Ngokufika kweminyaka yolwazi lwedijithali, izimfuneko zokuxhumana okufika phezulu, ukudluliswa kwesivinini esikhulu, kanye nokuba yimfihlo okuphezulu kwezokuxhumana ziya ngokuya ziba phezulu.Njengomkhiqizo osekelayo osekelayo wemboni yobuchwepheshe bolwazi lwe-elekthronikhi, i-PCB idinga i-substrate ukuthi ihlangabezane nokusebenza kwe-dielectric engaguquki, isici sokulahlekelwa kwemidiya ephansi, ukumelana nezinga lokushisa eliphezulu, njll., futhi ukuhlangabezana nalezi zidingo zokusebenza ukusebenzisa imvamisa ekhethekile ama-substrates, okuvame ukusetshenziswa kakhulu izinto ze-Teflon (PTFE).Kodwa-ke, enqubweni yokucubungula ye-PCB, ngenxa yokusebenza okungalungile kokumanzisa kwendawo yezinto ezibonakalayo zeTeflon, ukumanzisa kwendawo ngokwelashwa kwe-plasma kuyadingeka ngaphambi kwe-metalization yembobo, ukuze kuqinisekiswe ukuqhubeka kahle kwenqubo ye-metalization yembobo.

Iyini i-Plasma?

I-Plasma iwuhlobo lwento ehlanganisa ikakhulukazi ama-electron amahhala nama-ion ashajiwe, atholakala kabanzi endaweni yonke, evame ukubhekwa njengesimo sesine sezinto, esaziwa nge-plasma, noma "i-Ultra gaseous state", eyaziwa nangokuthi "i-plasma".I-Plasma ine-conductivity ephezulu futhi ihambisana kakhulu nezinkambu ze-electromagnetic.

Indlela

Ukusetshenziswa kwamandla (isb. amandla kagesi) kungqamuzana legesi egumbini le-vacuum kubangelwa ukungqubuzana kwama-electron asheshisa, okushisa ama-electron angaphandle ama-athomu nama-athomu, nama-ion akhiqizayo, noma ama-radicals mahhala asebenza kakhulu.Ngakho-ke ama-ion avelayo, ama-radicals wamahhala angqubuzana ngokuqhubekayo futhi asheshiswe ngamandla kagesi, ukuze angqubuzane nobuso bento, futhi acekele phansi izibopho zamangqamuzana phakathi kwebanga lama-microns amaningana, abangele ukuncishiswa kogqinsi oluthile, akhiqize ama-bumpy. izindawo ezingaphezulu, futhi ngesikhathi esifanayo zakha izinguquko ezibonakalayo namakhemikhali endaweni efana neqembu lomsebenzi wokwakheka kwegesi, kuthuthukisa amandla okubopha ngethusi, ukuqeda ukungcola neminye imiphumela.

I-oksijeni, i-nitrogen, negesi ye-Teflon ivame ukusetshenziswa ku-plasma engenhla.

Ukucutshungulwa kwe-Plasma okusetshenziswe emkhakheni we-PCB

• I-Hole wall dent emva kokubhoboza, susa ukungcola odongeni lwembobo;
• Susa i-carbide ngemuva kwe-laser drilling izimbobo eziyimpumputhe;
• Uma kwenziwa imigqa emihle, okusele kwefilimu eyomile kuyasuswa;
• Ubuso bodonga lwembobo bucushiwe ngaphambi kokuba impahla ye-Teflon ifakwe ethusi;
• Ukusebenza kobuso ngaphambi kwe-lamination yangaphakathi yepuleti;
• Ukuhlanza ngaphambi kokucwilisa igolide;
• Ukwenziwa kusebenze kobuso ngaphambi kokomiswa kanye nefilimu yokushisela.
• Shintsha isimo sangaphakathi sangaphakathi kanye nokumanzisa, thuthukisa amandla okubopha ama-interlayer;
• Susa ama-corrosion inhibitors kanye nezinsalela zefilimu zokushisela;

