqimba eziyisi-8 ezijwayelekile. Nakuba inqubo ye-microvia inyusa izindleko ze-HDI PCB, ukuklama okufanele nokunciphisa inani lezendlalelo kunganciphisa kakhulu izindleko zamayintshi ayisikwele wezinto ezibonakalayo kanye nenani lezendlalelo. Yakha amabhodi we-HDI angajwayelekile Ukwenziwa ngempumelelo kwe-HDI PCB kudinga amathuluzi nezinqubo ezikhethekile, njengokubhola nge-laser, ukuxhuma, imaging eqondile ye-laser, kanye nemijikelezo eqhubekayo yokukhipha izintambo.Umugqa webhodi we-HDI mncane, isikhala sincane, iringi iyaqina, futhi kusetshenziswa into ekhethekile ezacile.Ukuze ukhiqize ngempumelelo lolu hlobo lwebhodi, isikhathi esengeziwe kanye nokutshalwa kwezimali okukhulu kwezinqubo zokukhiqiza kanye nemishini kuyadingeka. I-Laser drilling technology Ukubhoboza izimbobo ezincane kunazo zonke kuvumela amasu amaningi ukuthi asetshenziswe ebusweni bebhodi lesifunda.Ngokusebenzisa ugodo olunobubanzi obungama-microns angu-20 (1 mil), le nsimbi enamandla ingangena ensimbi nasengilazini yakhe izimbobo ezincane.Imikhiqizo emisha iye yavela, njengama-laminates alahlekelwa kancane kanye nezinto zengilazi ezifanayo ezinama-dielectric constants aphansi.Lezi zinto zinokumelana nokushisa okuphezulu komhlangano ongenawo umthofu futhi zivumela ukusetshenziswa kwezimbobo ezincane. HDI ibhodi lamination kanye materials Ubuchwepheshe bezendlalelo eziningi obuthuthukisiwe buvumela abaklami ukuthi bengeze amapheya ezendlalelo ezengeziwe ngokulandelana ukuze bakhe i-PCB yezendlalelo eziningi.Ukusebenzisa i-laser drill ukuze udale izimbobo kungqimba lwangaphakathi kuvumela ukucwenga, ukuthwebula izithombe, nokushumeka ngaphambi kokucindezela.Le nqubo yokwengeza ibizwa ngokuthi ukwakhiwa okulandelanayo.Ukukhiqiza kwe-SBU kusebenzisa ama-vias agcwele ukuze kuvunyelwe ukuphathwa okungcono kokushisa 
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