Facultates Generales
- una Sided
- Duplex Sided
- Multi Layer
- Burried Via
- Caecus Via
- Impedimentum Controlled
- Micro Via
- Laser EXERCITATIO
- RoHS Obsequium
- Epoxy repleti vias
Rigidum PCB
Item
| Spec
|
Stratis
| 1~20
|
Tabula Crassitudo
| 0.1mm-8.0mm
|
Materia
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc.
|
Max Panel Location
| 600mm×1200mm
|
Min Hole Location
| 0.1mm
|
Min Line Latitudo / Space
| 3mil(0.075mm)
|
Tabula Italic Tolerantia
| 0.10mm
|
Nulla accumsan Crassitudo
| 0.093mm--5.00mm
|
Ex Layer Copper Crassitudo
| 18um--350um
|
EXERCITATIO foramen (Mechanical)
| 17um--175um
|
Foramen metam (Mechanical)
| 17um--175um
|
Diameter Tolerantia (Mechanical)
| 0.05mm
|
Registration (Mechanical)
| 0.093mm
|
Rationem ratio
| 16:01
|
Venditor larva Type
| LPI
|
SMT Min.Venditor larva Latitudo
| 0.093mm
|
Min.Venditor larva Clearance
| 0.05mm
|
Obturaculum foramen Diameter
| 0.25mm--0.60mm
|
Impedimentum Imperium Tolerantia
| -10%
|
Superficiem metam
| ENIG, OSP, HASL, Chem.Tin/Sn, Mico Aurum, etc
|
Soldermask
| Viridis/Yellow/Nigrum/White/Red/Blue
|
Silkscreen
| Red / Yellow / Niger / Alba
|
Testimonium
| UL, ISO 9001, ISO14001, IATF16949
|
Specialis Request
| Foramen caecum, digitus Aurum, BGA, Carbo atramentum, larva peculari, VIP processus, Edge plating, Dimidia foramina , etc
|
Materia Supplers
| Shengyi, ITEQ, Taiyo, etc.
|
Communis Package
| Vacuum+Carton
|
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