Ishadi lokungafani lemiphumela ngemva kokucubungula

1. Ukuhlolwa kokuthuthukiswa kwe-Hydrophilic

2. I-SEM ene-Copper-plated emigodini yeshidi le-RF-35 ngaphambi nangemva kokwelashwa kwe-plasma

3. Ukufakwa kwethusi ebusweni bebhodi le-PTFE Base ngaphambi nangemuva kokuguqulwa kwe-plasma

4. Isimo semaski se-Solder sobuso bebhodi lesisekelo le-PTFE ngaphambi nangemuva kokuguqulwa kwe-plasma

Incazelo yesenzo seplasma

1, Ukwelashwa okucushiwe kwe-Teflon material

Kodwa bonke onjiniyela abaye benza i-metalization ye-polytetrafluoroethylene izimbobo zezinto ezibonakalayo banalokhu okuhlangenwe nakho: ukusetshenziswa kwezinto ezijwayelekile. Ibhodi lesifunda eliphrintiwe elinezingqimba eziningi ze-FR-4 imbobo metalization processing indlela, ayiphumelelanga PTFE imbobo metalization.Phakathi kwazo, ukwelashwa kwangaphambili kokusebenza kwe-PTFE ngaphambi kokufakwa kwamakhemikhali ethusi kuwubunzima obukhulu kanye nesinyathelo esibalulekile.Ekwelashweni kokwenza kusebenze kwe-PTFE impahla ngaphambi kokufakwa kwamakhemikhali ethusi, izindlela eziningi zingasetshenziswa, kodwa sezizonke, zingaqinisekisa ikhwalithi yemikhiqizo, elungele izinjongo zokukhiqiza ngobuningi yilezi ezimbili ezilandelayo:

a) Indlela yokucubungula amakhemikhali: i-sodium yensimbi ne-radon, ukusabela kuzincibilikisi ezingewona amanzi njenge-tetrahydrofuran noma isixazululo se-glycol dimethyl ether, ukwakheka kwenkimbinkimbi ye-nio-sodium, isixazululo sokwelashwa kwe-sodium, kungenza ama-athomu angaphezulu eTeflon imbobo ziyafakwa, ukufeza inhloso yokumanzisa udonga lwembobo.Lena indlela evamile, umphumela omuhle, ikhwalithi ezinzile, isetshenziswa kabanzi.

b) Indlela yokwelashwa kwe-Plasma: le nqubo ilula ukusebenza, ikhwalithi yokucubungula ezinzile futhi enokwethenjelwa, ilungele ukukhiqizwa ngobuningi, ukusetshenziswa kokukhiqizwa kwenqubo yokumisa i-plasma.Isixazululo sokwelashwa kwe-sodium-crucible esilungiselelwe indlela yokwelapha amakhemikhali kunzima ukuhlanganisa, ubuthi obuphezulu, impilo yeshalofu emfushane, idinga ukwakhiwa ngokusho kwesimo sokukhiqiza, izidingo zokuphepha eziphezulu.Ngakho-ke, okwamanje, ukwelashwa kokuvula kwe-PTFE surface, indlela yokwelashwa kwe-plasma eyengeziwe, kulula ukuyisebenzisa, futhi kunciphisa kakhulu ukwelashwa kwamanzi angcolile.

2, Imbobo odongeni cavitation / imbobo odongeni resin ukususwa sokumba

Ukuze kucutshungulwe ibhodi lesifunda eliphrintiwe elinezingqimba eziningi ze-FR-4, ukubhola kwayo kwe-CNC ngemva kokumba i-resin yodonga lwembobo kanye nokususwa kwezinye izinto, ngokuvamile kusetshenziswa ukwelashwa okugxilile kwe-sulfuric acid, ukwelashwa kwe-chromic acid, ukwelashwa kwe-alkaline potassium permanganate, nokwelashwa kwe-plasma.Kodwa-ke, ebhodini lesifunda eliphrintiwe eliguquguqukayo kanye nebhodi lesifunda eliphrintiwe eliqinile-eguquguqukayo ukususa ukwelashwa kokungcola kokumba, ngenxa yomehluko wezimpawu ezibonakalayo, uma ukusetshenziswa kwezindlela zokwelapha zamakhemikhali ezingenhla, umphumela awulungile, futhi ukusetshenziswa kwe-plasma. ukubhoboza ukungcola nokususwa kwe-concave, ungathola udonga olungcono lwembobo, oluhambisana ne-metallic Plating yembobo, kodwa futhi lunezici zokuxhuma kwe-concave "ezintathu-ntathu".

