Ama-Vias ebhodini lesekethe abizwa nge-vias, ahlukaniswe ngemigodi, imigodi eyimpumputhe kanye nezimbobo ezigqitshiwe( HDI Circuit Board ).Ngokuyinhloko zisetshenziselwa ukuxhuma izintambo ezingqimbeni ezihlukene zenethiwekhi efanayo futhi ngokuvamile azisetshenziswa njengezingxenye ze-soldering;

Amaphedi ebhodini lesifunda abizwa ngokuthi ama-pads, ahlukaniswe abe ama-pin pads kanye nama-surface mount pads;amaphinikhodi anezimbobo ze-solder, ezisetshenziselwa ikakhulukazi izingxenye zephini lokunamathisela;kuyilapho ama-surface mount pads awanazo izimbobo ze-solder futhi asetshenziselwa kakhulu ukuhlanganisa izingxenye ze-Surface Mount.

I-Via ngokuyinhloko idlala indima yokuxhumana kukagesi, indawo yokuvula i-via ngokuvamile incane, ngokuvamile inqobo nje uma ubuchwepheshe bokucubungula ibhodi bungakwenza kwanele, futhi ingaphezulu le-via lingambozwa ngeyinki yemaski ye-solder noma cha;kuyilapho iphedi ingasetshenziselwa ugesi kuphela Indima yokuxhuma, kodwa futhi indima yokulungiswa kwemishini, indawo yokuvula i-pad (impela ibhekisela ku-pin pad) kufanele ibe mkhulu ngokwanele ukudlula iphini lengxenye, ngaphandle kwalokho. izodala izinkinga zokukhiqiza;ngaphezu kwalokho, ingaphezulu lephedi akumele libe neyinki ye-Solder mask, ngoba izothinta i-soldering, futhi ngokuvamile ingaphezulu lephedi liboshwe nge-flux lapho wenza ibhodi;kanye nobubanzi bembobo ye-pad (uma kubhekiselwa ku-pin pad) kumele kuhlangane okuthile Kungenjalo, ngeke kuthinte i-welding kuphela, kodwa futhi kubangele ukufakwa kungazinzi.