Esivame ukubhekisela kukho ukuthi " I-FR-4 Fiber Class Material PCB Board " yigama lekhodi lebanga lezinto ezingashi. Limele ukucaciswa kwempahla okumele i-resin ikwazi ukuzicisha ngokwayo ngemva kokushiswa. Akulona igama eliphathekayo, kodwa uhlobo lwezinto. Ibanga lezinto ezibonakalayo, ngakho-ke kunezinhlobo eziningi zezinto zebanga le-FR-4 ezisetshenziswa kumabhodi wesifunda jikelele okwamanje, kodwa eziningi zazo zenziwe ngalokho okubizwa ngokuthi i-Tera-Function epoxy resin plus filler (Filler) ne-glass fiber Izinto ezihlanganisiwe ezenziwe.
Ibhodi lesifunda eliphrintiwe eliguquguqukayo (I-Flexible Printed Circuit Board, isifushaniso se-FPC) ibizwa nangokuthi ibhodi lesifunda eliphrintiwe elivumelana nezimo, noma ibhodi lesifunda eliphrintiwe elivumelana nezimo.Ibhodi lesifunda eliphrintiwe eliguquguqukayo liwumkhiqizo oklanywe futhi owenziwe ku-substrate eguquguqukayo ngokuphrinta. 
Kunezinhlobo ezimbili eziyinhloko zama-substrate ebhodi lesifunda eliphrintiwe: izinto ze-organic substrate nezinto ze-inorganic substrate, kanye nezinto ze-organic substrate ezisetshenziswa kakhulu.Ama-substrates e-PCB asetshenzisiwe ahlukile ezendlalelo ezahlukene.Isibonelo, amabhodi ezendlalelo ezi-3 kuya kwezi-4 adinga ukusebenzisa izinto eziyinhlanganisela ezakhiwe, futhi amabhodi anezinhlangothi ezimbili ngokuvamile asebenzisa izinto zengilazi-epoxy. Lapho sikhetha ishidi, sidinga ukucabangela umthelela we-SMT Enqubweni yokuhlangana ye-elekthronikhi engenawo umthofu, ngenxa yokwanda kwezinga lokushisa, izinga lokugoba lebhodi lesifunda eliphrintiwe lapho kushisa likhuphuka.Ngakho-ke, kuyadingeka ukusebenzisa ibhodi elinezinga elincane lokugoba ku-SMT, njenge-FR-4 uhlobo lwe-substrate.
Njengoba ukucindezeleka kokunwetshwa nokunciphisa kwe-substrate ngemva kokushisa kuthinta izingxenye, kuzokwenza ukuthi i-electrode iqhume futhi inciphise ukuthembeka.Ngakho-ke, i-coefficient yokwandisa impahla kufanele inakwe lapho kukhethwa impahla, ikakhulukazi uma ingxenye inkulu kuno-3.2 × 1.6mm.I-PCB esetshenziswa kubuchwepheshe bokuhlanganiswa kwendawo idinga ukuguquguquka okuphezulu okushisayo, ukumelana nokushisa okuhle kakhulu (150 ℃, 60min) kanye nokuqina (260 ℃, 10s), amandla okunamathela e-foil yethusi ephezulu (1.5×104Pa noma ngaphezulu) namandla okugoba (25 × 104Pa), high conductivity kanye ne-dielectric encane engaguquki, i-punchability enhle (ukunemba ± 0.02mm) nokuhambisana nama-ejenti okuhlanza, ngaphezu kwalokho, ukubukeka kuyadingeka ukuba kube bushelelezi futhi kube flat, ngaphandle kokungqubuzana, ukuqhekeka, izibazi namabala okugqwala, njll. 
Ukukhetha ubukhulu be-PCB Ubukhulu bebhodi lesifunda eliphrintiwe ngu-0.5mm, 0.7mm, 0.8mm, 1mm, 1.5mm, 1.6mm, (1.8mm), 2.7mm, (3.0mm), 3.2mm, 4.0mm, 6.4mm, okuthi 0.7 mm kanye no-1.5 I-PCB enogqinsi lwe-mm isetshenziselwa ukwakhiwa kwamabhodi anezinhlangothi ezimbili aneminwe yegolide, kanti u-1.8mm no-3.0mm angosayizi abangajwayelekile. Ngokombono wokukhiqiza, usayizi webhodi lesifunda eliphrintiwe akufanele libe ngaphansi kuka-250×200mm, futhi usayizi ofanele ngokuvamile (250～350mm)×(200×250mm).Kuma-PCB anezinhlangothi ezinde ezingaphansi kuka-125mm noma izinhlangothi ezibanzi ngaphansi kuka-100mm, kulula Ukusebenzisa indlela yejigsaw. Ubuchwepheshe bokukhweza ngaphezulu bubeka inani lokugoba le-substrate enogqinsi oluyi-1.6mm njengekhasi lempi eliphezulu ≤0.5mm kanye nekhasi le-warpage eliphansi ≤1.2mm 
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