3, Ukususwa kwe-carbide

Plasma ukwelashwa indlela, hhayi kuphela ezihlukahlukene sheet ukumba ukungcola umphumela ukwelashwa kusobala, kodwa futhi eyinhlanganisela resin materials kanye micropores Drilling ukwelashwa ukungcola, kodwa futhi ubonise ukuphakama kwayo.Ngaphezu kwalokho, ngenxa yesidingo esikhulayo sokukhiqiza samabhodi wesekethe aphrintiwe anezingqimba eziningi ane-high interconnect density, izimbobo eziningi zokumba izimpumputhe zenziwa kusetshenziswa ubuchwepheshe be-laser, obungumkhiqizo wezinhlelo zokusebenza ze-laser drilling blind hole - carbon, okudingeka zisuswe ngaphambi imbobo metallization inqubo.Ngalesi sikhathi, ubuchwepheshe bokwelashwa kwe-plasma, ngaphandle kokungabaza ukuthatha umthwalo wemfanelo wokukhipha i-carbon.

4, Ukucubungula kwangaphambili kwangaphakathi

Ngenxa yesidingo esikhulayo sokukhiqiza samabhodi esekethe aphrintiwe ahlukahlukene, izidingo zobuchwepheshe bokucubungula ezihambisanayo nazo ziphakeme futhi ziphakeme.Ukulungiswa kwangaphakathi kwebhodi lesifunda eliphrintiwe eliguquguqukayo kanye nebhodi lesifunda eliphrintiwe eliqinile eliguquguqukayo lingakhuphula ubuqhwaga obungaphezulu kanye ne-activation degree, kukhuphule amandla okubopha phakathi kongqimba lwangaphakathi, futhi kube nokubaluleka okukhulu ukuthuthukisa isivuno sokukhiqiza.

Izinzuzo kanye nokubi kokucubungula i-plasma

Ukucutshungulwa kwe-Plasma kuyindlela elula, ephumelelayo futhi enekhwalithi ephezulu yokususa ukungcola kanye nokunamathisela emuva kwamabhodi esekethe aphrintiwe.Ukwelashwa kwe-Plasma kulungele ikakhulukazi izinto ze-Teflon (PTFE) ngoba azisebenzi kangako ngamakhemikhali futhi ukwelashwa nge-plasma kuvula umsebenzi.Ngejeneretha ye-high-frequency generator (i-40KHZ evamile), ubuchwepheshe be-plasma busungulwa ngokusebenzisa amandla enkundla kagesi ukuhlukanisa igesi yokucubungula ngaphansi kwezimo ze-vacuum.Lezi zishukumisa amagesi okuhlukanisa angazinzile ashintsha futhi ahlasele phezulu.Izinqubo zokwelapha ezinjengokuhlanza kahle kwe-UV, ukwenza kusebenze, ukusetshenziswa nokuphambana, kanye ne-plasma polymerization kuyindima yokwelashwa kwe-plasma surface.Inqubo yokucubungula i-plasma ingaphambi kokubhoboza ithusi, ikakhulukazi ukwelashwa kwezimbobo, inqubo yokucubungula i-plasma jikelele yile: ukumba - ukwelashwa kwe-plasma - ithusi.Ukwelashwa kwe-Plasma kungaxazulula izinkinga zembobo yembobo, izinsalela zezinsalela, ukuboshelwa kabi kukagesi kongqimba lwethusi lwangaphakathi kanye nokugqwala okunganele.Ngokucacile, ukwelashwa nge-plasma kungasusa ngempumelelo izinsalela ze-resin enqubweni yokumba, eyaziwa nangokuthi ukungcoliswa kokumba.Ivimbela ukuxhumeka kwethusi lembobo kungqimba lwethusi lwangaphakathi ngesikhathi se-metalization.Ukuze kuthuthukiswe amandla okubopha phakathi kwe-plating ne-resin, i-fiberglass nethusi, lawa ma-slags kufanele asuswe ahlanzekile.Ngakho-ke, i-plasma degluing kanye nokwelashwa kokugqwala kuqinisekisa uxhumano lukagesi ngemva kokufakwa kwethusi.

