English en Ke nānā aku nei ʻo ABIS i nā lawelawe Turnkey piha a me ka Complete PCB Assembly, hiki iā mākou ke hoʻokele i nā kauoha me ka loaʻa ʻana o nā ʻāpana ʻāpana a i ʻole.Ke hahai nei mākou i kahi papa hana kūʻai ʻana i nā ʻāpana PCB maikaʻi loa a hoʻonohonoho pono ʻia, i hoʻolālā ʻia e hoʻopili pono i kā mākou PCB Assembly Process e hōʻoia i ka maikaʻi loa no kāu papahana.Eia nō naʻe, ʻimi pololei ʻo ABIS i nā ʻāpana me nā mea hana kumu mua a me nā luna mana.E like me Digikey, Mouser, Future, Avnet a pēlā aku.
Hāʻawi ʻo ABIS i ka hoʻokō ʻana i ke kaulahao lako hoʻokahi me ka hoʻolālā hiʻohiʻona "pehea-inā" i ka manawa maoli.Kōkua mākou iā ʻoe e hoʻololi i ka mākeke me ka wikiwiki a ʻoi aku ka maikaʻi - hana i nā manawa hou no kāu hui.
ʻO ka waiho ʻana o nā ʻāpana
(1) Ma hope o ka hōʻea ʻana o nā mea i loko o ka hale kūʻai, e lawe ka luna hale kūʻai i ka waihona a waiho iā lākou e nānā ʻia.Hiki ke waiho pololei ʻia nā waiwai nui i loko o ka wahi kūpono o ka hale kūʻai, akā pono lākou e kaha ʻia ʻo "no ka nānā ʻana".A laila e hōʻoia ka QC a noi no ka nānā ʻana i ka hōʻea ʻana.
Aia ma loko o ka hōʻoia:
(1) Ka inoa o ka huahana, ka hōʻike kumu hoʻohālike, ka mea hana, ka lā hana a i ʻole ka helu pūʻulu, ke ola o ka papa, ka nui, ke kūlana paʻa a me nā palapala hōʻoia, a me nā mea ʻē aʻe.
(2) Ma hope o ka loaʻa ʻana o ka hōʻike nānā i hoʻopau ʻia ma ke ʻano he "kūpono", e hele ka mea mālama hale kūʻai i nā kaʻina hana hale kūʻai i ka manawa, a hoʻoneʻe ʻia nā waiwai i ka wahi nānā i kahi kūpono o ka hale kūʻai no ka mālama ʻana.ʻO nā huahana e nānā ʻia i waiho ʻia ma kahi kūpono o ka hale kūʻai e wehe ʻia mai ka māka "Pending Inspection";i ka wā i loaʻa ai kahi hōʻike hoʻokolokolo me ka hopena o ka nānā ʻana o "unqualified", E hana i ka hōʻailona kūpono ʻole e like me nā lula a kali i ka huahana non-conforming.
| Hiki i ka Hui PCB | |
| SMT/PTH ʻaoʻao hoʻokahi a ʻelua ʻaoʻao | ʻAe |
| ʻO nā ʻāpana nui ma nā ʻaoʻao ʻelua, BGA ma na aoao elua | ʻAe |
| ʻO ka nui o nā Chips liʻiliʻi loa | 0201 |
| Min BGA a me Micro BGA pitch a me ka helu poepoe | 0.008 in. (0.2mm) pitch, ʻoi aku ka nui o ka pōleʻa ma mua o 1000 |
| Min Nā ʻāpana alakaʻi pitch | 0.008 iniha (0.2 mm) |
| ʻO ka hui nui o nā ʻāpana ʻāpana ma ka mīkini | 2.2 in. x 2.2 in. x 0.6 in. |
| Nā mea hoʻohui mauna ʻilikai | ʻAe |
| Nā ʻāpana ʻano ʻokoʻa: | ʻAe, Hui ma nā lima |
| LED | |
| ʻO nā pūnaewele pale a me ka capacitor | |
| Nā capacitors electrolytic | |
| Nā pale pale a me nā capacitors (pots) | |
| Nā kumu | |
| Hoʻokuʻu hou ʻana | ʻAe |
| Nui ka nui o ka PCB | 14.5 iniha x 19.5 iniha. |
| Min PCB mānoanoa | 0.2 |
| Hoailona Pili | Makemake ʻia akā ʻaʻole pono |
| Hoʻopau PCB: | 1.SMOBC/HASL |
| 2.Electrolytic gula | |
| 3.Electroless gula | |
| 4.Electroless kala | |
| 5. Ke gula kaiapuni | |
| 6.Pini kaiapuni | |
| 7.OSP | |
| ʻAno PCB | Kekahi |
| ʻO ka PCB i hoʻopaʻa ʻia | 1. Hoʻopau ʻia ka pā |
| 2. Nā papa wehe | |
| 3 .V-Kula | |
| 4.Routed+V kiʻi ʻia | |
| Nānā | 1.X-ray ka nānā ʻana |
| 2.Microscope i 20X | |
| Hana hou | 1.BGA wehe a pani pani |
| 2.SMT IR rework station | |
| 3.Thru-hole rework station | |
| Paʻa paʻa | Hāʻawi i nā faila firmware polokalamu, irmware + lako polokalamu kuhikuhi hoʻonoho |
| Hoao hana | Pono ka pae o ka hoʻāʻo ʻana me nā ʻōlelo kuhikuhi |
| waihona PCB: | ʻO nā faila PCB Altium/Gerber/Eagle (Me nā kikoʻī e like me ka mānoanoa, ʻO ka mānoanoa keleawe, ke kala makamaka solder, hoʻopau, etc.) |
Kuleana kope © 2023 ABIS CIRCUITS CO., LTD.Mālama ʻia nā kuleana a pau. Mana e
Kākoʻo ʻia ka pūnaewele IPv6