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  • Manufacturing Process of Heavy Copper Multilayer Board
    • July 19. 2021
    Manufacturing Process of Heavy Copper Multilayer Board

    With the rapid development of automotive electronics and power communication modules, ultra-thick copper foil circuit boards of 12oz and above have gradually become a kind of special PCB boards with broad market prospects, which have attracted more and more manufacturers’ attention and attention; With the wide application of printed circuit boards in the electronic field, the functional requiremen...

  • PCB design technology
    • July 05. 2021

    The key to PCB EMC design is to minimize the reflow area and let the reflow path flow in the direction of the design. The most common return current problems come from cracks in the reference plane, changing the reference plane layer, and the signal flowing through the connector. Jumper capacitors or decoupling capacitors may solve some problems, but the overall impedance of capacitors, vias, pads...

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