Ubunakho ngokuBanzi
- Icala Elilodwa
- Amacala amabini
- Uluhlu oluninzi
- Wangcwatywa Via
- Iimfama Via
- Ukuphazamiseka kuyaLawulwa
- Micro Via
- ILaser Drilling
- Ukuthotyelwa kweRoHS
- I-epoxy izaliswe nge-vias
I-PCB eqinile
Into
| Spec
|
Iileya
| 1-20
|
Ukutyeba kweBhodi
| 0.1mm-8.0mm
|
Izinto eziphathekayo
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njl.
|
Ubungakanani bePaneli enkulu
| 600mm×1200mm
|
Ubungakanani boMngxuma omncinci
| 0.1mm
|
Ububanzi bomgca obuncinci/iSithuba
| 3mil(0.075mm)
|
Unyamezelo lolwandlalo lweBhodi
| Ubukhulu 0.10mm
|
I-Insulation Layer Ukutyeba
| 0.075mm--5.00mm
|
Out Layer Copper Ukutyeba
| 18um--350um
|
Umngxuma woKwemba (Oomatshini)
| 17um--175um
|
Gqiba umngxuma (oomatshini)
| 17um--175um
|
Ukunyamezelwa kweDiameter (Mechanical)
| 0.05mm
|
Ubhaliso (Ngoomatshini)
| 0.075mm
|
Umgangatho wento
| 16:01
|
Uhlobo lweMaski yeSolder
| LPI
|
SMT Min.Solder Mask Ububanzi
| 0.075mm
|
Min.I-Solder Mask Clearance
| 0.05mm
|
I-Plag Hole Diameter
| 0.25mm--0.60mm
|
Ukunyamezelwa koLawulo lwe-Impedans
| 士10%
|
Ukugqitywa komphezulu
| ENIG, OSP, HASL, Chem.Itoti/i-Sn, iFlash Gold, njl
|
I-Soldermask
| Buhlaza/Mthubi/Mnyama/Mhlophe/Bomvu/Bhlowu
|
Silkscreen
| Bomvu/Mthubi/Mnyama/Mhlophe
|
Isatifikethi
| UL, ISO 9001, ISO14001, IATF16949
|
Isicelo esiKhethekileyo
| Umngxunya oyimfama, umnwe weGolide, iBGA, i-inki yeCarbon, imaski ebonwayo, inkqubo yeVIP, ukubekwa komphetho, imingxunya enesiqingatha , njl
|
abaxhasi bezinto eziphathekayo
| Shengyi, ITEQ, Taiyo, njl.
|
Iphakheji eqhelekileyo
| Vacuum+Ibhokisi
|
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