General Mano
- Single Sided
- Double Sided
- Multi Layer
- Kuvigwa Via
- Bofu Via
- Impedance Inodzorwa
- Micro Via
- Laser Drilling
- RoHS Kutevedzera
- Epoxy yakazadzwa vias
PCB yakaoma
Item
| Spec
|
Layer
| 1~20
|
Board Ukobvu
| 0.1mm-8.0mm
|
Material
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, nezvimwewo.
|
Max Panel Size
| 600mm × 1200mm
|
Min Hole Size
| 0.1mm
|
Min Line Width/Space
| 3mil(0.075mm)
|
Board Outline Kushivirira
| 0.10mm
|
Insulation Layer Thickness
| 0.075mm--5.00mm
|
Kunze Layer Copper Kukora
| 18um--350um
|
Drilling Hole (Mechanical)
| 17um--175um
|
Pedzisa Gomba (Mechanical)
| 17um--175um
|
Diameter Tolerance (Mechanical)
| 0.05mm
|
Kunyoresa (Mechanical)
| 0.075mm
|
Aspect ratio
| 16:01
|
Solder Mask Type
| LPI
|
SMT Min.Solder Mask Width
| 0.075mm
|
Min.Solder Mask Clearance
| 0.05mm
|
Plug Hole Diameter
| 0.25mm--0.60mm
|
Impedance Kudzora Kushivirira
| 士10%
|
Surface finish
| ENIG, OSP, HASL, Chem.Tin/Sn, Flash Gold, etc
|
Soldermask
| Green/Yellow/Black/White/Red/Blue
|
Silkscreen
| Tsvuku/Yero/Mutema/Muchena
|
Chitupa
| UL, ISO 9001, ISO14001, IATF16949
|
Chikumbiro Chakakosha
| Gomba rakapofumadzwa, chigunwe chegoridhe, BGA, Carbon inki, chinotarisika mask, VIP maitiro, Edge plating, Hafu maburi , etc
|
Material Supplers
| Shengyi, ITEQ, Taiyo, nezvimwe.
|
Common Package
| Vacuum+Carton
|
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