Gbogbogbo Agbara
- Apa Nikan
- Apa Meji
- Multi Layer
- Ti sin Nipasẹ
- Afọju Nipasẹ
- Imudaniloju Iṣakoso
- Micro Nipasẹ
- Liluho lesa
- Ibamu RoHS
- Iposii kun vias
PCB lile
Nkan
| Spec
|
Fẹlẹfẹlẹ
| 1 ~ 20
|
Ọkọ Sisanra
| 0.1mm-8.0mm
|
Ohun elo
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu / Cu Base, ati be be lo
|
Iwon Panel Max
| 600mm×1200mm
|
Min Iho Iwon
| 0.1mm
|
Min Line Iwọn / aaye
| 3 milionu (0.075mm)
|
Ifarada Ifarada Board
| 0.10mm
|
Idabobo Layer Sisanra
| 0.075mm--5.00mm
|
Jade Layer Ejò Sisanra
| 18um--350um
|
Iho liluho (Mechanical)
| 17um--175um
|
Ipari Iho (Mechanical)
| 17um--175um
|
Ifarada Opin (Ẹrọ)
| 0.05mm
|
Iforukọsilẹ (Ẹrọ)
| 0.075mm
|
Ipin ipin
| 16:01
|
Solder Boju Iru
| LPI
|
SMT Min.Solder boju Iwọn
| 0.075mm
|
Min.Solder boju Kiliaransi
| 0.05mm
|
Pulọọgi Iho opin
| 0.25mm--0.60mm
|
Ifarada Iṣakoso Impedance
| 10%
|
Ipari dada
| ENIG, OSP, HASL, Chem.Tin/Sn, Gold Filaṣi, ati be be lo
|
Soldermask
| Alawọ ewe/ofee/dudu/funfun/pupa/bulu
|
Silkscreen
| Pupa/ofee/dudu/funfun
|
Iwe-ẹri
| UL, ISO 9001, ISO14001, IATF16949
|
Ibere Pataki
| Iho afọju, ika goolu, BGA, inki erogba, iboju yoju, ilana VIP, fifi eti, awọn iho idaji , ati be be lo
|
Awọn Olupese Ohun elo
| Shengyi, ITEQ, Taiyo, ati bẹbẹ lọ.
|
Package ti o wọpọ
| Igbale + Paali
|
English en 
