Pangkalahatang Kakayahan
- Single Sided
- Dalawang Panig
- Multi Layer
- Inilibing si Via
- Bulag Via
- Kinokontrol ang Impedance
- Micro Via
- Pagbabarena ng Laser
- Pagsunod sa RoHS
- Mga vias na puno ng epoxy
Matibay na PCB
item
| Spec
|
Mga layer
| 1~20
|
Kapal ng Lupon
| 0.1mm-8.0mm
|
materyal
| FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, atbp
|
Max na Laki ng Panel
| 600mm×1200mm
|
Min Laki ng Hole
| 0.1mm
|
Min Lapad/Espasyo ng Linya
| 3mil(0.075mm)
|
Board Outline Tolerance
| 士0.10mm
|
Kapal ng Layer ng Insulation
| 0.075mm--5.00mm
|
Out Layer Copper Kapal
| 18um--350um
|
Drilling Hole (Mekanikal)
| 17um--175um
|
Tapusin ang Hole (Mekanikal)
| 17um--175um
|
Diameter Tolerance (Mekanikal)
| 0.05mm
|
Pagpaparehistro (Mekanikal)
| 0.075mm
|
Aspect Ratio
| 16:01
|
Uri ng Solder Mask
| LPI
|
SMT Min.Lapad ng Solder Mask
| 0.075mm
|
Min.Panghinang Mask Clearance
| 0.05mm
|
Plug Hole Diameter
| 0.25mm--0.60mm
|
Impedance Control Tolerance
| 士10%
|
Pang-ibabaw na tapusin
| ENIG, OSP, HASL, Chem.Tin/Sn, Flash Gold, atbp
|
Soldermask
| Berde/Dilaw/Itim/Puti/Pula/Asul
|
Silkscreen
| Pula/Dilaw/Itim/Puti
|
Sertipiko
| UL, ISO 9001, ISO14001, IATF16949
|
Espesyal na Kahilingan
| Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half hole , atbp
|
Mga Tagatustos ng Materyal
| Shengyi, ITEQ, Taiyo, atbp.
|
Karaniwang Package
| Vacuum+Carton
|
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