Imishini ye-Plasma ngokuvamile inamagumbi okucubungula abanjelwe endaweni engenalutho futhi atholakala phakathi kwamapuleti amabili e-electrode, axhunywe kujeneretha ye-RF ukuze akhe inani elikhulu lama-plasma egumbini lokucubungula.Egunjini lokucutshungulwa phakathi kwamapuleti e-electrode amabili, ukulungiselelwa okulinganayo kunamapheya amaningana ezikhala zamakhadi aphambene ukuze kwakheke indawo yokukhosela yamagremu amaningi angakwazi ukuhlalisa amabhodi esekethe okucubungula i-plasma.Enqubweni ekhona yokucubungula i-plasma yebhodi le-PCB, lapho i-PCB substrate ifakwa emshinini we-plasma ukuze kucutshungulwe i-plasma, i-PCB substrate ngokuvamile ibekwa ngokuhambisanayo phakathi kwesikhala sekhadi lesihlobo segumbi lokucubungula i-plasma (okungukuthi, igumbi eliqukethe ukucutshungulwa kwe-plasma ibhodi lesifunda), i-plasma isetshenziselwa ukwelashwa kwe-plasma ku-plasma yembobo ku-substrate ye-PCB ukuthuthukisa umswakama ongaphezulu wembobo.

Isikhala somgodi wokucubungula umshini we-plasma sincane, ngakho-ke, ngokuvamile phakathi kwegumbi lokucutshungulwa kwepuleti le-electrode limiswe ngamapheya amane emisele yepuleti lekhadi eliphambene, okungukuthi, ukwakheka kwamabhuloki amane kungakwazi ukuhlalisa indawo yokukhosela yebhodi lesifunda se-plasma.Ngokuvamile, ubukhulu begridi ngayinye yendawo yokukhosela buyi-900mm (ubude) x 600mm (ubude) x 10mm (ububanzi, okungukuthi ubukhulu bebhodi), ngokwenqubo ekhona ye-PCB board processing plasma, isikhathi ngasinye Ibhodi lokucubungula i-plasma inamandla acishe abe yi-2 flat (900mm x 600mm x 4), kuyilapho isikhathi ngasinye somjikelezo wokucubungula i-plasma singamahora angu-1.5, ngaleyo ndlela inikeze amandla osuku olulodwa cishe amamitha-skwele angama-35.Kungabonakala ukuthi umthamo wokucubungula i-plasma webhodi le-PCB awuphezulu ngokusebenzisa inqubo yokucubungula i-plasma yebhodi le-PCB ekhona.

Isifinyezo

Ukwelashwa kwe-plasma kusetshenziswa kakhulu epuleti le-high-frequency, HDI , inhlanganisela eqinile futhi ethambile, elungele ikakhulukazi izinto ze-Teflon (PTFE).Umthamo ophansi wokukhiqiza, izindleko eziphakeme nakho kuwububi bayo, kodwa izinzuzo zokwelashwa kwe-plasma nazo zisobala, uma kuqhathaniswa nezinye izindlela zokwelapha ezingaphezulu, ekwelapheni ukusebenza kwe-Teflon, ukuthuthukisa i-hydrophilicity yayo, ukuqinisekisa ukuthi i-metalization yemigodi, ukwelashwa kwe-laser hole, ukususwa kwefilimu eyomile eyinsalela yomugqa oqondile, ukugobhoza, ukuqinisa kuqala, ukushisela kanye nokwelashwa kwangaphambili kwezinhlamvu zesikrini sikasilika, izinzuzo zakhona azinakushintshwa, futhi zinezici ezihlanzekile, ezivumelana nemvelo.