Fahaizana ankapobeny
- Single lafiny
- Indroa lafiny
- Multi Layer
- Nalevina Via
- Jamba Via
- Impedance voafehy
- Micro Via
- Laser Drilling
- Fanaraha-maso ny RoHS
- Epoxy feno vias
PCB henjana
zavatra
| Spec
|
sosona
| 1–20
|
Haben'ny birao
| 0.1mm-8.0mm
|
KEVITRA
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, sns
|
Max Panel Habe
| 600mm × 1200mm
|
Haben'ny lavaka min
| 0.1mm
|
Sakan'ny tsipika kely / habaka
| 3 mil (0,075 mm)
|
Fandeferana amin'ny drafitry ny birao
| 0.10mm
|
Hatevin'ny sosona insulation
| 0.075mm--5.00mm
|
Ny hatevin'ny varahina ivelany
| 18um--350um
|
Lavaka fandavahana (mekanika)
| 17um--175um
|
Lavaka vita (mekanika)
| 17um--175um
|
Fandeferana savaivony (Mekanika)
| 0,05 mm
|
Fisoratana anarana (Mekanika)
| 0,075 mm
|
Aspect ratio
| 16:01
|
Karazana saron-tava solder
| LPI
|
SMT Min.Solder Mask sakany
| 0,075 mm
|
Min.Solder Mask Clearance
| 0,05 mm
|
Plug Hole Diameter
| 0.25mm--0.60mm
|
Impedance Control Tolerance
| 士 10%
|
Famaranana ambonin'ny tany
| ENIG, OSP, HASL, Chem.Tin/Sn, Flash Volamena, sns
|
Soldermask
| Maitso / Mavo / Mainty / Fotsy / Mena / Manga
|
Silkscreen
| Mena / mavo / mainty / fotsy
|
Certificate
| UL, ISO 9001, ISO14001, IATF16949
|
Fangatahana manokana
| Lavaka jamba, rantsantanana volamena, BGA, ranomainty karbônina, saron-tava mitsikilo, dingana VIP, Fametahana sisiny, lavaka antsasaky , sns
|
Mpamatsy fitaovana
| Shengyi, ITEQ, Taiyo, sns.
|
Fonosana iombonana
| Vacuum+Carton
|
English mg 
